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Packaged microelectronic components with terminals exposed through encapsulant
Grant 8,637,973 - Koon , et al. January 28, 2 | 2014-01-28 |
Apparatus and method for packaging circuits
Grant 8,138,617 - Poo , et al. March 20, 2 | 2012-03-20 |
Apparatus and method for packaging circuits
Grant 8,115,306 - Poo , et al. February 14, 2 | 2012-02-14 |
Apparatus And Method For Packaging Circuits
App 20100140794 - Poo; Chia Yong ; et al. | 2010-06-10 |
Apparatus and method for packaging circuits
Grant 7,675,169 - Poo , et al. March 9, 2 | 2010-03-09 |
Method for fabricating packaged die
Grant 7,358,154 - Poo , et al. April 15, 2 | 2008-04-15 |
Packaged Microelectronic Components
App 20080067642 - Koon; Eng Meow ; et al. | 2008-03-20 |
Apparatus And Method For Packaging Circuits
App 20080054423 - Poo; Chia Y. ; et al. | 2008-03-06 |
Support elements for semiconductor devices with peripherally located bond pads
Grant 7,285,850 - Poo , et al. October 23, 2 | 2007-10-23 |
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
Grant 7,226,809 - Poo , et al. June 5, 2 | 2007-06-05 |
Semiconductor packages having leadframe-based connection arrays
App 20070120247 - Yu; Chan Min ; et al. | 2007-05-31 |
Packaged microelectronic components
Grant 7,195,957 - Koon , et al. March 27, 2 | 2007-03-27 |
In-process semiconductor packages with leadframe grid arrays
Grant 7,170,161 - Yu , et al. January 30, 2 | 2007-01-30 |
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
Grant 7,115,984 - Poo , et al. October 3, 2 | 2006-10-03 |
Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices
App 20060208351 - Poo; Chia Yong ; et al. | 2006-09-21 |
Support elements for semiconductor devices with peripherally located bond pads
App 20060208350 - Poo; Chia Yong ; et al. | 2006-09-21 |
Apparatus and method for packaging circuits
App 20060084240 - Poo; Chia Yong ; et al. | 2006-04-20 |
Methods for making semiconductor packages with leadframe grid arrays
Grant 6,967,127 - Yu , et al. November 22, 2 | 2005-11-22 |
Methods for making semiconductor packages with leadframe grid arrays
App 20050230808 - Yu, Chan Min ; et al. | 2005-10-20 |
Apparatus and method for packaging circuits
Grant 6,894,386 - Poo , et al. May 17, 2 | 2005-05-17 |
Apparatus and method for packaging circuits
App 20050029668 - Poo, Chia Yong ; et al. | 2005-02-10 |
Packaged microelectronic components
App 20050026325 - Koon, Eng Meow ; et al. | 2005-02-03 |
Packaged microelectronic components
Grant 6,836,009 - Koon , et al. December 28, 2 | 2004-12-28 |
Semiconductor packages with leadframe grid arrays and components
Grant 6,836,008 - Yu , et al. December 28, 2 | 2004-12-28 |
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages
Grant 6,818,977 - Poo , et al. November 16, 2 | 2004-11-16 |
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
App 20040124523 - Poo, Chia Yong ; et al. | 2004-07-01 |
Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
Grant 6,727,116 - Poo , et al. April 27, 2 | 2004-04-27 |
Packaged microelectronic components
App 20040026773 - Koon, Eng Meow ; et al. | 2004-02-12 |
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
App 20030230802 - Poo, Chia Yong ; et al. | 2003-12-18 |
Semiconductor Devices Including Peripherally Located Bond Pads, Assemblies, Packages, And Methods
App 20030232460 - Poo, Chia Yong ; et al. | 2003-12-18 |
Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
App 20030232462 - Poo, Chia Yong ; et al. | 2003-12-18 |
Semiconductor packages with leadframe grid arrays and components and methods for making the same
App 20030193091 - Yu, Chan Min ; et al. | 2003-10-16 |
Methods for making semiconductor packages with leadframe grid arrays
App 20030194837 - Yu, Chan Min ; et al. | 2003-10-16 |
Wafer level stackable semiconductor package
Grant 6,611,052 - Poo , et al. August 26, 2 | 2003-08-26 |
Stackable semiconductor package and wafer level fabrication method
Grant 6,582,992 - Poo , et al. June 24, 2 | 2003-06-24 |
Stackable semiconductor package and wafer level fabrication method
App 20030094683 - Poo, Chia Yong ; et al. | 2003-05-22 |
Stackable Semiconductor Package And Wafer Level Fabrication Method
App 20030096454 - Poo, Chia Yong ; et al. | 2003-05-22 |
Apparatus and method for packaging circuits
App 20030067001 - Poo, Chin Yong ; et al. | 2003-04-10 |
Semiconductor device package side-by-side stacking and mounting system
Grant 5,663,105 - Sua , et al. September 2, 1 | 1997-09-02 |
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