Yu; Art

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yu; Art.The latest application filed is for "chemical mechanical polishing process for forming shallow trench isolation structure".

Company Profile

0.5.7

Yu; Art - Fongshan TW
Yu; Art - Fongshan City TW
Yu; Art - Kaohsiung TW
Yu; Art - Feng-Shan TW
Yu; Art - Kaoshiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical polishing process for forming shallow trench isolation structure Grant 7,544,305 - Hsu , et al. June 9, 2	2009-06-09
Chemical Mechanical Polishing Process For Forming Shallow Trench Isolation Structure App 20080029478 - Hsu; Chia-Jung ; et al.	2008-02-07
Chemical mechanical polishing process for forming shallow trench isolation structure Grant 7,294,575 - Hsu , et al. November 13, 2	2007-11-13
Polish method for semiconductor device planarization Grant 7,172,970 - Lin , et al. February 6, 2	2007-02-06
Polish method for semiconductor device planarization App 20060258158 - Lin; Zong Huei ; et al.	2006-11-16
Chemical mechanical polishing process for forming shallow trench isolation structure App 20050148184 - Hsu, Chia-Rung ; et al.	2005-07-07
Polishing element App 20050101233 - Tsai, Teng-Chun ; et al.	2005-05-12
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same Grant 6,797,190 - Hsu , et al. September 28, 2	2004-09-28
Polish method for semiconductor device planarization App 20040180546 - Lin, Zong Huei ; et al.	2004-09-16
Wafer Carrier Assembly For A Chemical Mechanical Polishing Apparatus And A Polishing Method Using The Same App 20030234078 - Hsu, Chia-Lin ; et al.	2003-12-25
Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same Grant 6,638,391 - Hsu , et al. October 28, 2	2003-10-28
Method for reducing dishing in copper chemical mechanical polishing process App 20020192941 - Hsu, Chia-Lin ; et al.	2002-12-19

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