You; Ji-Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for You; Ji-Yong.The latest application filed is for "substrate including alignment marks, methods of aligning wafers and fabricating semiconductors".

Company Profile

0.5.8

You; Ji-Yong - Suwon-si KR
You; Ji-Yong - Gyeonggi-do KR
You; Ji-Yong - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate including alignment marks, methods of aligning wafers and fabricating semiconductors Grant 8,339,604 - Jang , et al. December 25, 2	2012-12-25
Substrate including alignment marks, methods of aligning wafers and fabricating semiconductors App 20100245825 - Jang; Jun-Young ; et al.	2010-09-30
Overlay mark and method of forming the same Grant 7,736,844 - Kim , et al. June 15, 2	2010-06-15
Photomask with overlay mark and method of fabricating semiconductor device Grant 7,732,105 - Yoo , et al. June 8, 2	2010-06-08
Substrate having alignment marks and method of obtaining alignment information using the same Grant 7,602,072 - Kim , et al. October 13, 2	2009-10-13
Overlay mark and method of forming the same App 20080032208 - Kim; Dae-Joung ; et al.	2008-02-07
Photomask With Overlay Mark And Method Of Fabricating Semiconductor Device App 20080014511 - YOO; Do-Yul ; et al.	2008-01-17
Substrate having alignment marks and method of obtaining alignment information using the same App 20070296935 - Kim; Joon-Sung ; et al.	2007-12-27
Overlay key, method of forming the overlay key, semiconductor device including the overlay key and method of manufacturing the semiconductor device App 20070063317 - Kim; Dae-Joung ; et al.	2007-03-22
Mask structure, method of forming the mask structure, method of forming a pattern using the mask structure and method of forming contacts in a semiconductor device using the mask structure App 20070026685 - Bae; Yong-Kug ; et al.	2007-02-01
Method of manufacturing a pattern structure and method of forming a trench using the same App 20070009838 - You; Ji-Yong ; et al.	2007-01-11
Reinforced bond-pad substructure and method for fabricating the same Grant 6,717,272 - Lee , et al. April 6, 2	2004-04-06
Reinforced bond-pad substructure and method for fabricating the same App 20030178644 - Lee, Jin-Hyuk ; et al.	2003-09-25

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