Yoshizumi; Akira
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshizumi; Akira.The latest application filed is for "image monitoring system and camera".
- Yoshizumi; Akira - Kodaira JP
- Yoshizumi, Akira - Kanagawa JP
- Yoshizumi; Akira - Yokohama JP
| Patent | Date |
|---|---|
| Image Monitoring System And Camera App 20130230294 - Sassa; Atsushi ; et al. | 2013-09-05 |
| Concrete surfacing method App 20050239959 - Hisashi, Osamu ; et al. | 2005-10-27 |
| Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom Grant 6,645,643 - Zafarana , et al. November 11, 2 | 2003-11-11 |
| Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom App 20020022679 - Zafarana, Roberto ; et al. | 2002-02-21 |
| Transparent conductive substrate and display apparatus Grant 5,907,382 - Kajiura , et al. May 25, 1 | 1999-05-25 |
| Plastic-encapsulated semiconductor device Grant 5,641,997 - Ohta , et al. June 24, 1 | 1997-06-24 |
| Thermosetting resin composition Grant 5,438,113 - Shimozawa , et al. August 1, 1 | 1995-08-01 |
| Polysilane monomolecular film and polysilane built-up film Grant 5,362,559 - Hayase , et al. November 8, 1 | 1994-11-08 |
| Semiconductor device encapsulant Grant 5,258,426 - Uchida , et al. * November 2, 1 | 1993-11-02 |
| Rubber-modified phenolic resin composition and method of manufacturing the same Grant 5,216,077 - Yoshizumi , et al. June 1, 1 | 1993-06-01 |
| Shrinkage compensated mortar material Grant 4,921,537 - Horiguchi , et al. May 1, 1 | 1990-05-01 |
| Rubber-modified phenolic resin composition and method of manufacturing the same Grant 4,916,174 - Yoshizumi , et al. April 10, 1 | 1990-04-10 |
| Epoxy resin composition for encapsulation of semi-conductor device Grant 4,719,255 - Yoshizumi , et al. January 12, 1 | 1988-01-12 |
| Resin-sealed semiconductor device Grant 4,248,920 - Yoshizumi , et al. February 3, 1 | 1981-02-03 |
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