Yoshizawa; Keiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshizawa; Keiji.The latest application filed is for "wiring substrate and semiconductor device".

Company Profile

0.6.6

Yoshizawa; Keiji - Nagano JP
YOSHIZAWA; KEIJI - NAGANO-SHI JP
Yoshizawa; Keiji - Futtsu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring substrate and semiconductor device Grant 9,899,304 - Imafuji , et al. February 20, 2	2018-02-20
Wiring Substrate And Semiconductor Device App 20170186677 - IMAFUJI; KEI ; et al.	2017-06-29
Wiring Substrate And Semiconductor Device App 20140301058 - SUNOHARA; Satoshi ; et al.	2014-10-09
Patterning method and computer readable medium therefor Grant 7,495,745 - Yoshizawa , et al. February 24, 2	2009-02-24
Patterning method and computer readable medium therefor App 20080123070 - Yoshizawa; Keiji ; et al.	2008-05-29
Sizing processing system and computer program for the same Grant 7,099,806 - Yoshizawa August 29, 2	2006-08-29
Method of efficiently converting-to-array and compressing data in a process for converting mask patterns of a LSI Grant 7,085,417 - Yoshizawa August 1, 2	2006-08-01
Reduction processing method and computer readable storage medium having program stored thereon for causing computer to execute the method Grant 6,957,176 - Yoshizawa October 18, 2	2005-10-18
Sizing processing system and computer program for the same App 20020181796 - Yoshizawa, Keiji	2002-12-05
Method of efficiently converting-to-array and compressing data in a process for converting mask patterns of a LSI App 20020105524 - Yoshizawa, Keiji	2002-08-08
Reduction processing method and computer readable storage medium having program stored thereon for causing computer to execute the method App 20010055033 - Yoshizawa, Keiji	2001-12-27
Laminate for insulation protection of circuit boards Grant 5,601,905 - Watanabe , et al. February 11, 1	1997-02-11

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