Yoshino; Toyokazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshino; Toyokazu.The latest application filed is for "composite cable to be connected to flat panel-shaped electrical equipment".
- Yoshino; Toyokazu - Kanagawa JP
- Yoshino; Toyokazu - Fukuoka JP
- Yoshino; Toyokazu - Fukuoka-shi JP
| Patent | Date |
|---|---|
| Composite cable to be connected to flat panel-shaped electrical equipment Grant 10,111,332 - Sasaki , et al. October 23, 2 | 2018-10-23 |
| Composite Cable To Be Connected To Flat Panel-shaped Electrical Equipment App 20180288875 - SASAKI; Tadahito ; et al. | 2018-10-04 |
| Camera cover Grant 10,048,572 - Yasuda , et al. August 14, 2 | 2018-08-14 |
| Camera cover and camera Grant 9,712,729 - Yoshino , et al. July 18, 2 | 2017-07-18 |
| Electrical connector Grant D791,702 - Sasaki , et al. July 11, 2 | 2017-07-11 |
| Camera Cover App 20170139310 - YASUDA; Hideki ; et al. | 2017-05-18 |
| Electrical connector Grant D761,735 - Sasaki , et al. July 19, 2 | 2016-07-19 |
| Camera Cover And Camera App 20160088200 - YOSHINO; Toyokazu ; et al. | 2016-03-24 |
| Camera Cover And Camera App 20130136436 - YOSHINO; Toyokazu ; et al. | 2013-05-30 |
| Multilayer Wiring Board And Method For Producing The Same App 20090145651 - YOSHINO; Toyokazu ; et al. | 2009-06-11 |
| Manufacturing method of flexible printed wiring board Grant 7,543,376 - Yoshino , et al. June 9, 2 | 2009-06-09 |
| Flexible printed wiring board and manufacturing method thereof Grant 7,427,717 - Morimoto , et al. September 23, 2 | 2008-09-23 |
| Multi-layer printed circuit board, and method for fabricating the same Grant 7,367,116 - Yoshino , et al. May 6, 2 | 2008-05-06 |
| Multi-layered flexible print circuit board and manufacturing method thereof Grant 7,263,769 - Morimoto , et al. September 4, 2 | 2007-09-04 |
| Multi-layered Flexible Print Circuit Board And Manufacturing Method Thereof App 20070148829 - YOSHINO; Toyokazu ; et al. | 2007-06-28 |
| Interlayer Connection Conductor And Manufacturing Method Thereof App 20060272850 - MORIMOTO; Shinji ; et al. | 2006-12-07 |
| Multi-layered flexible print circuit board and manufacturing method thereof App 20060102386 - Morimoto; Shinji ; et al. | 2006-05-18 |
| Flexible printed wiring board and manufacturing method thereof App 20050257952 - Morimoto, Shinji ; et al. | 2005-11-24 |
| Multi-layer flexible printed circuit board, and method for fabricating it App 20050011677 - Yoshino, Toyokazu ; et al. | 2005-01-20 |
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