Yoshino; Toshizumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshino; Toshizumi.The latest application filed is for "photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board".

Company Profile

0.7.6

Yoshino; Toshizumi - Katori JP
YOSHINO; Toshizumi - Katori-shi Chiba
Yoshino; Toshizumi - Kamisu N/A JP
Yoshino; Toshizumi - Ibaraki JP
Yoshino; Toshizumi - Ibaraki-ken JP
YOSHINO, TOSHIZUMI - KASHIMA-GUN JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board Grant 10,111,328 - Komuro , et al. October 23, 2	2018-10-23
Photosensitive Resin Composition, Dry Film Using Same, Printed Wiring Board, And Method For Producing Printed Wiring Board App 20160007454 - KOMURO; Nobuhito ; et al.	2016-01-07
Photosensitive resin composition for protective film of printed wiring board for semiconductor package Grant 9,075,307 - Kurafuchi , et al. July 7, 2	2015-07-07
Photosensitive Resin Composition For Protective Film Of Printed Wiring Board For Semiconductor Package App 20110223539 - Kurafuchi; Kazuhiko ; et al.	2011-09-15
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 7,071,243 - Sato , et al. July 4, 2	2006-07-04
Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the composition App 20060141381 - Yoshino; Toshizumi ; et al.	2006-06-29
Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon Grant 7,049,036 - Satou , et al. May 23, 2	2006-05-23
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20040214924 - Sato, Kuniaki ; et al.	2004-10-28
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film Grant 6,692,793 - Sato , et al. February 17, 2	2004-02-17
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film App 20010053437 - Sato, Kuniaki ; et al.	2001-12-20
Photo Curable Resin Composition And Photosensitive Element App 20010003759 - SATO, KUNIAKI ; et al.	2001-06-14
Photosensitive resin composition Grant 6,238,840 - Hirayama , et al. May 29, 2	2001-05-29

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