YOSHINO; Makoto
Patent Applications and Registrations
Patent applications and USPTO patent grants for YOSHINO; Makoto.The latest application filed is for "multi-layer inductor".
Company Profile
19.43.64
- YOSHINO; Makoto - Tokyo JP
- Yoshino; Makoto - Beppu JP
- Yoshino; Makoto - Minato-ku JP
- Yoshino; Makoto - Beppu City JP
- Yoshino; Makoto - Beppu Oita-Ken JP
- YOSHINO; MAKOTO - Isehara JP
- Yoshino; Makoto - Okazaki JP
- Yoshino; Makoto - Osaka N/A JP
- Yoshino; Makoto - Okazaki-city JP
- YOSHINO; Makoto - Beppu-shi JP
- Yoshino; Makoto - Kawasaki JP
- Yoshino; Makoto - Aichi-ken JP
- Yoshino, Makoto - Kariya-city JP
- Yoshino, Makoto - Kariya-shi JP
- Yoshino, Makoto - Ohita JP
- Yoshino, Makoto - Okazaki-shi JP
- Yoshino; Makoto - Ebina JP
Patent Activity
| Patent | Date |
|---|---|
| Multi-layer Coil Component App 20220310316 - OSHIMA; Yuya ; et al. | 2022-09-29 |
| Multi-layer Inductor App 20220310299 - OIDE; Akihiko ; et al. | 2022-09-29 |
| Multi-layer Coil Component App 20220310312 - OIDE; Akihiko ; et al. | 2022-09-29 |
| Multi-layer Inductor App 20220310301 - OIDE; Akihiko ; et al. | 2022-09-29 |
| Multi-layer Inductor App 20220301761 - OIDE; Akihiko ; et al. | 2022-09-22 |
| Bump bond structure for enhanced electromigration performance Grant 11,450,638 - Mishra , et al. September 20, 2 | 2022-09-20 |
| Electronic Component App 20220068565 - TOZAWA; Yoji ; et al. | 2022-03-03 |
| Electronic component Grant 11,227,721 - Tozawa , et al. January 18, 2 | 2022-01-18 |
| Multilayer Inductor Component App 20210383960 - KATO; Daiki ; et al. | 2021-12-09 |
| Multilayer Inductor Component App 20210375527 - SHIMOYASU; Masashi ; et al. | 2021-12-02 |
| Multilayer coil component and method for producing the same Grant 11,189,413 - Oshima , et al. November 30, 2 | 2021-11-30 |
| Method of manufacturing laminated coil component Grant 11,127,529 - Oshima , et al. September 21, 2 | 2021-09-21 |
| Multilayer Coil Component App 20200402701 - SHIGA; Yuto ; et al. | 2020-12-24 |
| Bump Bond Structure For Enhanced Electromigration Performance App 20200402938 - Mishra; Dibyajat ; et al. | 2020-12-24 |
| Electronic component Grant 10,848,119 - Oide , et al. November 24, 2 | 2020-11-24 |
| Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20200354214 - Wachtler; Kurt Peter ; et al. | 2020-11-12 |
| Lamination type LC filter array Grant 10,784,834 - Oide , et al. Sept | 2020-09-22 |
| Bump bond structure for enhanced electromigration performance Grant 10,763,231 - Mishra , et al. Sep | 2020-09-01 |
| Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,723,616 - Wachtler , et al. | 2020-07-28 |
| Method Of Manufacturing Laminated Coil Component App 20200234877 - OSHIMA; Yuya ; et al. | 2020-07-23 |
| Multilayer Coil Component App 20200234873 - KATO; Hajime ; et al. | 2020-07-23 |
| Multilayer Coil Component App 20200234874 - KATO; Hajime ; et al. | 2020-07-23 |
| Method of manufacturing laminated coil component Grant 10,665,388 - Oshima , et al. | 2020-05-26 |
| Multilayer Coil Component App 20200098507 - SHIGA; Yuto ; et al. | 2020-03-26 |
| Electronic Component App 20200066431 - SHIGA; Yuto ; et al. | 2020-02-27 |
| Multilayer Coil Component App 20200066432 - ISHIKAWA; Yuma ; et al. | 2020-02-27 |
| Bump Bond Structure For Enhanced Electromigration Performance App 20200035633 - Mishra; Dibyajat ; et al. | 2020-01-30 |
| Multilayer Coil Component App 20190348214 - TOBITA; Kazuya ; et al. | 2019-11-14 |
| Multilayer Coil Component App 20190333686 - KAZUTA; Youichi ; et al. | 2019-10-31 |
| Lamination Type Lc Filter Array App 20190280667 - OIDE; Akihiko ; et al. | 2019-09-12 |
| Coil Component App 20190237239 - KATO; Hajime ; et al. | 2019-08-01 |
| Multilayer common mode filter Grant 10,340,070 - Abe , et al. | 2019-07-02 |
| Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20190169019 - Wachtler; Kurt Peter ; et al. | 2019-06-06 |
| Integrated clip and lead and method of making a circuit Grant 10,283,409 - Shibuya , et al. | 2019-05-07 |
| Electronic Component App 20190123705 - OIDE; Akihiko ; et al. | 2019-04-25 |
| Multilayer Coil Component And Method For Producing The Same App 20190122800 - OSHIMA; Yuya ; et al. | 2019-04-25 |
| Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 10,233,074 - Wachtler , et al. | 2019-03-19 |
| Electronic Component App 20180337001 - TOZAWA; Yoji ; et al. | 2018-11-22 |
| Multilayer common mode filter Grant 10,115,515 - Ishikawa , et al. October 30, 2 | 2018-10-30 |
| Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20180127266 - Wachtler; Kurt Peter ; et al. | 2018-05-10 |
| Multilayer Common Mode Filter App 20180114624 - ABE; Takuo ; et al. | 2018-04-26 |
| Method Of Manufacturing Laminated Coil Component App 20180096789 - OSHIMA; Yuya ; et al. | 2018-04-05 |
| Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Grant 9,896,330 - Wachtler , et al. February 20, 2 | 2018-02-20 |
| Joined Body And Manufacturing Method Thereof, And Cooling Device And Electronic Equipment Using Cooling Device App 20170243808 - YOSHINO; MAKOTO ; et al. | 2017-08-24 |
| Integrated Clip and Lead and Method of Making a Circuit App 20170236754 - Shibuya; Makoto ; et al. | 2017-08-17 |
| Structure And Method For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip App 20170197823 - Wachtler; Kurt Peter ; et al. | 2017-07-13 |
| Integrated clip and lead and method of making a circuit Grant 9,673,097 - Shibuya , et al. June 6, 2 | 2017-06-06 |
| ESD protection component Grant 9,667,036 - Ishikawa , et al. May 30, 2 | 2017-05-30 |
| Multilayer Common Mode Filter App 20170092414 - ISHIKAWA; Yuma ; et al. | 2017-03-30 |
| Integrated Clip And Lead And Method Of Making A Circuit App 20160336256 - Shibuya; Makoto ; et al. | 2016-11-17 |
| ESD protection component and method for manufacturing ESD protection component Grant 9,293,913 - Umeda , et al. March 22, 2 | 2016-03-22 |
| Pipe joint Grant 9,255,657 - Yoshino , et al. February 9, 2 | 2016-02-09 |
| Method for establishing connection between communication apparatuses, communication apparatus, and server apparatus Grant 9,231,907 - Yoshino , et al. January 5, 2 | 2016-01-05 |
| Electrostatic protection component Grant 9,185,785 - Umeda , et al. November 10, 2 | 2015-11-10 |
| Esd Protection Component App 20150189798 - ISHIKAWA; Yuma ; et al. | 2015-07-02 |
| Multilayer common mode filter Grant 8,957,744 - Yoshino , et al. February 17, 2 | 2015-02-17 |
| Esd Protection Component And Method For Manufacturing Esd Protection Component App 20150036248 - UMEDA; Hidenobu ; et al. | 2015-02-05 |
| Electrostatic Protection Component App 20140204499 - UMEDA; Hidenobu ; et al. | 2014-07-24 |
| Multilayer Common Mode Filter App 20140191824 - YOSHINO; Makoto ; et al. | 2014-07-10 |
| Electrostatic protection component Grant 8,724,284 - Umeda , et al. May 13, 2 | 2014-05-13 |
| Multilayer common mode filter Grant 8,466,757 - Yoshino , et al. June 18, 2 | 2013-06-18 |
| Method For Establishing Connection Between Communication Apparatuses, Communication Apparatus, And Server Apparatus App 20130138824 - YOSHINO; Makoto ; et al. | 2013-05-30 |
| Electrostatic Protection Component App 20120300355 - Umeda; Hidenobu ; et al. | 2012-11-29 |
| Refrigerant piping unit and method of manufacturing pipe for the same Grant 8,251,101 - Yoshino , et al. August 28, 2 | 2012-08-28 |
| Heat exchanger with connector Grant 8,205,667 - Yoshino June 26, 2 | 2012-06-26 |
| Pipe joint App 20120133125 - Yoshino; Makoto ; et al. | 2012-05-31 |
| Pop semiconductor device manufacturing method Grant 8,048,358 - Takano , et al. November 1, 2 | 2011-11-01 |
| Multilayer Common Mode Filter App 20100301966 - YOSHINO; Makoto ; et al. | 2010-12-02 |
| Pipe joint unit and method of manufacturing the same Grant 7,837,234 - Yoshino , et al. November 23, 2 | 2010-11-23 |
| Pipe joint and pipe joint structure having the same and method of using the same Grant 7,810,848 - Yoshino October 12, 2 | 2010-10-12 |
| Vapour-compression type refrigerating machine and double pipe structure and double pipe joint structure preferably used therefor Grant 7,753,413 - Yoshino , et al. July 13, 2 | 2010-07-13 |
| POP Semiconductor Device Manufacturing Method App 20100015759 - TAKANO; Kiyoharu ; et al. | 2010-01-21 |
| Piping joint device Grant 7,611,171 - Yoshino November 3, 2 | 2009-11-03 |
| Refrigerant piping unit and method of manufacturing pipe for the same App 20090145152 - Yoshino; Makoto ; et al. | 2009-06-11 |
| Fuel cell Grant 7,544,436 - Yoshino , et al. June 9, 2 | 2009-06-09 |
| Heat exchanger with connector and method of manufacturing the connector App 20080264621 - Yoshino; Makoto | 2008-10-30 |
| Pipe joint unit and method of manufacturing the same App 20080157525 - Yoshino; Makoto ; et al. | 2008-07-03 |
| Pipe joint device Grant 7,354,078 - Yoshino April 8, 2 | 2008-04-08 |
| Pipe joint and pipe joint structure having the same and method of using the same App 20080048447 - Yoshino; Makoto | 2008-02-28 |
| Fuel Cell App 20080003475 - YOSHINO; Makoto ; et al. | 2008-01-03 |
| POP Semiconductor Device Manufacturing Method App 20070243667 - Takano; Kiyoharu ; et al. | 2007-10-18 |
| Fuel cell App 20070099048 - Takasu; Yoichi ; et al. | 2007-05-03 |
| Piping joint structure Grant 7,178,837 - Yoshino February 20, 2 | 2007-02-20 |
| Piping joint device and manufacturing method thereof App 20060220380 - Yoshino; Makoto | 2006-10-05 |
| Industrial equipment and system Grant 7,036,084 - Miwa , et al. April 25, 2 | 2006-04-25 |
| Electrolyte composition, solid electrolyte membrane and solid polymer fuel cell App 20060068254 - Yoshino; Makoto ; et al. | 2006-03-30 |
| Connecting structure of pipe and pipe joint and method of connecting the pipe to the pipe joint Grant 7,007,981 - Yoshino March 7, 2 | 2006-03-07 |
| Piping joint structure App 20050258644 - Yoshino, Makoto | 2005-11-24 |
| Semiconductor chip mounting substrate and semiconductor device using it Grant 6,965,162 - Yoshino , et al. November 15, 2 | 2005-11-15 |
| Pipe joint device App 20050110274 - Yoshino, Makoto | 2005-05-26 |
| Semiconductor package insulation film and manufacturing method thereof Grant 6,894,374 - Yoshino , et al. May 17, 2 | 2005-05-17 |
| Semiconductor package insulation film and manufacturing method thereof Grant 6,875,637 - Yoshino , et al. April 5, 2 | 2005-04-05 |
| Vapour-compression type refrigerating machine and double pipe structure and double pipe joint structure preferably used therefor App 20040261450 - Yoshino, Makoto ; et al. | 2004-12-30 |
| Semiconductor package insulation film and manufacturing method thereof App 20040070068 - Yoshino, Makoto ; et al. | 2004-04-15 |
| Connecting structure of pipe and pipe joint and method of connecting the pipe to the pipe joint App 20040041396 - Yoshino, Makoto | 2004-03-04 |
| Semiconductor chip mounting substrate and semiconductor device using it App 20030039102 - Yoshino, Makoto ; et al. | 2003-02-27 |
| Industrial equipment and system App 20030018654 - Miwa, Toshiharu ; et al. | 2003-01-23 |
| Semiconductor package insulation film and manufacturing method thereof App 20030017653 - Yoshino, Makoto ; et al. | 2003-01-23 |
| Refrigerant transporting hose App 20020157722 - Arima, Tetsuya ; et al. | 2002-10-31 |
| Fluid-impermeable composite hose App 20010023713 - Niki, Nobuaki ; et al. | 2001-09-27 |
| Fluid-impermeable composite hose App 20010023714 - Niki, Nobuaki ; et al. | 2001-09-27 |
| Micro-dot ink jet recorder Grant 4,746,928 - Yamada , et al. May 24, 1 | 1988-05-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 