Yoshinaga; Seiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshinaga; Seiichi.The latest application filed is for "electronic element unit and reinforcing adhesive agent".
- Yoshinaga; Seiichi - Saga N/A JP
- Yoshinaga; Seiichi - Yamanashi N/A JP
- Yoshinaga; Seiichi - Fukuoka-ken JP
- Yoshinaga; Seiichi - Kasuga JP
| Patent | Date |
|---|---|
| Electronic component mounting structure Grant 8,759,688 - Yoshinaga , et al. June 24, 2 | 2014-06-24 |
| Electronic element unit and reinforcing adhesive agent Grant 8,686,299 - Motomura , et al. April 1, 2 | 2014-04-01 |
| Electronic Element Unit And Reinforcing Adhesive Agent App 20120111617 - Motomura; Koji ; et al. | 2012-05-10 |
| Resin Application Apparatus And Data Creation Apparatus For Resin Application App 20110315321 - Yoshinaga; Seiichi ; et al. | 2011-12-29 |
| Electronic Component Mounting Structure App 20100000773 - Yoshinaga; Seiichi ; et al. | 2010-01-07 |
| Solder composition, connecting process with soldering, and connection structure with soldering App 20060043597 - Wada; Yoshiyuki ; et al. | 2006-03-02 |
| Solder composition, connecting process with soldering, and connection structure with soldering App 20060043543 - Wada; Yoshiyuki ; et al. | 2006-03-02 |
| Method for mounting electronic devices Grant 5,505,366 - Nishi , et al. April 9, 1 | 1996-04-09 |
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