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name:-0.02137303352356
name:-0.005836009979248
YOSHIMURA; Kei Patent Filings

YOSHIMURA; Kei

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOSHIMURA; Kei.The latest application filed is for "encapsulating material and multilayered glass panel using same".

Company Profile
5.25.22
  • YOSHIMURA; Kei - Tokyo JP
  • Yoshimura; Kei - Inzai JP
  • Yoshimura; Kei - Inba JP
  • Yoshimura; Kei - Chiba JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Encapsulating Material and Multilayered Glass Panel Using Same
App 20200392036 - NAITO; Takashi ;   et al.
2020-12-17
Conductive joint article and method for manufacturing same
Grant 10,449,622 - Naito , et al. Oc
2019-10-22
Heat-insulating member, low-melting glass composition, and sealing material paste
Grant 10,358,379 - Naito , et al. July 23, 2
2019-07-23
Bonding Article
App 20190217574 - NAITO; Takashi ;   et al.
2019-07-18
Multi-layer glass and method for producing the same
Grant 10,259,740 - Miyake , et al.
2019-04-16
Electronic component, method for producing same, and sealing material paste used in same
Grant 10,026,923 - Naito , et al. July 17, 2
2018-07-17
Conductive Joint Article And Method For Manufacturing Same
App 20180111218 - NAITO; Takashi ;   et al.
2018-04-26
Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same
Grant 9,950,948 - Naito , et al. April 24, 2
2018-04-24
Vacuum Heat Insulating Member, Sealing Material Used Therefor, And A Production Method Of The Vacuum Heat Insulating Member
App 20180094475 - NAITO; Takashi ;   et al.
2018-04-05
Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same
App 20170301883 - NAITO; Takashi ;   et al.
2017-10-19
Electronic component, conductive paste, and method for manufacturing an electronic component
Grant 9,786,463 - Aoyagi , et al. October 10, 2
2017-10-10
Lead-free Low-melting Glass Composition, Low-temperature Sealing Glass Frit, Low-temperature Sealing Glass Paste, Conductive Material, And Conductive Glass Paste Containing Glass Composition, And Glass-sealed Component And Electric/electronic Component Prepared Using The Same
App 20170253522 - NAITO; Takashi ;   et al.
2017-09-07
Electronic component, method for producing same, and sealing material paste used in same
Grant 9,728,341 - Naito , et al. August 8, 2
2017-08-08
Multi-layer Glass And Method For Producing The Same
App 20170203997 - MIYAKE; Tatsuya ;   et al.
2017-07-20
Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same
Grant 9,670,090 - Naito , et al. June 6, 2
2017-06-06
Electronic component, process for producing same, sealing material paste, and filler particles
Grant 9,614,178 - Naito , et al. April 4, 2
2017-04-04
Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same
Grant 9,556,061 - Naito , et al. January 31, 2
2017-01-31
Heat-insulating Member, Low-melting Glass Composition, And Sealing Material Paste
App 20160297706 - NAITO; Takashi ;   et al.
2016-10-13
Lead-free Low-melting Glass Composition, Low-temperature Sealing Glass Frit, Low-temperature Sealing Glass Paste, Conductive Material, And Conductive Glass Paste Containing Glass Composition, And Glass-sealed Component And Electric/electronic Component Prepared Using The Same
App 20160229737 - NAITO; Takashi ;   et al.
2016-08-11
Lead-free Low-melting Glass Composition, Low-temperature Sealing Glass Frit, Low-temperature Sealing Glass Paste, Conductive Material, And Conductive Glass Paste Containing Glass Composition, And Glass-sealed Component And Electric/electronic Component Prepared Using The Same
App 20160060158 - NAITO; Takashi ;   et al.
2016-03-03
Electronic Component, Process For Producing Same, Sealing Material Paste, And Filler Particles
App 20150270508 - Naito; Takashi ;   et al.
2015-09-24
Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component
Grant 9,142,708 - Naito , et al. September 22, 2
2015-09-22
Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same
App 20150187510 - Naito; Takashi ;   et al.
2015-07-02
Glass composition and covering and sealing members using same
Grant 9,048,056 - Yoshimura , et al. June 2, 2
2015-06-02
Positive electrode active material
Grant 8,951,436 - Hashiba , et al. February 10, 2
2015-02-10
Glass composition, electrically conductive paste composition comprising same, electrode wiring member, and electronic component
Grant 8,895,460 - Tachizono , et al. November 25, 2
2014-11-25
Low softening point glass composition, bonding material using same and electronic parts
Grant 8,685,872 - Naito , et al. April 1, 2
2014-04-01
Low Softening Point Glass Composition, Bonding Material Using Same Adn Electronic Parts
App 20130333748 - NAITO; Takashi ;   et al.
2013-12-19
Low softening point glass composition, bonding material using same and electronic parts
Grant 8,470,723 - Naito , et al. June 25, 2
2013-06-25
Glass composition and its applications
Grant 8,367,573 - Naito , et al. February 5, 2
2013-02-05
Positive Electrode Active Material
App 20130015410 - Hashiba; Yuji ;   et al.
2013-01-17
Glass Composition And Conductive Paste For Aluminum Electrode Wiring, Electronic Component Provided With That Aluminum Electrode Wiring And Method For Producing This Electronic Component
App 20120325297 - Naito; Takashi ;   et al.
2012-12-27
Electroconductive material and positive electrode material for lithium ion secondary battery using the same
Grant 8,337,723 - Hashiba , et al. December 25, 2
2012-12-25
Electronic Component, Conductive Paste, And Method For Manufacturing An Electronic Component
App 20120318559 - Aoyagi; Takuya ;   et al.
2012-12-20
Glass Composition, Electrically Conductive Paste Composition Comprising Same, Electrode Wiring Member, And Elctronic Component
App 20120067415 - Tachizono; Shinichi ;   et al.
2012-03-22
Glass Composition And Covering And Sealing Members Using Same
App 20120063076 - Yoshimura; Kei ;   et al.
2012-03-15
Electroconductive Material And Positive Electrode Material For Lithium Ion Secondary Battery Using The Same
App 20110001094 - Hashiba; Yuji ;   et al.
2011-01-06
Low Softening Point Glass Composition, Bonding Material Using Same And Electronic Parts
App 20100180934 - Naito; Takashi ;   et al.
2010-07-22
Glass Composition And Its Applications
App 20090199897 - Naito; Takashi ;   et al.
2009-08-13

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