Yoshimura; Ichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshimura; Ichiro.The latest application filed is for "methods for polishing semiconductor substrates that adjust for pad-to-pad variance".

Company Profile

1.12.7

Yoshimura; Ichiro - Shimotsuke JP
Yoshimura; Ichiro - Shimotsuke City JP
Yoshimura; Ichiro - Osaka N/A JP
Yoshimura; Ichiro - Utsunomiya N/A JP
Yoshimura; Ichiro - Utsunomiya City JP
Yoshimura; Ichiro - Tokyo JP
Yoshimura; Ichiro - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for polishing semiconductor substrates that adjust for pad-to-pad variance Grant 11,081,359 - Yoshimura , et al. August 3, 2	2021-08-03
Methods For Polishing Semiconductor Substrates That Adjust For Pad-to-pad Variance App 20200083057 - Yoshimura; Ichiro ; et al.	2020-03-12
Center flex single side polishing head having recess and cap Grant 9,566,687 - Albrecht , et al. February 14, 2	2017-02-14
Center Flex Single Side Polishing Head Having Recess And Cap App 20160101502 - Albrecht; Peter ; et al.	2016-04-14
Ion generating apparatus and air purifying apparatus Grant 9,005,529 - Tsuda , et al. April 14, 2	2015-04-14
Center Flex Single Side Polishing Head App 20140357161 - Bhagavat; Sumeet ; et al.	2014-12-04
Methods for reducing the width of the unbonded region in SOI structures Grant 8,440,541 - Pitney , et al. May 14, 2	2013-05-14
Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same Grant 8,330,245 - Pitney , et al. December 11, 2	2012-12-11
Methods For Reducing The Width Of The Unbonded Region In Soi Structures App 20110207246 - Pitney; John A. ; et al.	2011-08-25
Semiconductor Wafers With Reduced Roll-off And Bonded And Unbonded Soi Structures Produced From Same App 20110204471 - Pitney; John A. ; et al.	2011-08-25
Ion Generating Apparatus And Air Purifying Apparatus App 20110150710 - Tsuda; Tsutomu ; et al.	2011-06-23
Production method of thin plate and thin plate support for chucking employed in the method Grant 6,637,301 - Yoshimura October 28, 2	2003-10-28
Production method of thin plate and thin plate support for chucking employed in the method App 20020025447 - Yoshimura, Ichiro	2002-02-28
Method for screening optical fiber and apparatus for carrying out method Grant 5,322,228 - Nagayama , et al. June 21, 1	1994-06-21
Process of drawing optical fiber Grant 5,320,658 - Ohga , et al. June 14, 1	1994-06-14
Method for controlling fiber diameter during optical fiber drawing process Grant 5,073,179 - Yoshimura , et al. December 17, 1	1991-12-17
High temperature furnace with thermal insulation Grant 5,017,209 - Yoshimura May 21, 1	1991-05-21

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