loadpatents
Patent applications and USPTO patent grants for YOSHIMI; Hideaki.The latest application filed is for "isolation in a semiconductor device".
Patent | Date |
---|---|
Isolation In A Semiconductor Device App 20220131002 - NOMA; Takashi ;   et al. | 2022-04-28 |
Semiconductor device with backmetal and related methods Grant 11,114,402 - Seddon , et al. September 7, 2 | 2021-09-07 |
Semiconductor Device With Backmetal And Related Methods App 20210272920 - SEDDON; Michael J. ;   et al. | 2021-09-02 |
Semiconductor Device With Backmetal And Related Methods App 20190267344 - SEDDON; Michael J. ;   et al. | 2019-08-29 |
Semiconductor device manufacturing method Grant 9,917,010 - Yoshimi , et al. March 13, 2 | 2018-03-13 |
Semiconductor device and method of automatically inspecting an appearance of the same Grant 8,809,076 - Yoshimi , et al. August 19, 2 | 2014-08-19 |
Semiconductor Device Manufacturing Method App 20140220739 - Yoshimi; Hideaki ;   et al. | 2014-08-07 |
Semiconductor device and manufacturing method thereof Grant 8,736,047 - Yoshimi , et al. May 27, 2 | 2014-05-27 |
Resin molded semiconductor device and manufacturing method thereof Grant 8,648,452 - Saito , et al. February 11, 2 | 2014-02-11 |
Resin Molded Semiconductor Device And Manufacturing Method Thereof App 20140027894 - SAITO; Kiyoshi ;   et al. | 2014-01-30 |
Semiconductor Device And Method Of Automatically Inspecting An Appearance Of The Same App 20130192078 - YOSHIMI; Hideaki ;   et al. | 2013-08-01 |
Resin Molded Semiconductor Device And Manufacturing Method Thereof App 20110260311 - SAITO; Kiyoshi ;   et al. | 2011-10-27 |
Resin molded semiconductor device and manufacturing method thereof Grant 7,998,794 - Saito , et al. August 16, 2 | 2011-08-16 |
Resin Molded Semiconductor Device And Manufacturing Method Thereof App 20100052138 - Saito; Kiyoshi ;   et al. | 2010-03-04 |
Semiconductor Device And Manufacturing Method Thereof App 20070228554 - Yoshimi; Hideaki ;   et al. | 2007-10-04 |
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