YOSHIKAWA; Tetsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for YOSHIKAWA; Tetsuya.The latest application filed is for "anomaly determination apparatus".
- YOSHIKAWA; Tetsuya - Toyota-shi JP
- Yoshikawa; Tetsuya - Takasago JP
- Yoshikawa; Tetsuya - Takasago-shi JP
- Yoshikawa; Tetsuya - Hyogo JP
- Yoshikawa; Tetsuya - Kobe JP
| Patent | Date |
|---|---|
| Anomaly Determination Device For Power Transmission Device App 20220042596 - BUNAZAWA; Hideaki ; et al. | 2022-02-10 |
| Abnormality Determination Device App 20220041174 - BUNAZAWA; Hideaki ; et al. | 2022-02-10 |
| Anomaly Determination Apparatus App 20220044502 - BUNAZAWA; Hideaki ; et al. | 2022-02-10 |
| Device For Vehicle Including Power Transfer Device App 20220042842 - BUNAZAWA; Hideaki ; et al. | 2022-02-10 |
| Tire testing device Grant 9,046,444 - Wakazono , et al. June 2, 2 | 2015-06-02 |
| Tire Testing Device App 20130233066 - Wakazono; Takehiko ; et al. | 2013-09-12 |
| Tire testing machine and tire testing method Grant 8,342,020 - Sumimoto , et al. January 1, 2 | 2013-01-01 |
| Tire testing machine and method for testing tire Grant 8,136,393 - Yoshikawa , et al. March 20, 2 | 2012-03-20 |
| Tire Testing Machine And Method For Testing Tire App 20110000292 - Yoshikawa; Tetsuya ; et al. | 2011-01-06 |
| Tire Testing Machine And Tire Testing Method App 20090308156 - Sumimoto; Yu ; et al. | 2009-12-17 |
| Method for high-pressure processing Grant 7,520,938 - Sakashita , et al. April 21, 2 | 2009-04-21 |
| High pressure processing method and apparatus Grant 7,513,265 - Yoshikawa , et al. April 7, 2 | 2009-04-07 |
| Method for fabricating copper-based interconnections for semiconductor device Grant 7,335,596 - Onishi , et al. February 26, 2 | 2008-02-26 |
| Process and composition for removing residues from the microstructure of an object Grant 7,220,714 - Masuda , et al. May 22, 2 | 2007-05-22 |
| Method for fabricating copper-based interconnections for semiconductor device App 20060019496 - Onishi; Takashi ; et al. | 2006-01-26 |
| Method for forming aerial metallic wiring on semiconductor substrate Grant 6,916,735 - Fujikawa , et al. July 12, 2 | 2005-07-12 |
| Method for high-pressure processing App 20050051194 - Sakashita, Yoshihiko ; et al. | 2005-03-10 |
| Cleaning apparatus App 20040226588 - Onishi, Takashi ; et al. | 2004-11-18 |
| High pressure processing method and apparatus App 20040123484 - Yoshikawa, Tetsuya ; et al. | 2004-07-01 |
| Process and composition for removing residues from the microstructure of an object App 20030217764 - Masuda, Kaoru ; et al. | 2003-11-27 |
| Method for forming aerial metallic wiring on semiconductor substrate App 20030077892 - Fujikawa, Takao ; et al. | 2003-04-24 |
| Vacuum arc vapor deposition device having electrode switching means Grant 5,103,766 - Yoshikawa , et al. April 14, 1 | 1992-04-14 |
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