YOSHIKAWA; Shunsaku
Patent Applications and Registrations
Patent applications and USPTO patent grants for YOSHIKAWA; Shunsaku.The latest application filed is for "solder alloy, cast article, formed article, and solder joint".
Company Profile
13.26.38
- YOSHIKAWA; Shunsaku - Tokyo JP
- Yoshikawa; Shunsaku - Soka N/A JP
- Yoshikawa; Shunsaku - Adachi-ku JP
- Yoshikawa; Shunsaku - Saitama JP
Patent Activity
| Patent | Date |
|---|---|
| Solder Alloy, Cast Article, Formed Article, And Solder Joint App 20220143761 - YOSHIKAWA; Shunsaku ; et al. | 2022-05-12 |
| Soldering Alloy, Soldering Paste, Preform Solder, Soldering Ball, Wire Solder, Resin Flux Cored Solder, Solder Joint, Electronic Circuit Board, And Multi-layer Electronic Circuit Board App 20220040802 - SAITO; Takashi ; et al. | 2022-02-10 |
| Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint Grant 11,241,760 - Yokoyama , et al. February 8, 2 | 2022-02-08 |
| Solder Alloy App 20220032406 - IIJIMA; Yuuki ; et al. | 2022-02-03 |
| Solder alloy, solder ball, solder preform, solder paste and solder joint Grant 11,167,379 - Iijima , et al. November 9, 2 | 2021-11-09 |
| Solder alloy Grant 11,123,824 - Yokoyama , et al. September 21, 2 | 2021-09-21 |
| Solder Paste App 20210114143 - HAYASHIDA; Toru ; et al. | 2021-04-22 |
| Solder alloy, solder paste, and solder joint Grant 10,967,464 - Izumita , et al. April 6, 2 | 2021-04-06 |
| Solder Alloy, Solder Paste, Solder Ball, Resin Flux-cored Solder And Solder Joint App 20210001431 - YOKOYAMA; Takahiro ; et al. | 2021-01-07 |
| Solder Alloy, Solder Paste, Solder Ball, Resin Flux-cored Solder And Solder Joint App 20200376608 - YOKOYAMA; Takahiro ; et al. | 2020-12-03 |
| Solder Alloy App 20200376606 - YOKOYAMA; Takahiro ; et al. | 2020-12-03 |
| Solder Alloy, Solder Ball, Solder Preform, Solder Paste And Solder Joint App 20200306895 - IIJIMA; Yuki ; et al. | 2020-10-01 |
| Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method Grant 10,717,158 - Saito , et al. | 2020-07-21 |
| Solder Alloy, Solder Paste, And Solder Joint App 20200114475 - IZUMITA; Naoko ; et al. | 2020-04-16 |
| Solder alloy, solder ball, and solder joint Grant 10,500,680 - Tachibana , et al. Dec | 2019-12-10 |
| Solder paste Grant 10,350,712 - Koroki , et al. July 16, 2 | 2019-07-16 |
| Lead-free solder alloy Grant 10,343,238 - Suzuki , et al. July 9, 2 | 2019-07-09 |
| Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component App 20190118310 - Yoshikawa; Shunsaku | 2019-04-25 |
| "Lead-Free Solder Ball" App 20190088611 - Yamanaka; Yoshie ; et al. | 2019-03-21 |
| Lead-Free Solder Alloy App 20190076966 - Ohnishi; Tsukasa ; et al. | 2019-03-14 |
| Solder alloy Grant 10,213,879 - Yoshikawa , et al. Feb | 2019-02-26 |
| Solder Alloy For Preventing Fe Erosion, Resin Flux Cored Solder, Wire Solder, Resin Flux Cored Wire Solder, Flux Coated Solder, Solder Joint And Soldering Method App 20190001443 - SAITO; Takashi ; et al. | 2019-01-03 |
| Solder Alloy, Solder Ball, And Solder Joint App 20180361519 - TACHIBANA; Ken ; et al. | 2018-12-20 |
| Sn-Cu-based lead-free solder alloy Grant 10,137,536 - Ohnishi , et al. November 27, 2 | 2018-11-27 |
| Lead-free solder alloy Grant 10,076,808 - Ohnishi , et al. September 18, 2 | 2018-09-18 |
| Solder paste Grant 9,987,710 - Koroki , et al. June 5, 2 | 2018-06-05 |
| Lead-free Solder Alloy App 20180001426 - SUZUKI; Masayuki ; et al. | 2018-01-04 |
| Lead-Free Solder Ball App 20180005970 - Yamanaka; Yoshie ; et al. | 2018-01-04 |
| Lead-free solder alloy Grant 9,844,837 - Shimamura , et al. December 19, 2 | 2017-12-19 |
| Lead-free solder alloy and in-vehicle electronic circuit Grant 9,837,757 - Yoshikawa , et al. December 5, 2 | 2017-12-05 |
| Solder alloy Grant 9,808,890 - Nomura , et al. November 7, 2 | 2017-11-07 |
| Lead-free solder ball Grant 9,780,055 - Yamanaka , et al. October 3, 2 | 2017-10-03 |
| Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component App 20170274481 - Yoshikawa; Shunsaku | 2017-09-28 |
| Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part Grant 9,773,721 - Yoshikawa , et al. September 26, 2 | 2017-09-26 |
| Solder Alloy App 20170151636 - YOSHIKAWA; Shunsaku ; et al. | 2017-06-01 |
| Solder Paste App 20160158897 - Koroki; Motoki ; et al. | 2016-06-09 |
| Solder Paste App 20160158896 - Koroki; Motoki ; et al. | 2016-06-09 |
| Lead-free Solder Alloy And In-vehicle Electronic Circuit App 20160056570 - YOSHIKAWA; Shunsaku ; et al. | 2016-02-25 |
| Lead-free Solder Alloy App 20150328722 - SUZUKI; Masayuki ; et al. | 2015-11-19 |
| Lead-Free Solder Ball App 20150221606 - Yamanaka; Yoshie ; et al. | 2015-08-06 |
| Solder Alloy App 20150086263 - Nomura; Hikaru ; et al. | 2015-03-26 |
| Lead-free solder connection structure and solder ball Grant 8,975,757 - Ueshima , et al. March 10, 2 | 2015-03-10 |
| Lead-Free Solder Alloy App 20150037088 - Ohnishi; Tsukasa ; et al. | 2015-02-05 |
| Sn-cu-based Lead-free Solder Alloy App 20150029670 - Ohnishi; Tsukasa ; et al. | 2015-01-29 |
| Solder alloy Grant 8,932,519 - Ishibashi , et al. January 13, 2 | 2015-01-13 |
| Bonding material for semiconductor devices Grant 8,896,119 - Sakamoto , et al. November 25, 2 | 2014-11-25 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20140326490 - Yoshikawa; Shunsaku ; et al. | 2014-11-06 |
| Lead-Free Solder Alloy App 20140141273 - Shimamura; Masato ; et al. | 2014-05-22 |
| Solder Alloy App 20130343809 - Ishibashi; Seiko ; et al. | 2013-12-26 |
| Bonding Material for Semiconductor Devices App 20130134591 - Sakamoto; Yoshitsugu ; et al. | 2013-05-30 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20120199393 - Yoshikawa; Shunsaku ; et al. | 2012-08-09 |
| Lead-free Solder Connection Structure And Solder Ball App 20110115084 - Ueshima; Minoru ; et al. | 2011-05-19 |
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