Yoshiike; Masashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshiike; Masashi.The latest application filed is for "mems device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing mems device".

Company Profile

0.10.10

Yoshiike; Masashi - Nagano JP
Yoshiike; Masashi - Chino JP
YOSHIIKE; Masashi - Chino-shi JP
Yoshiike; Masashi - Fujimi-machi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Piezoelectric device, liquid ejecting head, manufacturing method of piezoelectric device, and manufacturing method of liquid ejecting device Grant 10,272,682 - Yoshiike	2019-04-30
MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device Grant 10,246,321 - Yoshiike	2019-04-02
MEMS device, liquid ejecting head, and liquid ejecting apparatus Grant 10,173,891 - Yoshiike J	2019-01-08
Electronic device and manufacturing method of electronic device Grant 10,081,161 - Yoshiike , et al. September 25, 2	2018-09-25
Mems Device, Liquid Ejecting Head, Liquid Ejecting Apparatus, Method For Manufacturing Mems Device App 20180093882 - YOSHIIKE; Masashi	2018-04-05
Mems Device, Liquid Ejecting Head, And Liquid Ejecting Apparatus App 20180079641 - YOSHIIKE; Masashi	2018-03-22
Electronic device manufacturing method and electronic device Grant 9,889,629 - Sato , et al. February 13, 2	2018-02-13
Piezoelectric device, liquid ejecting head, manufacturing method of piezoelectric device, and manufacturing method of liquid ejecting device App 20170341394 - Yoshiike; Masashi	2017-11-30
Piezoelectric device, liquid ejecting head and method for manufacturing piezoelectric device Grant 9,751,306 - Sato , et al. September 5, 2	2017-09-05
Electronic device, liquid ejecting head, and method of manufacturing electronic device Grant 9,682,549 - Yamaguchi , et al. June 20, 2	2017-06-20
Bonded structure, piezoelectric device, liquid ejecting head, and method of manufacturing bonded structure Grant 9,682,554 - Yoshiike June 20, 2	2017-06-20
Bonded Structure, Piezoelectric Device, Liquid Ejecting Head, And Method Of Manufacturing Bonded Structure App 20170050437 - YOSHIIKE; Masashi	2017-02-23
Piezoelectric Device, Liquid Ejecting Head And Method For Manufacturing Piezoelectric Device App 20170028726 - SATO; Naoya ; et al.	2017-02-02
Electronic Device, Liquid Ejecting Head, And Method Of Manufacturing Electronic Device App 20170028714 - YAMAGUCHI; Haruo ; et al.	2017-02-02
Electronic device, and manufacturing method of electronic device Grant 9,553,064 - Matsuo , et al. January 24, 2	2017-01-24
Electronic Device, And Manufacturing Method Of Electronic Device App 20160276300 - MATSUO; Yoshihide ; et al.	2016-09-22
Electronic Device Manufacturing Method And Electronic Device App 20160257101 - SATO; Naoya ; et al.	2016-09-08
Electronic Device And Manufacturing Method Of Electronic Device App 20160257093 - YOSHIIKE; Masashi ; et al.	2016-09-08
Wiring substrate, droplet ejection head, printing apparatus, electronic device, and manufacturing method for wiring substrate Grant 9,321,261 - Yoshiike April 26, 2	2016-04-26
Wiring Substrate, Droplet Ejection Head, Printing Apparatus, Electronic Device, And Manufacturing Method For Wiring Substrate App 20150191012 - YOSHIIKE; Masashi	2015-07-09

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