Yoshii; Akito
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshii; Akito.The latest application filed is for "method of manufacturing bonded body".
- Yoshii; Akito - Niigata JP
- YOSHII; Akito - Niigata-shi Niigata
- Yoshii; Akito - Nigata-shi JP
- Yoshii; Akito - Niigata-ken JP
| Patent | Date |
|---|---|
| Method of manufacturing bonded body Grant 10,290,601 - Dietz , et al. | 2019-05-14 |
| Method Of Manufacturing Bonded Body App 20180082972 - DIETZ; Raymond ; et al. | 2018-03-22 |
| Method for producing a metal particle Grant 9,789,546 - Takahashi , et al. October 17, 2 | 2017-10-17 |
| Metal particle Grant 9,186,727 - Takahashi , et al. November 17, 2 | 2015-11-17 |
| Silver Paste Composition And Method For Producing The Same App 20150218391 - Takahashi; Tomoyuki ; et al. | 2015-08-06 |
| Method For Producing A Metal Particle App 20150190865 - TAKAHASHI; Tomoyuki ; et al. | 2015-07-09 |
| Metal Particle And Method For Producing The Same App 20130221287 - Takahash; Tomoyuki ; et al. | 2013-08-29 |
| Conductive composition Grant 8,344,523 - Dietz , et al. January 1, 2 | 2013-01-01 |
| Shield method for electronic component enclosure and shield material Grant 8,015,690 - Ueno , et al. September 13, 2 | 2011-09-13 |
| Conductive Composition App 20100065790 - Dietz; Raymond L. ; et al. | 2010-03-18 |
| Shield method for electronic component enclosure and shield material App 20090223711 - Ueno; Yoshikazu ; et al. | 2009-09-10 |
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