Yoshihara; Hidekazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshihara; Hidekazu.The latest application filed is for "cover structure of tactile sensor and tactile sensor".

Company Profile

1.21.16

Yoshihara; Hidekazu - Ibaraki JP
Yoshihara; Hidekazu - Tokyo N/A JP
Yoshihara; Hidekazu - Minato-ku JP
Yoshihara; Hidekazu - Moriya JP
Yoshihara; Hidekazu - Fuchu-shi JP
Yoshihara; Hidekazu - Moriya-Shi JP
Yoshihara; Hidekazu - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cover structure of tactile sensor and tactile sensor Grant 10,584,983 - Murota , et al.	2020-03-10
Cover Structure Of Tactile Sensor And Tactile Sensor App 20170343394 - MUROTA; Yuki ; et al.	2017-11-30
Flexible circuit body and method for production thereof Grant 9,635,751 - Yoshihara , et al. April 25, 2	2017-04-25
Flexible circuit board and its method for production Grant 9,155,193 - Kajiya , et al. October 6, 2	2015-10-06
Flexible circuit board and method for production thereof Grant 9,024,198 - Kajiya , et al. May 5, 2	2015-05-05
Sealing structure Grant 9,024,184 - Kajiya , et al. May 5, 2	2015-05-05
Flexible Circuit Body And Method For Production Thereof App 20140124257 - Yoshihara; Hidekazu ; et al.	2014-05-08
Flexible Circuit Board And Method For Production Thereof App 20140102771 - Kajiya; Atsushi ; et al.	2014-04-17
Lighting device with LEDs mounted on flexible circuit board self maintained in bellows shape and manufacturing method thereof Grant 8,562,177 - Kajiya , et al. October 22, 2	2013-10-22
LED flexible board assembly and lighting unit Grant 8,545,056 - Kajiya , et al. October 1, 2	2013-10-01
Flexible printed circuit board Grant D687,397 - Kajiya , et al. August 6, 2	2013-08-06
Sealing Structure App 20130194735 - Kajiya; Atsushi ; et al.	2013-08-01
Method For Producing Decorative Sintered Metallic Article And Decorative Sintered Metallic Article App 20130058824 - Hirama; Masashi ; et al.	2013-03-07
Flexible Circuit Board And Its Method For Production App 20130056248 - Kajiya; Atsushi ; et al.	2013-03-07
Board Assembly And Lighting Unit App 20120287614 - Kajiya; Atsushi ; et al.	2012-11-15
Lighting Device And Manufacturing Method Thereof App 20120281411 - Kajiya; Atsushi ; et al.	2012-11-08
Flexible printed circuit board Grant D669,046 - Kajiya , et al. October 16, 2	2012-10-16
Flexible printed circuit board Grant D669,045 - Kajiya , et al. October 16, 2	2012-10-16
Flexible printed circuit board Grant D661,265 - Kajiya , et al. June 5, 2	2012-06-05
Method For Producing Decorative Metallic Article With Wood Grain Metal Pattern, And Decorative Metallic Article With Wood Grain Metal Pattern App 20120107561 - Hirama; Masashi ; et al.	2012-05-03
Method For Producing Sintered Copper Article For Craft Or Decorative Use, And Plastic Copper Containing Clay Compound App 20120107167 - Kasukawa; Tomoaki ; et al.	2012-05-03
Method For Producing Decorative Metallic Article Having Woodgrain Metal Pattern, And Decorative Metallic Article Having Woodgrain Metal Pattern App 20120100393 - Hirama; Masashi ; et al.	2012-04-26
Flexible printed circuit board Grant D656,111 - Kajiya , et al. March 20, 2	2012-03-20
Flexible printed circuit board Grant D656,112 - Kajiya , et al. March 20, 2	2012-03-20
Micromechanical device having an improved beam Grant 5,696,619 - Knipe , et al. December 9, 1	1997-12-09

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