loadpatents
name:-0.0086889266967773
name:-0.035039901733398
name:-0.00048995018005371
Yoshigahara; Haruyuki Patent Filings

Yoshigahara; Haruyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshigahara; Haruyuki.The latest application filed is for "method of manufacturing resin impregnated material, composite material and copper-clad laminate".

Company Profile
0.3.7
  • Yoshigahara; Haruyuki - Kizugawa JP
  • Yoshigahara; Haruyuki - Kizugawa-shi JP
  • Yoshigahara; Haruyuki - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity

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