YOSHIDA; Tatsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOSHIDA; Tatsushi.The latest application filed is for "method of manufacturing sulfide-based inorganic solid electrolyte material".

Company Profile

0.25.26

YOSHIDA; Tatsushi - Tsukuba-shi Ibaraki
Yoshida; Tatsushi - Fujisawa JP
Yoshida; Tatsushi - Fujisawa-shi JP
Yoshida; Tatsushi - Kanagawa N/A JP
Yoshida; Tatsushi - Chigasaki JP
Yoshida; Tatsushi - Osaka JP
Yoshida; Tatsushi - Hyogo JP
Yoshida, Tatsushi - Chigasaki-shi JP
Yoshida; Tatsushi - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lithium Nitride Composition For Sulfide-based Inorganic Solid Electrolyte Material App 20220081296 - MATSUBARA; Tetsuya ; et al.	2022-03-17
Diphosphorus Pentasulfide Composition For Sulfide-based Inorganic Solid Electrolyte Material App 20220085407 - YOSHIDA; Tatsushi ; et al.	2022-03-17
Method Of Manufacturing Sulfide-based Inorganic Solid Electrolyte Material App 20220085406 - MATSUBARA; Tetsuya ; et al.	2022-03-17
Solder ball jet nozzle having improved reliability Grant 10,029,327 - Murata , et al. July 24, 2	2018-07-24
Solder Ball Jet Nozzle Having Improved Reliability App 20160121416 - Murata; Kenichi ; et al.	2016-05-05
Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly Grant 8,881,967 - Matsumoto , et al. November 11, 2	2014-11-11
Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge Grant 8,477,457 - Matsumoto , et al. July 2, 2	2013-07-02
Head-gimbal Assembly With A Suspension-lead Pad Having A Form That Is Configured To Inhibit Formation Of An Inter-pad Solder Bridge App 20130063839 - Matsumoto; Yuhsuke ; et al.	2013-03-14
Connecting Electrical Parts App 20110132879 - Matsumoto; Yuhsuke ; et al.	2011-06-09
Apparatus For Interconnecting Connection Pads Of A Head-gimbal Assembly And Manufacturing Method For The Head-gimbal Assembly App 20100089981 - Matsumoto; Yohsuke ; et al.	2010-04-15
Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension Grant 7,619,856 - Matsumoto , et al. November 17, 2	2009-11-17
Rotating disk storage device and integrated wire head suspension assembly Grant 7,583,475 - Matsumoto , et al. September 1, 2	2009-09-01
Method for manufacturing a magnetic disk device with improved head gimbal assembly Grant 7,550,695 - Ichimura , et al. June 23, 2	2009-06-23
Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass Grant 7,486,480 - Satoh , et al. February 3, 2	2009-02-03
Thermoplastic Resin Composition with High Thermal Conductivity App 20080277619 - Matsumoto; Kazuaki ; et al.	2008-11-13
Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy Grant 7,400,470 - Matsumoto , et al. July 15, 2	2008-07-15
Conductive Composition, Conductive Molded Body and Conductive Gel Composition, and Method for Producing the Same App 20080139710 - Tsukada; Yasuhiro ; et al.	2008-06-12
Method of assembling a head gimbal assembly Grant 7,380,329 - Kidachi , et al. June 3, 2	2008-06-03
Method of removing lead-free solder from slider pad and magnetic disk drive Grant 7,342,749 - Hashi , et al. March 11, 2	2008-03-11
Transfer system for assembling a head gimbal assembly Grant 7,210,221 - Kidachi , et al. May 1, 2	2007-05-01
Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly Grant 7,161,766 - Kidachi , et al. January 9, 2	2007-01-09
Head gimbal assembly and magnetic disk drive with solder ball connection App 20060238921 - Matsumoto; Yuhsuke ; et al.	2006-10-26
Resin composition containing ultrafine particles App 20060199900 - Matsumoto; Kazuaki ; et al.	2006-09-07
Manufacturing method of head gimbal assembly with solder fillet and head gimbal assembly App 20060193084 - Satoh; Takuya ; et al.	2006-08-31
Head gimbal assembly and magnetic disk drive App 20060139809 - Matsumoto; Yuhsuke ; et al.	2006-06-29
Method for manufacturing a magnetic disk device with improved head gimbal assembly App 20060053621 - Ichimura; Yohtaroh ; et al.	2006-03-16
Method of removing lead-free solder from slider pad and magnetic disk drive App 20060012918 - Hashi; Nobuyuki ; et al.	2006-01-19
Flame retardant and flame-retardant resin composition Grant 6,982,294 - Matsumoto , et al. January 3, 2	2006-01-03
Rotating disk storage device and integrated wire head suspension assembly App 20050199680 - Matsumoto, Yuhsuke ; et al.	2005-09-15
Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly App 20050028353 - Kidachi, Takao ; et al.	2005-02-10
Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly App 20050022372 - Kidachi, Takao ; et al.	2005-02-03
Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly App 20050024777 - Kidachi, Takao ; et al.	2005-02-03
Apparatus and method for separating head gimbal assembly from bonding jig Grant 6,848,167 - Mita , et al. February 1, 2	2005-02-01
Apparatus for assembling a head gimbal assembly Grant 6,823,581 - Kidachi , et al. November 30, 2	2004-11-30
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus Grant 6,742,694 - Satoh , et al. June 1, 2	2004-06-01
Method for bonding slider and suspension together and deciding conditions of laser beam irradiation Grant 6,676,778 - Tuchiya , et al. January 13, 2	2004-01-13
Wire bonding method and apparatus Grant 6,676,005 - Itoh , et al. January 13, 2	2004-01-13
Appearance inspecting jig for small parts and inspecting method employing the same jig Grant 6,628,380 - Fujimori , et al. September 30, 2	2003-09-30
Flame retardant and flame-retardant resin composition App 20030130387 - Matsumoto, Kazuaki ; et al.	2003-07-10
Head supporting arm, Data recording apparatus, with laser beam exposing aperture and limiter Grant 6,556,384 - Inoue , et al. April 29, 2	2003-04-29
Wire bonding method and apparatus App 20030010806 - Itoh, Kenji ; et al.	2003-01-16
Solder-ball bonding device and method App 20020179696 - Pattanaik, Surya ; et al.	2002-12-05
Hard disk drive with slider support structure and head gimbal assembly Grant 6,459,549 - Tsuchiya , et al. October 1, 2	2002-10-01
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus App 20020113115 - Satoh, Takuya ; et al.	2002-08-22
Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assemly App 20020060882 - Kidachi, Takao ; et al.	2002-05-23
Head supporting arm having laser beam exposing aperture Grant 6,366,431 - Tsuchiya , et al. April 2, 2	2002-04-02
Apparatus and method for separating head gimbal assembly from bonding jig App 20010054225 - Mita, Yasuhiro ; et al.	2001-12-27
Method for ultrasonic bonding of slider and lead in a hard disk drive head gimbal assembly Grant 6,321,974 - Tsuchiya , et al. November 27, 2	2001-11-27

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