Yoshida; Sumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshida; Sumio.The latest application filed is for "flexible laminate board, process for manufacture of the board, and flexible print wiring board".
- Yoshida; Sumio - Chikusei N/A JP
- YOSHIDA; Sumio - Chikusei-shi JP
- Yoshida; Sumio - Ibaraki JP
- Yoshida; Sumio - Yokohama JP
- Yoshida; Sumio - Ono JP
| Patent | Date |
|---|---|
| Flexible laminate board, process for manufacturing of the board, and flexible print wiring board Grant 8,501,279 - Suzuki , et al. August 6, 2 | 2013-08-06 |
| Flexible Laminate Board, Process For Manufacture Of The Board, And Flexible Print Wiring Board App 20120244275 - SUZUKI; Masahiko ; et al. | 2012-09-27 |
| Flexible Laminate Board, Process for Manufacturing of the Board, and Flexible Print Wiring Board App 20090081426 - Suzuki; Masahiko ; et al. | 2009-03-26 |
| Prepreg of ultra-high-molecular-weight polyethylene Grant 5,723,388 - Kobayashi , et al. March 3, 1 | 1998-03-03 |
| Method for the continuous production of a polyethylene material having high strength and high modulus of elasticity Grant 5,702,657 - Yoshida , et al. December 30, 1 | 1997-12-30 |
| Saw blade Grant 4,958,546 - Yoshida , et al. September 25, 1 | 1990-09-25 |
| Saw blade Grant 4,827,822 - Yoshida , et al. May 9, 1 | 1989-05-09 |
| Saw blade Grant 4,727,788 - Yoshida , et al. March 1, 1 | 1988-03-01 |
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