Yoshida; Hisahiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshida; Hisahiko.The latest application filed is for "mounted structure and manufacturing method of mounted structure".
- Yoshida; Hisahiko - Osaka N/A JP
- Yoshida; Hisahiko - Ibaraki JP
- Yoshida; Hisahiko - Ibaraki-shi JP
| Patent | Date |
|---|---|
| Mounted structure and manufacturing method of mounted structure Grant 9,603,295 - Yamaguchi , et al. March 21, 2 | 2017-03-21 |
| Mounted Structure And Manufacturing Method Of Mounted Structure App 20140049930 - Yamaguchi; Atsushi ; et al. | 2014-02-20 |
| Electronic device and manufacturing method Grant 7,993,984 - Yokota , et al. August 9, 2 | 2011-08-09 |
| Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device Grant 7,969,028 - Yoshida June 28, 2 | 2011-06-28 |
| Electronic Device And Manufacturing Method App 20090014873 - Yokota; Yasuo ; et al. | 2009-01-15 |
| Semiconductor Device Mounting Structure, Manufacturing Method, And Removal Method Of Semiconductor Device App 20080308930 - Yoshida; Hisahiko | 2008-12-18 |
| Lead-free solder and soldered article Grant 7,282,174 - Hirata , et al. October 16, 2 | 2007-10-16 |
| Lead-free solder and soldered article App 20060102690 - Hirata; Masahiko ; et al. | 2006-05-18 |
| Solder paste Grant 6,926,849 - Taguchi , et al. August 9, 2 | 2005-08-09 |
| Solder paste Grant 6,736,907 - Taguchi , et al. May 18, 2 | 2004-05-18 |
| Solder pastes App 20040069974 - Taguchi, Toshihiko ; et al. | 2004-04-15 |
| Solder paste App 20030121564 - Taguchi, Toshihiko ; et al. | 2003-07-03 |
| Lead-free Zinc-Containing Solder Paste App 20020050305 - Taguchi, Toshihiko ; et al. | 2002-05-02 |
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