Yoshiba; Shigeharu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshiba; Shigeharu.The latest application filed is for "method for manufacturing semiconductor device, semiconductor device and molding die".
- Yoshiba; Shigeharu - Gunma N/A JP
- Yoshiba; Shigeharu - Oizumi-machi JP
| Patent | Date |
|---|---|
| Circuit device and method of manufacturing the same Grant 9,035,473 - Nakazato , et al. May 19, 2 | 2015-05-19 |
| Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method Grant 8,105,883 - Yoshiba , et al. January 31, 2 | 2012-01-31 |
| Method For Manufacturing Semiconductor Device, Semiconductor Device And Molding Die App 20100219517 - YOSHIBA; Shigeharu ; et al. | 2010-09-02 |
| Circuit Device And Method Of Manufacturing The Same App 20100078833 - NAKAZATO; Isao ; et al. | 2010-04-01 |
| Semiconductor device and switching element Grant 7,030,501 - Yoshiba , et al. April 18, 2 | 2006-04-18 |
| Semiconductor device and switching element App 20050017339 - Yoshiba, Shigeharu ; et al. | 2005-01-27 |
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