Yoshi; Naonobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoshi; Naonobu.The latest application filed is for "metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate".

Company Profile

0.7.7

Yoshi; Naonobu - Tokyo-to JP
YOSHI; Naonobu - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate Grant 9,972,413 - Omori , et al. May 15, 2	2018-05-15
Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate Grant 9,953,740 - Omori , et al. April 24, 2	2018-04-24
Metal particle dispersion, article and sintered film using metal particle dispersion, and method for producing sintered film Grant 9,751,997 - Ogura , et al. September 5, 2	2017-09-05
Metal Microparticle Dispersion, Process For Production Of Electrically Conductive Substrate, And Electrically Conductive Substrate App 20170013711 - HOJO; Mikiko ; et al.	2017-01-12
Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate Grant 9,497,859 - Hojo , et al. November 15, 2	2016-11-15
Conductive substrate comprising a metal fine particle sintered film Grant 9,420,698 - Yoshi , et al. August 16, 2	2016-08-16
Dispersant, Metal Particle Dispersion For Electroconductive Substrates, And Method For Producing Electroconductive Substrate App 20150299364 - OMORI; Yoshinobu ; et al.	2015-10-22
Metal Particle Dispersion For Electroconductive Substrates, Method For Producing The Same, And Method For Producing An Electroconductive Substrate App 20150279505 - Omori; Yoshinobu ; et al.	2015-10-01
Metal Particle Dispersion, Article And Sintered Film Using Metal Particle Dispersion, And Method For Producing Sintered Film App 20150252157 - Ogura; Michihiro ; et al.	2015-09-10
Metal Microparticle Dispersion, Process For Production Of Electrically Conductive Substrate, And Electrically Conductive Substrate App 20120267151 - Hojo; Mikiko ; et al.	2012-10-25
Conductive Substrate App 20120061130 - Yoshi; Naonobu ; et al.	2012-03-15

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