| Patent | Date |
|---|
Apparatus and method for guiding multi-view capture
Grant 11,375,107 - Lim , et al. June 28, 2 | 2022-06-28 |
Learning-based 3d Model Creation Apparatus And Method
App 20220101604 - LIM; Seong-Jae ; et al. | 2022-03-31 |
Learning-based 3D model creation apparatus and method
Grant 11,232,632 - Lim , et al. January 25, 2 | 2022-01-25 |
Method and system for generating 3D image of character
Grant 11,138,785 - Choi , et al. October 5, 2 | 2021-10-05 |
Apparatus And Method For Generating Three-dimensional Model
App 20210158606 - LEE; Seung-Wook ; et al. | 2021-05-27 |
Apparatus And Method For Guiding Multi-view Capture
App 20210136280 - LIM; Seong-Jae ; et al. | 2021-05-06 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant RE48,408 - Pagaila , et al. January 26, 2 | 2021-01-26 |
Camera auxiliary device for privacy protection and privacy protection method using the same
Grant 10,791,263 - Hwang , et al. September 29, 2 | 2020-09-29 |
Learning-based 3d Model Creation Apparatus And Method
App 20200273247 - LIM; Seong-Jae ; et al. | 2020-08-27 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant RE48,111 - Pagaila , et al. | 2020-07-21 |
Method And System For Generating 3d Image Of Character
App 20200184711 - CHOI; Jin Sung ; et al. | 2020-06-11 |
Training Data Set Generation Apparatus And Method For Machine Learning
App 20200151963 - LEE; Seung-Wook ; et al. | 2020-05-14 |
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
Grant 10,643,952 - Pagaila , et al. | 2020-05-05 |
Apparatus and method for generating 3D printing model using multiple textures
Grant 10,360,313 - Yoon , et al. | 2019-07-23 |
Method and apparatus for reconstructing 3D face with stereo camera
Grant 10,043,278 - Kim , et al. August 7, 2 | 2018-08-07 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 9,893,045 - Pagaila , et al. February 13, 2 | 2018-02-13 |
Apparatus and method for creating three-dimensional personalized figure
Grant 9,846,804 - Lim , et al. December 19, 2 | 2017-12-19 |
Apparatus And Method For Generating 3d Printing Model Using Multiple Textures
App 20170255714 - YOON; Seung Uk ; et al. | 2017-09-07 |
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
Grant 9,754,858 - Pagaila , et al. September 5, 2 | 2017-09-05 |
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die
App 20170018507 - Pagaila; Reza A. ; et al. | 2017-01-19 |
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
Grant 9,484,279 - Pagaila , et al. November 1, 2 | 2016-11-01 |
Apparatus And Method For Authoring Three-dimensional Object For Three-dimensional Printing
App 20160176116 - HWANG; Bon Woo ; et al. | 2016-06-23 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20160111410 - Pagaila; Reza A. ; et al. | 2016-04-21 |
Local multi-resolution 3-D face-inherent model generation apparatus and method and facial skin management system
Grant 9,245,380 - Kim , et al. January 26, 2 | 2016-01-26 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 9,240,380 - Pagaila , et al. January 19, 2 | 2016-01-19 |
Apparatus and method for reconstructing three dimensional faces based on multiple cameras
Grant 9,189,857 - Yoon , et al. November 17, 2 | 2015-11-17 |
Apparatus And Method For Creating Three-dimensional Personalized Figure
App 20150254502 - LIM; Seong-Jae ; et al. | 2015-09-10 |
Method And Apparatus For Reconstructing 3d Face With Stereo Camera
App 20150228081 - KIM; Kap Kee ; et al. | 2015-08-13 |
Apparatus And Method For Generating Three-dimensional Output Data
App 20150172637 - YOON; Seung-Uk ; et al. | 2015-06-18 |
Integrated circuit packaging system with embedded circuitry and post
Grant 8,957,530 - Shim , et al. February 17, 2 | 2015-02-17 |
3D model shape transformation method and apparatus
Grant 8,922,547 - Lim , et al. December 30, 2 | 2014-12-30 |
3D model shape transformation method and apparatus
Grant 08922547 - | 2014-12-30 |
System and method for managing face data
Grant 8,902,305 - Hwang , et al. December 2, 2 | 2014-12-02 |
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
Grant 8,896,109 - Pagaila , et al. November 25, 2 | 2014-11-25 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20140327145 - Pagaila; Reza A. ; et al. | 2014-11-06 |
Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
Grant 8,822,281 - Pagaila , et al. September 2, 2 | 2014-09-02 |
Method And Apparatus For Creating Three-dimensional Montage
App 20140204089 - LIM; Seong Jae ; et al. | 2014-07-24 |
Method And Apparatus For Generating Three-dimensional Caricature Using Shape And Texture Of Face
App 20140192045 - HWANG; Bon Woo ; et al. | 2014-07-10 |
3d Avatar Output Device And Method
App 20140168216 - KIM; Kap Kee ; et al. | 2014-06-19 |
Apparatus and method for creating 3D content for oriental painting
Grant 8,682,107 - Yoon , et al. March 25, 2 | 2014-03-25 |
Apparatus And Method For Reconstructing Three Dimensional Faces Based On Multiple Cameras
App 20130301906 - YOON; Seung-Uk ; et al. | 2013-11-14 |
Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die
App 20130292851 - Pagaila; Reza A. ; et al. | 2013-11-07 |
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
Grant 8,518,746 - Pagaila , et al. August 27, 2 | 2013-08-27 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20130105989 - Pagaila; Reza A. ; et al. | 2013-05-02 |
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
App 20130075903 - Pagaila; Reza A. ; et al. | 2013-03-28 |
System And Method For Managing Face Data
App 20130057656 - HWANG; Bon Woo ; et al. | 2013-03-07 |
Local Multi-resolution 3-d Face-inherent Model Generation Apparatus And Method And Facial Skin Management System
App 20130050434 - KIM; Kap Kee ; et al. | 2013-02-28 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
Grant 8,383,457 - Pagaila , et al. February 26, 2 | 2013-02-26 |
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
Grant 8,354,297 - Pagaila , et al. January 15, 2 | 2013-01-15 |
3d Model Shape Transformation Method And Apparatus
App 20120162217 - LIM; Seong-Jae ; et al. | 2012-06-28 |
Apparatus And Method For Creating 3d Content For Oriental Painting
App 20120163733 - YOON; Seung-Uk ; et al. | 2012-06-28 |
Apparatus And Method For Creating Animation By Capturing Movements Of Non-rigid Objects
App 20120154393 - LEE; Ji-Hyung ; et al. | 2012-06-21 |
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
App 20120056329 - Pagaila; Reza A. ; et al. | 2012-03-08 |
Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die
App 20120056312 - Pagaila; Reza A. ; et al. | 2012-03-08 |
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
App 20120056316 - Pagaila; Reza A. ; et al. | 2012-03-08 |
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die
App 20110298101 - Pagaila; Reza A. ; et al. | 2011-12-08 |
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
App 20110204505 - Pagaila; Reza A. ; et al. | 2011-08-25 |
Integrated Circuit Packaging System With Embedded Circuitry And Post
App 20110127678 - Shim; Il Kwon ; et al. | 2011-06-02 |
Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
Grant 7,888,184 - Shim , et al. February 15, 2 | 2011-02-15 |
Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
App 20100327406 - Padmanathan; Meenakshi ; et al. | 2010-12-30 |
Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof
Grant 7,786,008 - Do , et al. August 31, 2 | 2010-08-31 |
Device, Unit, System And Method For The Magnetically-assisted Assembling Of Chip-scale, And Nano And Micro-scale Components Onto A Substrate
App 20100170086 - Ramadan; Qasem ; et al. | 2010-07-08 |
Integrated Circuit Packaging System Having Through Silicon Vias With Partial Depth Metal Fill Regions And Method Of Manufacture Thereof
App 20100148336 - Do; Byung Tai ; et al. | 2010-06-17 |
Integrated Circuit Packaging System With Embedded Circuitry And Post, And Method Of Manufacture Thereof
App 20090315170 - Shim; Il Kwon ; et al. | 2009-12-24 |
RF and MMIC stackable micro-modules
Grant 7,592,703 - Kripesh , et al. September 22, 2 | 2009-09-22 |
RF and MMIC stackable micro-modules
App 20070222083 - Kripesh; Vaidyanathan ; et al. | 2007-09-27 |
RF and MMIC stackable micro-modules
Grant 7,230,318 - Kripesh , et al. June 12, 2 | 2007-06-12 |
Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same
App 20060223313 - Yoon; Seung Uk ; et al. | 2006-10-05 |
RF and MMIC stackable micro-modules
App 20050146049 - Kripesh, Vaidyanathan ; et al. | 2005-07-07 |
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