| Patent | Date |
|---|
Semiconductor Device And Manufacturing Method Thereof
App 20220293482 - Khim; Jin Young ; et al. | 2022-09-15 |
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
Grant 11,430,723 - Kim , et al. August 30, 2 | 2022-08-30 |
Electronic device package and fabricating method thereof
Grant 11,362,128 - Kim , et al. June 14, 2 | 2022-06-14 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20220181314 - Kim; Jin Young ; et al. | 2022-06-09 |
Semiconductor device and manufacturing method thereof
Grant 11,205,602 - Khim , et al. December 21, 2 | 2021-12-21 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 11,183,493 - Kim , et al. November 23, 2 | 2021-11-23 |
Electronic Device Package And Fabricating Method Thereof
App 20210020679 - Kim; Jin Young ; et al. | 2021-01-21 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20200203331 - Kim; Jin Young ; et al. | 2020-06-25 |
Electronic device package and fabricating method thereof
Grant 10,692,918 - Kim , et al. | 2020-06-23 |
Electronic Device Package And Fabricating Method Thereof
App 20190393258 - Kim; Jin Young ; et al. | 2019-12-26 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 10,388,643 - Kim , et al. A | 2019-08-20 |
Electronic device package and fabricating method thereof
Grant 10,304,890 - Kim , et al. | 2019-05-28 |
Semiconductor Device And Manufacturing Method Thereof
App 20190057919 - Khim; Jin Young ; et al. | 2019-02-21 |
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate
App 20190043793 - Kim; Jae Yun ; et al. | 2019-02-07 |
Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
Grant 10,177,117 - Bang , et al. J | 2019-01-08 |
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
Grant 10,090,230 - Kim , et al. October 2, 2 | 2018-10-02 |
Semiconductor device and manufacturing method thereof
Grant 10,062,626 - Khim , et al. August 28, 2 | 2018-08-28 |
Electronic Device Package And Fabricating Method Thereof
App 20180083061 - Kim; Jin Young ; et al. | 2018-03-22 |
Semiconductor Device And Manufacturing Method Thereof
App 20180033708 - Khim; Jin Young ; et al. | 2018-02-01 |
Electronic device package and fabricating method thereof
Grant 9,831,282 - Kim , et al. November 28, 2 | 2017-11-28 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20170271315 - Kim; Jin Young ; et al. | 2017-09-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20170200686 - Kang; Sung Geun ; et al. | 2017-07-13 |
Stacked semiconductor package and manufacturing method thereof
Grant 9,633,966 - Park , et al. April 25, 2 | 2017-04-25 |
Laser assisted bonding for semiconductor die interconnections
Grant 9,627,348 - Ryu , et al. April 18, 2 | 2017-04-18 |
Semiconductor device using EMC wafer support system and fabricating method thereof
Grant 9,627,368 - Kim , et al. April 18, 2 | 2017-04-18 |
Electronic Device Package And Fabricating Method Thereof
App 20160365379 - Kim; Jin Young ; et al. | 2016-12-15 |
Method For Fabricating Semiconductor Package Having A Multi-layer Molded Conductive Substrate And Structure
App 20160343688 - Bang; Won Bae ; et al. | 2016-11-24 |
Package of finger print sensor and fabricating method thereof
Grant 9,431,447 - Kim , et al. August 30, 2 | 2016-08-30 |
Stacked Semiconductor Package and Manufacturing Method Thereof
App 20160104659 - Park; Dong Joo ; et al. | 2016-04-14 |
Laser Assisted Bonding For Semiconductor Die Interconnections
App 20160049381 - Ryu; Dong Su ; et al. | 2016-02-18 |
Package Of Finger Print Sensor And Fabricating Method Thereof
App 20150340399 - Kim; Jin Young ; et al. | 2015-11-26 |
Package of finger print sensor and fabricating method thereof
Grant 9,129,873 - Kim , et al. September 8, 2 | 2015-09-08 |
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate
App 20150084185 - Kim; Jae Yun ; et al. | 2015-03-26 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,847,372 - Darveaux , et al. September 30, 2 | 2014-09-30 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof
App 20140147970 - Kim; Jin Young ; et al. | 2014-05-29 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,541,260 - Darveaux , et al. September 24, 2 | 2013-09-24 |
Exposed die overmolded flip chip package and fabrication method
Grant 8,476,748 - Darveaux , et al. July 2, 2 | 2013-07-02 |
Exposed die overmolded flip chip package
Grant 8,368,194 - Darveaux , et al. February 5, 2 | 2013-02-05 |
Exposed die overmolded flip chip package method
Grant 8,207,022 - Darveaux , et al. June 26, 2 | 2012-06-26 |
Exposed die overmolded flip chip package and fabrication method
Grant 7,898,093 - Darveaux , et al. March 1, 2 | 2011-03-01 |
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques
Grant 6,589,801 - Yoon , et al. July 8, 2 | 2003-07-08 |
Circuit pattern tape for wafer-scale production of chip size semiconductor packages
Grant 6,479,887 - Yoon , et al. November 12, 2 | 2002-11-12 |
Grid array type lead frame having lead ends in different planes
Grant 6,150,709 - Shin , et al. November 21, 2 | 2000-11-21 |
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