Yoon; In Sang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoon; In Sang.The latest application filed is for "method for manufacturing synthetic gemstone".

Company Profile

6.45.36

Yoon; In Sang - Seoul KR
Yoon; In Sang - Ichon-si N/A KR
Yoon; In Sang - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with shielding and method of manufacture thereof Grant 11,145,603 - Han , et al. October 12, 2	2021-10-12
Integrated circuit packaging system with shielding and method of manufacture thereof Grant 11,024,585 - Han , et al. June 1, 2	2021-06-01
Method for manufacturing synthetic gemstone Grant 10,844,512 - Choi , et al. November 24, 2	2020-11-24
Method For Manufacturing Synthetic Gemstone App 20200270178 - CHOI; Chul-Hong ; et al.	2020-08-27
Biological Material Manufacturing Device And Driving Method Thereof App 20200248117 - Kind Code	2020-08-06
Method For Manufacturing Synthetic Gemstone App 20200131665 - CHOI; Chul-Hong ; et al.	2020-04-30
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof App 20180294236 - Han; Byung Joon ; et al.	2018-10-11
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof App 20180294235 - Han; Byung Joon ; et al.	2018-10-11
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof Grant 10,083,903 - Yoon , et al. September 25, 2	2018-09-25
Integrated circuit packaging system with shielding and method of manufacturing thereof Grant 9,997,468 - Han , et al. June 12, 2	2018-06-12
Interposer substrate designs for semiconductor packages Grant 9,905,491 - Yoon , et al. February 27, 2	2018-02-27
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 9,748,203 - Yang , et al. August 29, 2	2017-08-29
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof App 20160300799 - Han; Byung Joon ; et al.	2016-10-13
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof Grant 9,385,066 - Yoon , et al. July 5, 2	2016-07-05
Integrated circuit packaging system with package stacking Grant 9,349,666 - Bae , et al. May 24, 2	2016-05-24
Integrated circuit packaging system with connection structure and method of manufacture thereof Grant 9,202,715 - Kim , et al. December 1, 2	2015-12-01
Coreless integrated circuit packaging system and method of manufacture thereof Grant 9,142,530 - Do , et al. September 22, 2	2015-09-22
Coreless Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20140284791 - Do; Byung Tai ; et al.	2014-09-25
Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer Grant 8,765,525 - Yoon , et al. July 1, 2	2014-07-01
Integrated circuit packaging system with stack device Grant 8,698,297 - Bae , et al. April 15, 2	2014-04-15
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,674,516 - Han , et al. March 18, 2	2014-03-18
Method of manufacturing integrated circuit packaging system with support structure Grant 8,633,100 - Yang , et al. January 21, 2	2014-01-21
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Grant 8,558,366 - Choi , et al. October 15, 2	2013-10-15
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Grant 8,497,575 - Yoon , et al. July 30, 2	2013-07-30
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20130154092 - Yang; DeokKyung ; et al.	2013-06-20
Integrated circuit packaging system with an interposer substrate and method of manufacture thereof Grant 8,409,917 - Yoon , et al. April 2, 2	2013-04-02
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20130075926 - Bae; JoHyun ; et al.	2013-03-28
Integrated circuit package on package system Grant 8,367,465 - Park , et al. February 5, 2	2013-02-05
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120326331 - Han; Byung Joon ; et al.	2012-12-27
Integrated Circuit Packaging System With Molded Laser Via Interposer And Method Of Manufacture Thereof App 20120319265 - Yoon; In Sang ; et al.	2012-12-20
Integrated Circuit Packaging System With Support Structure And Method Of Manufacture Thereof App 20120319286 - Yang; DeokKyung ; et al.	2012-12-20
Integrated circuit package system with package stacking and method of manufacture thereof Grant 8,299,595 - Yoon , et al. October 30, 2	2012-10-30
Integrated Circuit Packaging System With An Interposer Substrate And Method Of Manufacture Thereof App 20120241925 - Yoon; In Sang ; et al.	2012-09-27
Integrated circuit package system with step mold recess Grant 8,247,894 - Yoon , et al. August 21, 2	2012-08-21
Integrated Circuit Packaging System With Connection Structure And Method Of Manufacture Thereof App 20120119360 - Kim; YoungChul ; et al.	2012-05-17
Integrated Circuit Packaging System With Interposer Interconnections And Method Of Manufacture Thereof App 20120086115 - Choi; A Leam ; et al.	2012-04-12
Integrated circuit package system and method of package stacking Grant 8,130,512 - Yoon , et al. March 6, 2	2012-03-06
Mountable integrated circuit package system with substrate having a conductor-free recess Grant 8,129,832 - Carson , et al. March 6, 2	2012-03-06
Bump chip carrier semiconductor package system Grant 8,124,459 - Yoon , et al. February 28, 2	2012-02-28
Integrated circuit package system Grant 8,102,666 - Park , et al. January 24, 2	2012-01-24
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Grant 8,080,446 - Choi , et al. December 20, 2	2011-12-20
Integrated circuit package system with interposer Grant 8,035,210 - Yang , et al. October 11, 2	2011-10-11
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof App 20110227209 - Yoon; In Sang ; et al.	2011-09-22
Semiconductor Packaging System With An Aligned Interconnect And Method Of Manufacture Thereof App 20110204508 - Yoon; In Sang ; et al.	2011-08-25
Integrated circuit with step molded inner stacking module package in package system Grant 7,875,967 - Yang , et al. January 25, 2	2011-01-25
Integrated Circuit Packaging System With Interposer Interconnections And Method Of Manufacture Thereof App 20100301469 - Choi; A Leam ; et al.	2010-12-02
Mountable integrated circuit package system with stacking interposer Grant 7,800,212 - Yoon , et al. September 21, 2	2010-09-21
Integrated Circuit Package System And Method Of Package Stacking App 20100123233 - Yoon; In Sang ; et al.	2010-05-20
Integrated Circuit Package System App 20100046183 - Park; HyungSang ; et al.	2010-02-25
Integrated circuit package system with mold lock subassembly Grant 7,667,314 - Yoon , et al. February 23, 2	2010-02-23
Integrated Circuit Package System With Step Mold Recess App 20090236720 - Yoon; In Sang ; et al.	2009-09-24
Integrated Circuit With Step Molded Inner Stacking Module Package In Package System App 20090224390 - Yang; DeokKyung ; et al.	2009-09-10
Mountable Integrated Circuit Package System With Stacking Interposer App 20090166834 - Yoon; In Sang ; et al.	2009-07-02
Integrated Circuit Package System With Interposer App 20090166835 - Yang; Joungin ; et al.	2009-07-02
Mountable Integrated Circuit Package System With Protrusion App 20090127715 - Shin; HanGil ; et al.	2009-05-21
Mountable Integrated Circuit Package System With Substrate Having A Conductor-free Recess App 20090108428 - Carson; Flynn ; et al.	2009-04-30
Integrated Circuit Package System With Mold Lock Subassembly App 20090085199 - Yoon; In Sang ; et al.	2009-04-02
Semiconductor chip packaging method with individually placed film adhesive pieces Grant 7,306,971 - Jeong , et al. December 11, 2	2007-12-11
Multichip Package System App 20070235216 - Bae; JoHyun ; et al.	2007-10-11
Integrated Circuit Package On Package System App 20070216006 - Park; DongSam ; et al.	2007-09-20
Bump Chip Carrier Semiconductor Package System App 20070108605 - Yoon; In Sang ; et al.	2007-05-17
Encapsulation method for semiconductor device having center pad App 20060192275 - Lee; Seongmin ; et al.	2006-08-31
Semiconductor chip packaging method with individually placed film adhesive pieces App 20050208701 - Jeong, Jin-Wook ; et al.	2005-09-22

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