YOON; Hyungsuk Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOON; Hyungsuk Alexander.The latest application filed is for "modifying ferroelectric properties of hafnium oxide with hafnium nitride layers".

Company Profile

3.41.58

YOON; Hyungsuk Alexander - San Jose CA
Yoon; Hyungsuk Alexander - Fremont CA
Yoon; Hyungsuk Alexander - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Modifying Ferroelectric Properties Of Hafnium Oxide With Hafnium Nitride Layers App 20210028273 - YOON; Hyungsuk Alexander ; et al.	2021-01-28
Capping Layer For A Hafnium Oxide-based Ferroelectric Material App 20210020433 - YOON; Hyungsuk Alexander ; et al.	2021-01-21
Method of sealing open pores on surface of porous dielectric material using iCVD process Grant 10,535,514 - Cho , et al. Ja	2020-01-14
Methods For Improving Performance In Hafnium Oxide-based Ferroelectric Material Using Plasma And/or Thermal Treatment App 20190057860 - YOON; Hyungsuk Alexander ; et al.	2019-02-21
Method of Surface Localized Pore Sealing of Porous Dielectric Material App 20180277362 - Cho; Byung Jin ; et al.	2018-09-27
Methods for forming germanium and silicon germanium nanowire devices Grant 9,911,660 - Yoon , et al. March 6, 2	2018-03-06
Method of Sealing Open Pores on Surface of Porous Dielectric Material Using iCVD Process App 20170358488 - Cho; Byung Jin ; et al.	2017-12-14
Methods For Forming Germanium And Silicon Germanium Nanowire Devices App 20170309521 - Yoon; Hyungsuk Alexander ; et al.	2017-10-26
Method of manufacturing n-doped graphene and electrical component using NH.sub.4F, and graphene and electrical component thereby Grant 9,472,675 - Cho , et al. October 18, 2	2016-10-18
Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof App 20160270237 - Cho; Byung Jin ; et al.	2016-09-15
Apparatus and method for atomic layer deposition Grant 9,359,673 - Yoon , et al. June 7, 2	2016-06-07
Systems And Methods For Forming Selective Metal Electrode Layers For Resistive Switching Memories App 20160138166 - Yoon; Hyungsuk Alexander ; et al.	2016-05-19
Method of Manufacturing N-Doped Graphene and Electrical Component Using NH4F, and Graphene and Electrical Component Thereby App 20150280011 - Cho; Byung Jin ; et al.	2015-10-01
Controlled ambient system for interface engineering Grant 9,117,860 - Boyd , et al. August 25, 2	2015-08-25
Apparatus For Barrier Interface Preparation Of Copper Interconnect App 20150128861 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
Methods For Barrier Interface Preparation Of Copper Interconnect App 20150132946 - Yoon; Hyungsuk Alexander ; et al.	2015-05-14
Apparatus for the removal of a fluorinated polymer from a substrate Grant 8,926,789 - Yoon , et al. January 6, 2	2015-01-06
Method for barrier interface preparation of copper interconnect Grant 8,916,232 - Yoon , et al. December 23, 2	2014-12-23
Methods for removing a metal oxide from a substrate Grant 8,883,027 - Yoon , et al. November 11, 2	2014-11-11
Methods And Apparatuses For Three Dimensional Integrated Circuits App 20140145334 - BOYD; John ; et al.	2014-05-29
Methods and apparatuses for three dimensional integrated circuits Grant 8,673,769 - Boyd , et al. March 18, 2	2014-03-18
Methods for atomic layer deposition Grant 8,623,456 - Yoon , et al. January 7, 2	2014-01-07
Device with post-contact back end of line through-hole via integration Grant 8,519,461 - Boyd , et al. August 27, 2	2013-08-27
Methods For Three-dimensional Integrated Circuit Through Hole Via Gapfill And Overburden Removal App 20130171820 - Boyd; John ; et al.	2013-07-04
Methods For Atomic Layer Deposition App 20130040460 - Yoon; Hyungsuk Alexander ; et al.	2013-02-14
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal Grant 8,323,460 - Boyd , et al. December 4, 2	2012-12-04
Methods for removing an edge polymer from a substrate Grant 8,298,433 - Yoon , et al. October 30, 2	2012-10-30
Processes and Systems for Engineering a Barrier Surface for Copper Deposition App 20120269987 - Dordi; Yezdi ; et al.	2012-10-25
Apparatus and method for atomic layer deposition Grant 8,287,647 - Yoon , et al. October 16, 2	2012-10-16
Apparatus And Method For Atomic Layer Deposition App 20120248219 - Yoon; Hyungsuk Alexander ; et al.	2012-10-04
Device With Post-contact Back End Of Line Through-hole Via Integration App 20120205807 - Boyd; John ; et al.	2012-08-16
Processes and systems for engineering a barrier surface for copper deposition Grant 8,241,701 - Dordi , et al. August 14, 2	2012-08-14
Methods of post-contact back end of line through-hole via integration Grant 8,187,968 - Boyd , et al. May 29, 2	2012-05-29
Methods for Isolated Bevel Edge Clean App 20120118320 - Yoon; Hyungsuk Alexander ; et al.	2012-05-17
Methods Of Fabricating Electronic Devices Using Direct Copper Plating App 20120056325 - YOON; Hyungsuk Alexander ; et al.	2012-03-08
Apparatus for isolated bevel edge clean and method for using the same Grant 8,127,395 - Yoon , et al. March 6, 2	2012-03-06
Interconnect Structure And Method Of Manufacturing A Damascene Structure App 20110306203 - Dordi; Yezdi ; et al.	2011-12-15
Methods of fabricating electronic devices using direct copper plating Grant 8,058,164 - Yoon , et al. November 15, 2	2011-11-15
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 8,053,355 - Redeker , et al. November 8, 2	2011-11-08
Interconnect structure and method of manufacturing a damascene structure Grant 8,026,605 - Dordi , et al. September 27, 2	2011-09-27
Integrated Tool Sets And Process To Keep Substrate Surface Wet During Plating And Clean In Fabrication Of Advanced Nano-electronic Devices App 20110143553 - Wang; Yaxin ; et al.	2011-06-16
Methods of Fabricating a Barrier Layer Over Interconnect Structures in Atomic Deposition Environments App 20110065273 - YOON; Hyungsuk Alexander ; et al.	2011-03-17
Methods of fabricating a barrier layer with varying composition for copper metallization Grant 7,863,179 - Yoon , et al. January 4, 2	2011-01-04
Methods And Systems For Low Interfacial Oxide Contact Between Barrier And Copper Metallization App 20100267229 - Redeker; Fritz ; et al.	2010-10-21
Apparatus For The Removal Of A Fluorinated Polymer From A Substrate App 20100181025 - Yoon; Hyungsuk Alexander ; et al.	2010-07-22
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 7,749,893 - Redeker , et al. July 6, 2	2010-07-06
Methods For Removing A Metal Oxide From A Substrate App 20100108491 - Yoon; Hyungsuk Alexander ; et al.	2010-05-06
Methods For Removing An Edge Polymer From A Substrate App 20100099265 - YOON; HYUNGSUK ALEXANDER ; et al.	2010-04-22
Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor Grant 7,691,278 - Yoon , et al. April 6, 2	2010-04-06
Methods Of Post-contact Back End Of Line Through-hole Via Integration App 20100044867 - Boyd; John ; et al.	2010-02-25
Apparatus for the removal of a metal oxide from a substrate and methods therefor Grant 7,662,253 - Yoon , et al. February 16, 2	2010-02-16
Apparatus for the removal of an edge polymer from a substrate and methods therefor Grant 7,651,585 - Yoon , et al. January 26, 2	2010-01-26
Apparatus For Integrated Surface Treatment And Deposition For Copper Interconnect App 20090320749 - Yoon; Hyungsuk Alexander ; et al.	2009-12-31
Self assembled monolayer for improving adhesion between copper and barrier layer App 20090304914 - Nalla; Praveen ; et al.	2009-12-10
Methods of post-contact back end of the line through-hole via integration Grant 7,615,480 - Boyd , et al. November 10, 2	2009-11-10
Apparatus and method for integrated surface treatment and deposition for copper interconnect Grant 7,615,486 - Yoon , et al. November 10, 2	2009-11-10
Plasma oxidation and removal of oxidized material Grant 7,540,935 - Kim , et al. June 2, 2	2009-06-02
Apparatus for isolated bevel edge clean and method for using the same App 20090113656 - Yoon; Hyungsuk Alexander ; et al.	2009-05-07
Methods of post-contact back end of line through-hole via integration App 20080315418 - Boyd; John ; et al.	2008-12-25
Methods and apparatuses for three dimensional integrated circuits App 20080315422 - Boyd; John ; et al.	2008-12-25
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal App 20080314756 - Boyd; John ; et al.	2008-12-25
Methods of fabricating electronic devices using direct copper plating App 20080299772 - Yoon; Hyungsuk Alexander ; et al.	2008-12-04
Apparatus And Method For Integrated Surface Treatment And Film Deposition App 20080260967 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Pre And Post Treatment Of Atomic Layer Deposition App 20080260963 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Integrated Surface Treatment And Deposition For Copper Interconnect App 20080260940 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Apparatus And Method For Atomic Layer Deposition App 20080261412 - Yoon; Hyungsuk Alexander ; et al.	2008-10-23
Multiple precursor cyclical deposition system Grant 7,396,565 - Yang , et al. July 8, 2	2008-07-08
Interconnect structure and method of manufacturing a damascene structure App 20080142971 - Dordi; Yezdi ; et al.	2008-06-19
Methods and systems for low interfacial oxide contact between barrier and copper metallization App 20080142972 - Redeker; Fritz ; et al.	2008-06-19
Methods of fabricating a barrier layer with varying composition for copper metallization App 20080102621 - Yoon; Hyungsuk Alexander ; et al.	2008-05-01
Methods and apparatus for barrier interface preparation of copper interconnect App 20080057198 - Yoon; Hyungsuk Alexander ; et al.	2008-03-06
Processes and systems for engineering a barrier surface for copper deposition App 20070292603 - Dordi; Yezdi ; et al.	2007-12-20
Apparatus for the removal of a metal oxide from a substrate and methods therefor App 20070072432 - Yoon; Hyungsuk Alexander ; et al.	2007-03-29
Apparatus for the removal of an edge polymer from a substrate and methods therefor App 20070068899 - Yoon; Hyungsuk Alexander	2007-03-29
Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor App 20070068623 - Kim; Yunsang ; et al.	2007-03-29
Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor App 20070072433 - Yoon; Hyungsuk Alexander ; et al.	2007-03-29
Plasma oxidation and removal of oxidized material App 20060128152 - Kim; Yunsang ; et al.	2006-06-15
CVD TiSiN barrier for copper integration Grant 6,958,296 - Chen , et al. October 25, 2	2005-10-25
Multiple precursor cyclical deposition system Grant 6,846,516 - Yang , et al. January 25, 2	2005-01-25
Multiple precursor cyclical depositon system App 20050008779 - Yang, Michael Xi ; et al.	2005-01-13
Selective deposition of a barrier layer on a metal film Grant 6,809,026 - Yoon , et al. October 26, 2	2004-10-26
CVD TiSiN barrier for copper integration App 20040197492 - Chen, Ling ; et al.	2004-10-07
Metal nitride formation App 20030224217 - Byun, Jeong Soo ; et al.	2003-12-04
Multiple precursor cyclical deposition system App 20030190423 - Yang, Michael Xi ; et al.	2003-10-09
Selective deposition of abarrier layer on a metal film App 20030181035 - Yoon, Hyungsuk Alexander ; et al.	2003-09-25
CVD TiSiN barrier for copper integration Grant 6,596,643 - Chen , et al. July 22, 2	2003-07-22
CVD TiSiN barrier for copper integration App 20030022507 - Chen, Ling ; et al.	2003-01-30
Integrated barrier layer structure for copper contact level metallization App 20020192948 - Chen, Fusen ; et al.	2002-12-19
Deposition of tungsten silicide films App 20020168840 - Hong, Soonil ; et al.	2002-11-14
Deposition of tungsten silicide films App 20020162500 - Hong, Soonil ; et al.	2002-11-07

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