loadpatents
name:-0.0062210559844971
name:-0.0062570571899414
name:-0.00046086311340332
Yoon; BoHan Patent Filings

Yoon; BoHan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoon; BoHan.The latest application filed is for "system and method for directional grinding on backside of a semiconductor wafer".

Company Profile
0.5.4
  • Yoon; BoHan - Pusan KR
  • Yoon; BoHan - Icheon-Si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System and method for directional grinding on backside of a semiconductor wafer
Grant 8,994,196 - Lee , et al. March 31, 2
2015-03-31
Integrated circuit package system with support structure under wire-in-film adhesive
Grant 8,035,211 - Ko , et al. October 11, 2
2011-10-11
System and Method for Directional Grinding on Backside of a Semiconductor Wafer
App 20110101546 - Lee; SungYoon ;   et al.
2011-05-05
Method for directional grinding on backside of a semiconductor wafer
Grant 7,892,072 - Lee , et al. February 22, 2
2011-02-22
Integrated circuit system with a debris trapping system
Grant 7,659,140 - Lee , et al. February 9, 2
2010-02-09
Integrated Circuit Package System With Support Structure Under Wire-in-film Adhesive
App 20090243070 - Ko; WonJun ;   et al.
2009-10-01
System and Method for Directional Grinding on Backside of a Semiconductor Wafer
App 20090068933 - Lee; SungYoon ;   et al.
2009-03-12
Integrated Circuit System With A Debris Trapping System
App 20080242053 - Lee; Taewoo ;   et al.
2008-10-02

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