Yoo; Sehoon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoo; Sehoon.The latest application filed is for "method for filling a wafer via with solder".
- Yoo; Sehoon - Incheon KR
- Yoo; Sehoon - Columbus OH
| Patent | Date |
|---|---|
| Method for filling a wafer via with solder Grant 10,115,635 - Yoo , et al. October 30, 2 | 2018-10-30 |
| Method For Filling A Wafer Via With Solder App 20180301377 - Yoo; Sehoon ; et al. | 2018-10-18 |
| Apparatus And Methods For Filling A Wafer Via With Solder App 20170148678 - Yoo; Sehoon ; et al. | 2017-05-25 |
| Apparatus for filling a wafer via with solder Grant 9,603,254 - Yoo , et al. March 21, 2 | 2017-03-21 |
| Apparatus For Filling A Wafer Via With Solder And Having A Pressure Unit, And Method For Filling A Wafer Via With Solder Using Same App 20140123488 - Yoo; Sehoon ; et al. | 2014-05-08 |
| Method of forming nanostructures on ceramics Grant 7,303,723 - Akbar , et al. December 4, 2 | 2007-12-04 |
| Method of forming nanostructures on ceramics and the ceramics formed App 20040126624 - Akbar, Sheikh A. ; et al. | 2004-07-01 |
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