loadpatents
name:-0.016914129257202
name:-0.0052590370178223
name:-0.00035715103149414
YOO; Jin O Patent Filings

YOO; Jin O

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOO; Jin O.The latest application filed is for "front end module".

Company Profile
0.6.15
  • YOO; Jin O - Suwon-si KR
  • Yoo; Jin O - Gyunggi-do N/A KR
  • Yoo; Jin O - Suwon KR
  • YOO; Jin O. - Hwaseong KR
  • YOO; Jin O - Hwaseong KR
  • YOO; Jin O. - Gyunggi-do KR
  • Yoo; Jin O. - Suwon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Front End Module
App 20200304167 - KWON; Jae Wook ;   et al.
2020-09-24
Semiconductor package and method of manufacturing the same
Grant 9,793,223 - Yoo October 17, 2
2017-10-17
Semiconductor Package And Method Of Manufacturing The Same
App 20170012003 - YOO; Jin O
2017-01-12
Semiconductor package and method of manufacturing the same
Grant 9,508,624 - Yoo November 29, 2
2016-11-29
Package And Method Of Manufacturing Package Thereof
App 20160255726 - YOO; Jin O
2016-09-01
Package and method of manufacturing package thereof
Grant 9,392,697 - Yoo July 12, 2
2016-07-12
Electrostatic Discharge Protection Board
App 20160029479 - YOO; Jin O ;   et al.
2016-01-28
Package And Method Of Manufacturing Package Thereof
App 20150189749 - YOO; Jin O
2015-07-02
Printed Circuit Board Having Inductor Embedded Therein And Manufacturing Method Thereof
App 20150173197 - Cho; Suk Hyeon ;   et al.
2015-06-18
Semiconductor Package And Manufacturing Method Thereof
App 20150004753 - YOO; Jin O.
2015-01-01
Semiconductor package module
Grant 8,558,377 - Yoo October 15, 2
2013-10-15
Semiconductor Package And Method Of Manufacturing The Same
App 20130082367 - YOO; Jin O
2013-04-04
Semiconductor Package And Method Of Manufacturing The Same
App 20130037923 - YOO; Jin O
2013-02-14
Semiconductor Package And Manufacturing Method Thereof
App 20120104571 - YOO; Jin O.
2012-05-03
Semiconductor Package Module
App 20120104572 - YOO; Jin O.
2012-05-03
Stacked semiconductor multi-chip package
App 20060091517 - Yoo; Jin O. ;   et al.
2006-05-04
Connecting structure for USB
App 20030171035 - Yoo, Jin O
2003-09-11

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