YOO; Je Gwang

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOO; Je Gwang.The latest application filed is for "package board and method for manufacturing the same".

Company Profile

0.42.77

YOO; Je Gwang - Suwon-Si KR
YOO; Je Gwang - Suwon KR
Yoo; Je-Gwang - Yongin-si N/A KR
Yoo; Je Gwang - Gyunggi-do N/A KR
Yoo; Je-Gwang - Yongln-si KR
Yoo; Je Gwang - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Board And Method For Manufacturing The Same App 20150351247 - KWON; Kwang Hee ; et al.	2015-12-03
Package Substrate, Package, Package On Package And Manufacturing Method Of Package Substrate App 20150348918 - PARK; Jin Seon ; et al.	2015-12-03
Package Board And Method For Manufacturing The Same App 20150351228 - PARK; Jin Seon ; et al.	2015-12-03
Package Board, Method Of Manufacturing The Same, And Semiconductor Package Using The Same App 20150195905 - KANG; Myung Sam ; et al.	2015-07-09
Method of fabricating cavity capacitor embedded in printed circuit board Grant 8,966,746 - Kim , et al. March 3, 2	2015-03-03
Printed circuit board having electronic components embedded therein Grant 8,942,004 - Hong , et al. January 27, 2	2015-01-27
Method of manufacturing component embedded printed circuit board Grant 8,683,684 - Cho , et al. April 1, 2	2014-04-01
Method of manufacturing printed circuit board Grant 8,592,135 - Mok , et al. November 26, 2	2013-11-26
Printed circuit board and manufacturing method thereof Grant 8,457,450 - Kim , et al. June 4, 2	2013-06-04
Method of manufacturing cooling fin and package substrate with cooling fin Grant 8,377,748 - Lee , et al. February 19, 2	2013-02-19
Electromagnetic bandgap structure and printed circuit board Grant 8,310,840 - Kim , et al. November 13, 2	2012-11-13
Printed circuit board with embedded chip capacitor Grant 8,279,616 - Kim , et al. October 2, 2	2012-10-02
Method Of Manufacturing A Printed Circuit Board App 20120222299 - MOK; Jee Soo ; et al.	2012-09-06
Printed Circuit Board And Manufacturing Method Thereof App 20120199388 - KIM; Joon-Sung ; et al.	2012-08-09
Electromagnetic interference noise reduction board using electromagnetic bandgap structure Grant 8,232,478 - Kim , et al. July 31, 2	2012-07-31
Method Of Manufacturing Printed Circuit Board App 20120148960 - Mok; Jee Soo ; et al.	2012-06-14
Printed circuit board and method of manufacturing the same Grant 8,198,550 - Mok , et al. June 12, 2	2012-06-12
Method of manufacturing a printed circuit board Grant 8,181,339 - Kim , et al. May 22, 2	2012-05-22
Electromagnetic bandgap structure and printed circuit board Grant 8,169,790 - Kim , et al. May 1, 2	2012-05-01
Electromagnetic bandgap structure and printed circuit board Grant 8,158,889 - Kim , et al. April 17, 2	2012-04-17
Printed circuit board Grant 8,159,824 - Cho , et al. April 17, 2	2012-04-17
Printed Circuit Board Having Eletronic Components Embedded Therein App 20120087097 - HONG; Suk Chang ; et al.	2012-04-12
Apparatus for manufacturing printed circuit board Grant 8,151,446 - Mok , et al. April 10, 2	2012-04-10
Circuit board for signal transmission and method of manufacturing the same App 20120080224 - Yoo; Je Gwang ; et al.	2012-04-05
Carrier Member For Transmitting Circuits, Coreless Printed Circuit Board Using The Carrier Member, And Method Of Manufacturing The Same App 20120073865 - Kang; Myung Sam ; et al.	2012-03-29
Method Of Manufacturing Printed Circuit Board Including Landless Via App 20120066902 - Kim; Han ; et al.	2012-03-22
Method of manufacturing component embedded printed circuit board App 20120030940 - Cho; Suk-Hyeon ; et al.	2012-02-09
Method of manufacturing multilayered printed circuit board App 20120005894 - Mok; Jee Soo ; et al.	2012-01-12
Method of manufacturing cooling fin and package substrate with cooling fin App 20110308069 - LEE; Eung Suek ; et al.	2011-12-22
Fabricating method for printed circuit board Grant 8,065,797 - Watanabe , et al. November 29, 2	2011-11-29
Component embedded printed circuit board Grant 8,064,217 - Cho , et al. November 22, 2	2011-11-22
Printed circuit board and manufacturing method thereof Grant 8,056,220 - Kim , et al. November 15, 2	2011-11-15
Method of manufacturing optical waveguide and method of manufacturing package board Grant 8,048,324 - Cho , et al. November 1, 2	2011-11-01
Circuit board with buried circuit pattern App 20110259627 - Jung; Hoe-Ku ; et al.	2011-10-27
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same Grant 8,022,311 - Kim , et al. September 20, 2	2011-09-20
Method of fabricating cavity capacitor embedded in printed circuit board App 20110197409 - Kim; Han ; et al.	2011-08-18
Method of manufacturing a circuit board Grant 7,992,291 - Jung , et al. August 9, 2	2011-08-09
Printed circuit board Grant 7,991,250 - Kim , et al. August 2, 2	2011-08-02
Chip capacitor embedment method App 20110179642 - Kim; Han ; et al.	2011-07-28
Printed circuit board with embedded chip capacitor App 20110180312 - Kim; Han ; et al.	2011-07-28
Printed circuit board with embedded cavity capacitor Grant 7,983,055 - Kim , et al. July 19, 2	2011-07-19
Printed circuit board and manufacturing method thereof Grant 7,947,906 - Lee , et al. May 24, 2	2011-05-24
Method of manufacturing circuit board Grant 7,937,833 - Jung , et al. May 10, 2	2011-05-10
Package board and method for manufacturing thereof Grant 7,903,410 - Cho , et al. March 8, 2	2011-03-08
Optical wiring board having a core App 20110039076 - Kim; Joon-Sung ; et al.	2011-02-17
Method of manufacturing a component-embedded PCB Grant 7,886,433 - Bae , et al. February 15, 2	2011-02-15
Printed circuit board App 20110007999 - Kim; Sang-Hoon ; et al.	2011-01-13
Manufacturing method of bottom substrate of package App 20100255634 - Park; Jung-Hyun ; et al.	2010-10-07
Printed circuit board and manufacturing method thereof Grant 7,809,220 - Kim , et al. October 5, 2	2010-10-05
Circuit Layer Comprising Cnts And Method Of Manufacturing The Same App 20100230146 - LEE; Eung Suek ; et al.	2010-09-16
Electromagnetic interference noise reduction board using electromagnetic bandgap structure App 20100212951 - Kim; Han ; et al.	2010-08-26
Printed circuit board and method of manufacturing the same App 20100175915 - Mok; Jee Soo ; et al.	2010-07-15
Package substrate including solder resist layer having pattern parts and method of fabricating the same App 20100132982 - Cho; Seung Hyun ; et al.	2010-06-03
Method of fabricating multilayer printed circuit board Grant 7,707,715 - Okabe , et al. May 4, 2	2010-05-04
Method of manufacturing printed circuit board Grant 7,697,800 - Cho , et al. April 13, 2	2010-04-13
Printed circuit board including optical waveguide and method of manufacturing the same Grant 7,672,547 - Kim , et al. March 2, 2	2010-03-02
Method of fabricating multilayer printed circuit board App 20100024212 - Okabe; Shuhichi ; et al.	2010-02-04
Printed circuit board and method of manufacturing the same App 20090308650 - Lee; Eung Suek ; et al.	2009-12-17
Printed circuit board and method of manufacturing the same App 20090301767 - Mok; Jee Soo ; et al.	2009-12-10
Printed circuit board including landless via and method of manufacturing the same App 20090294164 - Kim; Han ; et al.	2009-12-03
Conductive Paste Including A Carbon Nanotube And Printed Circuit Board Using The Same App 20090294739 - Lee; Eung-Suek ; et al.	2009-12-03
Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof App 20090294956 - Lee; Eung Suek ; et al.	2009-12-03
Printed circuit board including optical waveguide and method of manufacturing the same App 20090290832 - Kim; Sang Hoon ; et al.	2009-11-26
Multilayered printed circuit board and method of manufacturing the same App 20090250259 - Mok; Jee Soo ; et al.	2009-10-08
Multilayered printed circuit board and method of manufacturing the same App 20090236131 - Mok; Jee Soo ; et al.	2009-09-24
Multilayered printed circuit board and method of manufacturing the same App 20090236130 - Mok; Jee Soo ; et al.	2009-09-24
Package board, semiconductor package, and fabricating method thereof Grant 7,592,708 - Kim , et al. September 22, 2	2009-09-22
Method of manufacturing printed circuit board App 20090223044 - Cho; Han Seo ; et al.	2009-09-10
Printed circuit board and manufacturing method thereof App 20090208164 - Kim; Sang-Hoon ; et al.	2009-08-20
Printed circuit board and manufacturing method thereof App 20090173531 - Kim; Joon-Sung ; et al.	2009-07-09
Printed circuit board and manufacturing method thereof Grant 7,546,002 - Cho , et al. June 9, 2	2009-06-09
Method of manufacturing optical board App 20090133444 - Kim; Sang-Hoon ; et al.	2009-05-28
Optical wiring board and manufacturing method thereof App 20090130390 - Kim; Joon-Sung ; et al.	2009-05-21
Conductive Paste And Printed Circuit Board Using The Same App 20090114425 - LEE; Eung-Suek ; et al.	2009-05-07
Optical printed circuit board and fabricating method thereof Grant 7,529,439 - Kim , et al. May 5, 2	2009-05-05
Printed circuit board and manufacturing method thereof App 20090107709 - MOK; Jee-Soo ; et al.	2009-04-30
Printed circuit board and manufacturing method thereof App 20090100671 - Kim; Sang-Hoon ; et al.	2009-04-23
Printed circuit board and manufacturing method thereof App 20090103860 - Kim; Sang-Hoon ; et al.	2009-04-23
Printed circuit board App 20090084584 - Cho; Han-Seo ; et al.	2009-04-02
Method of interconnecting layers of a printed circuit board App 20090083975 - Lee; Eung-Suek ; et al.	2009-04-02
Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor App 20090084591 - Kim; Han ; et al.	2009-04-02
Printed circuit board with embedded cavity capacitor App 20090086451 - Kim; Han ; et al.	2009-04-02
Printed circuit board with embedded chip capacitor and chip capacitor embedment method App 20090085691 - Kim; Han ; et al.	2009-04-02
Method of manufacturing optical waveguide and method of manufacturing package board App 20090072419 - Cho; Han-Seo ; et al.	2009-03-19
Optical waveguide, package board having the same, and manufacturing method thereof Grant 7,505,661 - Cho , et al. March 17, 2	2009-03-17
Method of fabricating multilayer printed circuit board App 20090056119 - Okabe; Shuhichi ; et al.	2009-03-05
Apparatus and method for manufacturing printed circuit board App 20090049683 - Mok; Jee-Soo ; et al.	2009-02-26
Electromagnetic bandgap structure and printed circuit board App 20090039984 - Kim; Han ; et al.	2009-02-12
Electromagnetic bandgap structure and printed curcuit board App 20090038840 - Kim; Han ; et al.	2009-02-12
Printed circuit board and manufacturing method thereof Grant 7,489,839 - Kim , et al. February 10, 2	2009-02-10
Optical waveguide, package board having the same, and manufacturing method thereof App 20090028494 - Cho; Han-Seo ; et al.	2009-01-29
Heat-releasing printed circuit board and manufacturing method thereof App 20090017275 - Lee; Eung-Suek ; et al.	2009-01-15
Electromagnetic bandgap structure and printed circuit board App 20080314630 - Kim; Han ; et al.	2008-12-25
Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same App 20080264684 - Kang; Myung Sam ; et al.	2008-10-30
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same App 20080212299 - Kim; Tae Eui ; et al.	2008-09-04
Package board and method for manufacturing thereof App 20080198552 - Cho; Suk-Hyeon ; et al.	2008-08-21
Component-embedded PCB and manufacturing method thereof App 20080171172 - Bae; Won-Cheol ; et al.	2008-07-17
Method of manufacturing printed circuit board App 20080115355 - Park; Jung-Hyun ; et al.	2008-05-22
Printed circuit board and manufacturing method thereof App 20080118200 - Kim; Sang-Hoon ; et al.	2008-05-22
Method of manufacturing a component-embedded printed circuit board App 20080115349 - Kim; Seung-Gu ; et al.	2008-05-22
Method of manufacturing circuit board App 20080098597 - Jung; Hoe-Ku ; et al.	2008-05-01
Circuit board and manufacturing method thereof App 20080101045 - Jung; Hoe-Ku ; et al.	2008-05-01
Fabricating method for printed circuit board App 20080052905 - Watanabe; Ryoichi ; et al.	2008-03-06
Method of manufacturing as component embedded printed circuit board App 20080055863 - Cho; Suk-Hyeon ; et al.	2008-03-06
Printed circuit board and manufacturing method thereof App 20080044129 - Cho; Han Seo ; et al.	2008-02-21
Optical printed circuit board and fabricating method thereof App 20080037929 - Kim; Joon-Sung ; et al.	2008-02-14
Bottom substrate of package on package and manufacturing method thereof App 20080006942 - Park; Jung-Hyun ; et al.	2008-01-10
Printed circuit board and method of manufacturing the same App 20080000680 - Cho; Suk Hyeon ; et al.	2008-01-03
Printed circuit board for package of electronic components and manufacturing method thereof App 20070290344 - Kang; Myung-Sam ; et al.	2007-12-20
Manufacturing method of a package substrate App 20070281390 - Kang; Myung-Sam ; et al.	2007-12-06
Solder bonding structure using bridge type pattern App 20070126126 - Kim; Seung Gu ; et al.	2007-06-07
Package board, semiconductor package, and fabricating method thereof App 20070080469 - Kim; Seung-Gu ; et al.	2007-04-12
Printed circuit board and manufacturing method thereof App 20070074900 - Lee; Doo-Hwan ; et al.	2007-04-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.