loadpatents
Patent applications and USPTO patent grants for YOO; JAEKYUNG.The latest application filed is for "semiconductor package including mold layer and manufacturing method thereof".
Patent | Date |
---|---|
Semiconductor Package Including Mold Layer And Manufacturing Method Thereof App 20220293563 - KO; YEONGKWON ;   et al. | 2022-09-15 |
Semiconductor Package App 20220020701 - KO; Yeongkwon ;   et al. | 2022-01-20 |
Semiconductor Package Including Underfill And Method For Manufacturing The Same App 20220013474 - YOO; Jaekyung ;   et al. | 2022-01-13 |
Semiconductor Package And Method Of Fabricating The Same App 20210366876 - YOO; Jaekyung ;   et al. | 2021-11-25 |
Semiconductor Packages And Methods Of Manufacturing The Same App 20210028098 - YOO; JAEKYUNG ;   et al. | 2021-01-28 |
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