Yoo; Hyun Jee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoo; Hyun Jee.The latest application filed is for "encapsulation film".

Company Profile

42.71.78

Yoo; Hyun Jee - Daejeon KR
YOO; Hyun Jee - Hyun Jee KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure-sensitive adhesive composition Grant 11,370,942 - Cho , et al. June 28, 2	2022-06-28
Encapsulation film Grant 11,342,534 - Moon , et al. May 24, 2	2022-05-24
Encapsulation film and method for encapsulating organic electronic device using same Grant 11,223,028 - Yoo , et al. January 11, 2	2022-01-11
Adhesive and method of encapsulating organic electronic device using the same Grant 11,142,669 - Yoo , et al. October 12, 2	2021-10-12
Encapsulation Film App 20210226157 - Mok; Yeong Bong ; et al.	2021-07-22
Organic Electronic Device Including Encapsulation Layer App 20210202909 - Yoo; Hyun Jee ; et al.	2021-07-01
Encapsulation film Grant 10,937,990 - Yoo , et al. March 2, 2	2021-03-02
Encapsulation film Grant 10,910,594 - Lee , et al. February 2, 2	2021-02-02
Encapsulation film Grant 10,864,706 - Kim , et al. December 15, 2	2020-12-15
Encapsulation Film App 20200381664 - BAE; Kyung Yul ; et al.	2020-12-03
Temperature-Changeable Adhesive Sheet and Temperature-Changeable Adhesive Sheet Manufacturing Method Using Same App 20200325361 - Lee; Hui Je ; et al.	2020-10-15
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same Grant 10,752,814 - Park , et al. A	2020-08-25
Encapsulation film and organic electronic device including the same Grant 10,720,600 - Moon , et al.	2020-07-21
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same App 20200220091 - YOO; Hyun Jee ; et al.	2020-07-09
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same Grant 10,683,440 - Cho , et al.	2020-06-16
Encapsulation film Grant 10,680,199 - Kim , et al.	2020-06-09
Adhesive composition, adhesive film comprising same, and organic electronic device comprising same Grant 10,647,890 - Bae , et al.	2020-05-12
Encapsulation Film App 20200127230 - MOON; Jung Ok ; et al.	2020-04-23
Adhesive film Grant 10,626,307 - Yoo , et al.	2020-04-21
Adhesive film and sealing product for organic electronic device using same Grant 10,626,245 - Lee , et al.	2020-04-21
Adhesive and method of encapsulating organic electronic device using the same Grant 10,622,573 - Yoo , et al.	2020-04-14
Encapsulation film Grant 10,593,908 - Moon , et al.	2020-03-17
Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same Grant 10,570,321 - Cho , et al. Feb	2020-02-25
Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns Grant 10,522,786 - Yoo , et al. Dec	2019-12-31
Pressure-sensitive Adhesive Composition App 20190382632 - CHO; Yoon Gyung ; et al.	2019-12-19
Display device Grant 10,497,904 - Kim , et al. De	2019-12-03
Curable composition Grant 10,457,842 - Cho , et al. Oc	2019-10-29
Adhesive film and organic electronic device comprising the same Grant 10,442,960 - Bae , et al. Oc	2019-10-15
Pressure-sensitive adhesive composition Grant 10,435,596 - Cho , et al. O	2019-10-08
Pressure-sensitive Adhesive Film And Method Of Manufacturing Organic Electronic Device Using The Same App 20190270916 - CHO; Yoon Gyung ; et al.	2019-09-05
Encapsulation film and method for encapsulating organic electronic device using same Grant 10,403,850 - Yoo , et al. Sep	2019-09-03
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same Grant 10,392,536 - Bae , et al. A	2019-08-27
Organic electronic device Grant 10,385,237 - Bae , et al. A	2019-08-20
Pressure-sensitive Adhesive Composition, Pressure-sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device App 20190241773 - Cho; Yoon Gyung ; et al.	2019-08-08
Encapsulation Film And Method For Encapsulating Organic Electronic Device Using Same App 20190229292 - YOO; Hyun Jee ; et al.	2019-07-25
Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same Grant 10,351,738 - Bae , et al. July 16, 2	2019-07-16
Encapsulation film Grant 10,355,239 - Yoo , et al. July 16, 2	2019-07-16
Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same Grant 10,336,917 - Cho , et al.	2019-07-02
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same Grant 10,308,842 - Cho , et al.	2019-06-04
Encapsulation Film App 20190157612 - YOO; Hyun Jee ; et al.	2019-05-23
Pressure Sensitive Adhesive Composition, Pressure Sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same App 20190127612 - PARK; Sang Min ; et al.	2019-05-02
Encapsulation Film App 20190123299 - LEE; Jung Woo ; et al.	2019-04-25
Encapsulation Film App 20190115562 - MOON; Jung Ok ; et al.	2019-04-18
Encapsulation Film App 20190077120 - KIM; Hyun Suk ; et al.	2019-03-14
Adhesive film Grant 10,227,514 - Yoo , et al.	2019-03-12
Adhesive Film And Sealing Product For Organic Electronic Device Using Same App 20190071553 - LEE; Seung Min ; et al.	2019-03-07
Organic Electronic Device App 20190074480 - YOO; Hyun Jee ; et al.	2019-03-07
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same Grant 10,202,525 - Park , et al. Feb	2019-02-12
Encapsulation Film And Organic Electronic Device Comprising The Same App 20190019987 - CHOI; Ban Seok ; et al.	2019-01-17
Encapsulation film and organic electronic device comprising the same Grant 10,181,577 - Choi , et al. Ja	2019-01-15
Display Device (amended) App 20180366684 - KIM; Hyun Suk ; et al.	2018-12-20
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same App 20180342687 - YOO; Hyun Jee ; et al.	2018-11-29
Method for manufacturing electronic device Grant 10,141,543 - Cho , et al. Nov	2018-11-27
Encapsulation film with light absorbing material Grant 10,135,022 - Yoo , et al. November 20, 2	2018-11-20
Adhesive film and product for encapsulating organic electronic device using same Grant 10,125,292 - Lee , et al. November 13, 2	2018-11-13
Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns Grant 10,103,352 - Yoo , et al. October 16, 2	2018-10-16
Encapsulation film and organic electronic device comprising the same Grant 10,103,353 - Cho , et al. October 16, 2	2018-10-16
Adhesive film and sealing product for organic electronic device using same Grant 10,093,785 - Lee , et al. October 9, 2	2018-10-09
Encapsulation film and organic electronic device comprising the same Grant 10,096,797 - Choi , et al. October 9, 2	2018-10-09
Encapsulation film Grant 10,074,827 - Yoo , et al. September 11, 2	2018-09-11
Adhesive and method of encapsulating organic electronic device using the same Grant 10,062,855 - Yoo , et al. August 28, 2	2018-08-28
Encapsulation composition (as amended) Grant 10,050,204 - Lee , et al. August 14, 2	2018-08-14
Adhesive Film App 20180223141 - YOO; Hyun Jee ; et al.	2018-08-09
Encapsulation Film App 20180190937 - KIM; Hyun Suk ; et al.	2018-07-05
Adhesive Film And Organic Electronic Device Comprising The Same App 20180171181 - BAE; Kyung Yul ; et al.	2018-06-21
Organic Electronic Device App 20180171179 - BAE; Kyung Yul ; et al.	2018-06-21
Adhesive Composition, Adhesive Film Comprising Same, And Organic Electronic Device Comprising Same App 20180171188 - BAE; Kyung Yul ; et al.	2018-06-21
Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same Grant 9,966,562 - Cho , et al. May 8, 2	2018-05-08
Photocurable adhesive film for organic electronic device seal, organic electronic device and method for sealing same Grant 9,957,426 - Cho , et al. May 1, 2	2018-05-01
Encapsulant film Grant 9,923,169 - Yoo , et al. March 20, 2	2018-03-20
Encapsulation film Grant 9,871,224 - Kim , et al. January 16, 2	2018-01-16
Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same Grant 9,803,112 - Yoo , et al. October 31, 2	2017-10-31
Encapsulation film Grant 9,806,293 - Yoo , et al. October 31, 2	2017-10-31
Encapsulation film and method for encapsulating organic electronic device using same Grant 9,806,287 - Yoo , et al. October 31, 2	2017-10-31
Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device Grant 9,793,103 - Yoo , et al. October 17, 2	2017-10-17
Composition for encapsulation film, encapsulation film, and electronic device comprising the same Grant 9,768,386 - Shim , et al. September 19, 2	2017-09-19
ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE COMPRISING THE SAME (As Amended) App 20170222183 - CHO; Yoon Gyung ; et al.	2017-08-03
Encapsulation film Grant 9,698,378 - Cho , et al. July 4, 2	2017-07-04
Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same Grant 9,695,345 - Yoo , et al. July 4, 2	2017-07-04
Encapsulation film Grant 9,698,379 - Yoo , et al. July 4, 2	2017-07-04
Encapsulation Film App 20170186997 - YOO; Hyun Jee ; et al.	2017-06-29
ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE INCLUDING THE SAME( As Amended) App 20170170427 - YOO; Hyun Jee ; et al.	2017-06-15
ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE COMPRISING THE SAME (As Amended) App 20170166715 - CHOI; Ban Seok ; et al.	2017-06-15
ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE INCLUDING THE SAME (As Amended) App 20170170426 - MOON; Jung Ok ; et al.	2017-06-15
Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device Grant 9,659,763 - Yoo , et al. May 23, 2	2017-05-23
Encapsulation Film App 20170077450 - Kim; Hyun Suk ; et al.	2017-03-16
Pressure-sensitive Adhesive Composition App 20170077440 - YOO; Hyun Jee ; et al.	2017-03-16
Pressure-sensitive Adhesive Composition App 20170051184 - YOO; Hyun Jee ; et al.	2017-02-23
Adhesive film and method of encapsulating organic electronic device Grant 9,577,214 - Yoo , et al. February 21, 2	2017-02-21
Encapsulation Film App 20170044405 - YOO; Hyun Jee ; et al.	2017-02-16
Encapsulation Film App 20170040570 - KIM; Hyun Suk ; et al.	2017-02-09
Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film Grant 9,548,473 - Yoo , et al. January 17, 2	2017-01-17
Adhesive film Grant 9,422,460 - Yoo , et al. August 23, 2	2016-08-23
Adhesive film Grant 9,391,293 - Cho , et al. July 12, 2	2016-07-12
ENCAPSULANT FILM (As Amended) App 20160155987 - YOO; Hyun Jee ; et al.	2016-06-02
COMPOSITION FOR ENCAPSULATION FILM, ENCAPSULATION FILM, AND ELECTRONIC DEVICE COMPRISING THE SAME (As Amended) App 20160149131 - SHIM; Jung Sup ; et al.	2016-05-26
PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME (As Amended) App 20160137887 - YOO; Hyun Jee ; et al.	2016-05-19
Adhesive film Grant 9,343,696 - Yoo , et al. May 17, 2	2016-05-17
Adhesive film and sealing method for organic electronic device using same Grant 9,343,697 - Shim , et al. May 17, 2	2016-05-17
Adhesive film and method for encapsulating organic electronic device using same Grant 9,343,702 - Bae , et al. May 17, 2	2016-05-17
Organic Electronic Device App 20160133872 - YOO; Hyun Jee ; et al.	2016-05-12
Method Of Evaluating Reliable Life Span Of Encapsulant Film And Device For Evaluating Reliability Of Said Film App 20160131599 - YOO; Hyun Jee ; et al.	2016-05-12
Encapsulation Film And Method For Encapsulating Organic Electronic Device Using Same App 20160118620 - YOO; Hyun Jee ; et al.	2016-04-28
Encapsulation Film And Method For Encapsulating Organic Electronic Device Using Same App 20160093830 - YOO; Hyun Jee ; et al.	2016-03-31
Pressure-sensitive Adhesive Film And Method Of Manufacturing Organic Electronic Device Using The Same App 20160046841 - CHO; Yoon Gyung ; et al.	2016-02-18
Pressure-sensitive Adhesive Composition, Pressure-sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same App 20150376468 - CHO; Yoon Gyung ; et al.	2015-12-31
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE FILM, AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME (As amended) App 20150376469 - BAE; Kyung Yul ; et al.	2015-12-31
Pressure-sensitive Adhesive Film And Method Of Manufacturing Organic Electronic Device Using The Same App 20150368523 - BAE; Kyung Yul ; et al.	2015-12-24
Curable Composition App 20150368528 - CHO; Yoon Gyung ; et al.	2015-12-24
Encapsulation Composition (as Amended) App 20150357570 - LEE; Seung Min ; et al.	2015-12-10
Pressure-sensitive Adhesive Composition App 20150329747 - CHO; Yoon Gyung ; et al.	2015-11-19
Pressure Sensitive Adhesive Composition, Pressure Sensitive Adhesive Film, And Method Of Manufacturing Organic Electronic Device Using The Same App 20150299523 - PARK; Sang Min ; et al.	2015-10-22
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same App 20150287940 - YOO; Hyun Jee ; et al.	2015-10-08
Adhesive Film App 20150284595 - YOO; Hyun Jee ; et al.	2015-10-08
Adhesive and method of encapsulating organic electronic device using the same Grant 9,105,648 - Yoo , et al. August 11, 2	2015-08-11
Encapsulation Film App 20150188085 - YOO; Hyun Jee ; et al.	2015-07-02
Adhesive Film And Method For Encapsulating Organic Electronic Device Using Same App 20150144932 - BAE; Kyung Yul ; et al.	2015-05-28
Organic light emitting device comprising encapsulating structure Grant 9,035,545 - Jeong , et al. May 19, 2	2015-05-19
Method Of Manufacturing Organic Electronic Device App 20150079726 - CHO; Yoon Gyung ; et al.	2015-03-19
Adhesive Film And Sealing Method For Organic Electronic Device Using Same App 20150060836 - SHIM; Jung Sup ; et al.	2015-03-05
Adhesive Film And Sealing Product For Organic Electronic Device Using Same App 20150048356 - LEE; Seung Min ; et al.	2015-02-19
Adhesive Film And Product For Encapsulating Organic Electronic Device Using Same App 20150034940 - LEE; Seung Min ; et al.	2015-02-05
Pressure-sensitive Adhesive Composition App 20140377554 - CHO; Yoon Gyung ; et al.	2014-12-25
Adhesive Film App 20140332782 - YOO; Hyun Jee ; et al.	2014-11-13
Photocurable Adhesive Film For Organic Electronic Device Seal, Organic Electronic Device, And Method For Sealing Same App 20140319497 - CHO; Yoon Gyung ; et al.	2014-10-30
Method For Manufacturing Electornic Device App 20140318707 - CHO; Yoon Gyung ; et al.	2014-10-30
Encapsulation Film App 20140319999 - CHO; Yoon Gyung ; et al.	2014-10-30
Adhesive And Method Of Encapsulating Organic Electronic Device Using The Same App 20140264302 - YOO; Hyun Jee ; et al.	2014-09-18
Photocurable Adhesive Film For Organic Electronic Device Seal, Organic Electronic Device And Method For Sealing Same App 20140235742 - CHO; Yoon Gyung ; et al.	2014-08-21
Encapsulation Film App 20140217621 - YOO; Hyun Jee ; et al.	2014-08-07
Adhesive film and method of encapsulating organic electrode device using the same Grant 8,742,411 - Yoo , et al. June 3, 2	2014-06-03
Adhesive Film App 20140110699 - Cho; Yoon Gyung ; et al.	2014-04-24
Adhesive Film And Method Of Encapsulating Organic Electronic Device App 20140091296 - YOO; Hyun Jee ; et al.	2014-04-03
Epoxy-based Composition, Ashesive Film, Dicing Die-bonding Film And Semiconductor Device App 20130281571 - YOO; Hyun Jee ; et al.	2013-10-24
Adhesive Film App 20130251989 - Yoo; Hyun Jee ; et al.	2013-09-26
Dicing die bonding film and dicing method Grant 8,541,289 - Hong , et al. September 24, 2	2013-09-24
Adhesive Film And Method Of Encapsulating Organic Electrode Device Using The Same App 20130240862 - Yoo; Hyun Jee ; et al.	2013-09-19
Organic Light Emitting Device Comprising Encapsulating Structure App 20130207093 - Jeong; Kwang Jin ; et al.	2013-08-15
Adhesive film, dicing die bonding film and semiconductor device using the same Grant 8,207,616 - Hong , et al. June 26, 2	2012-06-26
Acrylic Composition For Optical Members, Protective Film For Optical Members, Polarizing Plate, And Liquid Crystal Display App 20110109849 - Yoo; Hyun Jee ; et al.	2011-05-12
Epoxy-based Composition, Adhesive Film, Dicing Die-bonding Film And Semiconductor Device App 20110111218 - Yoo; Hyun Jee ; et al.	2011-05-12
Dicing Die Bonding Film Having Excellent Burr Property And Reliability And Semiconductor Device Using The Same App 20110037180 - Yoo; Hyun Jee ; et al.	2011-02-17
Adhesive Film, Dicing Die Bonding Film And Semiconductor Device Using The Same App 20100289158 - Hong; Jong Wan ; et al.	2010-11-18
Dicing Die Bonding Film And Dicing Method App 20100291739 - Hong; Jong Wan ; et al.	2010-11-18