YOO; Hyein

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOO; Hyein.The latest application filed is for "thermal conductive film".

Company Profile

2.7.10

YOO; Hyein - Suwon-si KR
Yoo; Hyein - Pyeongtaek-si KR
Yoo; Hyein - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal Conductive Film App 20220246491 - LEE; Joungphil ; et al.	2022-08-04
Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same Grant 11,355,413 - Lee , et al. June 7, 2	2022-06-07
Semiconductor device having stacked semiconductor chips and method for fabricating the same Grant 10,923,465 - Chang , et al. February 16, 2	2021-02-16
Adhesive Film, Semiconductor Apparatus Using The Same, And Semiconductor Package Including The Same App 20200211920 - LEE; Joungphil ; et al.	2020-07-02
Semiconductor Device Having Stacked Semiconductor Chips And Method For Fabricating The Same App 20190273075 - Chang; Won-Gi ; et al.	2019-09-05
Semiconductor device having stacked semiconductor chips and method for fabricating the same Grant 10,354,985 - Chang , et al. July 16, 2	2019-07-16
Semiconductor package having mold layer with curved corner and method of fabricating same Grant 10,147,713 - Yoo , et al. De	2018-12-04
Method of fabricating a fan-out panel level package and a carrier tape film therefor Grant 10,115,613 - Chang , et al. October 30, 2	2018-10-30
Semiconductor Package And Method Of Fabricating Same App 20180158810 - YOO; Hyein ; et al.	2018-06-07
Method of fabricating a semiconductor package having mold layer with curved corner Grant 9,929,131 - Yoo , et al. March 27, 2	2018-03-27
Semiconductor Device Having Stacked Semiconductor Chips And Method For Fabricating The Same App 20170365591 - CHANG; WON-GI ; et al.	2017-12-21
Semiconductor Packages App 20170358535 - YOO; Hyein ; et al.	2017-12-14
Method Of Fabricating A Fan-out Panel Level Package And A Carrier Tape Film Therefor App 20170358467 - CHANG; Won-Gi ; et al.	2017-12-14
Nanostructured hybrid particle, manufacturing method thereof, and device including the nanostructured hybrid particle Grant 9,842,962 - Woo , et al. December 12, 2	2017-12-12
Method Of Fabricating A Semiconductor Package App 20170179098 - YOO; Hyein ; et al.	2017-06-22
Nanostructured Hybrid Particle, Manufacturing Method Thereof, And Device Including The Nanostructured Hybrid Particle App 20160300981 - WOO; Kyoungja ; et al.	2016-10-13

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.