Yoo; Chan H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoo; Chan H..The latest application filed is for "interposers for microelectronic devices".

Company Profile

48.29.48

Yoo; Chan H. - Boise ID
Yoo; Chan H. - San Jose CA
Yoo; Chan H. - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems Grant 11,444,067 - Fay , et al. September 13, 2	2022-09-13
Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities Grant 11,416,437 - Kinsley , et al. August 16, 2	2022-08-16
Interposers For Microelectronic Devices App 20220254723 - Fay; Owen ; et al.	2022-08-11
Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer Grant 11,410,981 - Yoo , et al. August 9, 2	2022-08-09
Memory device interface and method Grant 11,386,004 - Keeth , et al. July 12, 2	2022-07-12
Three-dimensional Stacking Semiconductor Assemblies And Methods Of Manufacturing The Same App 20220208736 - Fay; Owen R. ; et al.	2022-06-30
Dual Sided Fan-out Package Having Low Warpage Across All Temperatures App 20220149014 - Yoo; Chan H. ; et al.	2022-05-12
Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same Grant 11,309,285 - Fay , et al. April 19, 2	2022-04-19
Tubular Heat Spreaders For Memory Modules And Memory Modules Incorporating The Same App 20220071061 - Kinsley; Thomas H. ; et al.	2022-03-03
Interposers for microelectronic devices Grant 11,264,332 - Fay , et al. March 1, 2	2022-03-01
Semiconductor Assemblies Including Thermal Circuits And Methods Of Manufacturing The Same App 20220059508 - Yoo; Chan H. ; et al.	2022-02-24
Low Cost Three-dimensional Stacking Semiconductor Assemblies App 20220044998 - Fay; Owen R. ; et al.	2022-02-10
Dual sided fan-out package having low warpage across all temperatures Grant 11,239,206 - Yoo , et al. February 1, 2	2022-02-01
Substrates For Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same App 20210407882 - Chun; Hyunsuk ; et al.	2021-12-30
Tubular heat spreaders for memory modules and memory modules incorporating the same Grant 11,206,749 - Kinsley , et al. December 21, 2	2021-12-21
Semiconductor Devices With Flexible Reinforcement Structure App 20210384043 - Fay; Owen R. ; et al.	2021-12-09
Memory Modules And Memory Packages Including Graphene Layers For Thermal Management App 20210367057 - Yoo; Chan H. ; et al.	2021-11-25
Semiconductor assemblies including thermal circuits and methods of manufacturing the same Grant 11,171,118 - Yoo , et al. November 9, 2	2021-11-09
Memory Device Interface And Method App 20210318956 - Keeth; Brent ; et al.	2021-10-14
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20210272932 - Yoo; Chan H. ; et al.	2021-09-02
Memory modules and memory packages including graphene layers for thermal management Grant 11,081,565 - Yoo , et al. August 3, 2	2021-08-03
Semiconductor Device App 20210202337 - Chun; Hyunsuk ; et al.	2021-07-01
Stacked Interposer Structures, Microelectronic Device Assemblies Including Same, And Methods Of Fabrication, And Related Electronic Systems App 20210183842 - Fay; Owen R. ; et al.	2021-06-17
Semiconductor device having laterally offset stacked semiconductor dies Grant 11,037,910 - Yoo , et al. June 15, 2	2021-06-15
Microelectronic Device Assemblies And Packages And Related Methods And Systems App 20210118852 - Fay; Owen R. ; et al.	2021-04-22
Semiconductor Assemblies Including Vertically Integrated Circuits And Methods Of Manufacturing The Same App 20210090969 - Yoo; Chan H. ; et al.	2021-03-25
Redistribution Layers Including Reinforcement Structures And Related Semiconductor Device Packages, Systems And Methods App 20210074623 - Chun; Hyunsuk ; et al.	2021-03-11
Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board Grant 10,943,860 - Yoo , et al. March 9, 2	2021-03-09
Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer App 20210050339 - YOO; Chan H. ; et al.	2021-02-18
Memory Modules And Memory Packages Including Graphene Layers For Thermal Management App 20210036125 - Yoo; Chan H. ; et al.	2021-02-04
Tubular Heat Spreaders For Memory Modules And Memory Modules Incorporating The Same App 20210037679 - Kinsley; Thomas H. ; et al.	2021-02-04
Methods For Memory Power Management And Memory Devices And Systems Employing The Same App 20210035617 - Stave; Eric J. ; et al.	2021-02-04
Semiconductor Assemblies Including Vertically Integrated Circuits And Methods Of Manufacturing The Same App 20210005526 - Yoo; Chan H. ; et al.	2021-01-07
Semiconductor Assemblies Including Thermal Circuits And Methods Of Manufacturing The Same App 20210005575 - Yoo; Chan H. ; et al.	2021-01-07
Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same Grant 10,872,835 - Yoo , et al. December 22, 2	2020-12-22
Three-dimensional Stacking Semiconductor Assemblies And Methods Of Manufacturing The Same App 20200395337 - Fay; Owen R. ; et al.	2020-12-17
Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods Grant 10,861,782 - Chun , et al. December 8, 2	2020-12-08
Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer Grant 10,840,229 - Yoo , et al. November 17, 2	2020-11-17
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20200350293 - Yoo; Chan H. ; et al.	2020-11-05
Dual Sided Fan-out Package Having Low Warpage Across All Temperatures App 20200321317 - Yoo; Chan H. ; et al.	2020-10-08
Interposer, Microelectronic Device Assembly Including Same And Methods Of Fabrication App 20200303363 - Yoo; Chan H. ; et al.	2020-09-24
Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer Grant 10,770,398 - Yoo , et al. Sep	2020-09-08
Memory Device Interface And Method App 20200272564 - Keeth; Brent ; et al.	2020-08-27
Memory Device Interface And Method App 20200272560 - Keeth; Brent ; et al.	2020-08-27
Dual sided fan-out package having low warpage across all temperatures Grant 10,714,456 - Yoo , et al.	2020-07-14
Memory Devices, Modules And Systems Having Memory Devices With Varying Physical Dimensions, Memory Formats, And Operational Capa App 20200201807 - Kinsley; Thomas H. ; et al.	2020-06-25
Interposers For Microelectronic Devices App 20200168554 - Fay; Owen ; et al.	2020-05-28
Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer App 20200144189 - YOO; Chan H. ; et al.	2020-05-07
Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer App 20200144241 - YOO; Chan H. ; et al.	2020-05-07
Thrumold post package with reverse build up hybrid additive structure Grant 10,593,568 - Yoo , et al.	2020-03-17
Semiconductor device modules including a die electrically connected to posts and related methods Grant 10,586,780 - Pachamuthu , et al.	2020-03-10
Redistribution Layers Including Reinforcement Structures And Related Semiconductor Device Packages, Systems And Methods App 20200066625 - Chun; Hyunsuk ; et al.	2020-02-27
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control App 20190304860 - Yoo; Chan H. ; et al.	2019-10-03
Stress tuned stiffeners for micro electronics package warpage control Grant 10,396,003 - Yoo , et al. A	2019-08-27
Semiconductor Device Modules And Related Methods App 20190252342 - Pachamuthu; Ashok ; et al.	2019-08-15
Dual Sided Fan-out Package Having Low Warpage Across All Temperatures App 20190237438 - Yoo; Chan H. ; et al.	2019-08-01
Semiconductor Device with Flexible Circuit for Enabling Non-destructive Attaching and Detaching of Device to System Board App 20190214331 - Yoo; Chan H. ; et al.	2019-07-11
Device module having a plurality of dies electrically connected by posts Grant 10,325,874 - Pachamuthu , et al.	2019-06-18
Dual sided fan-out package having low warpage across all temperatures Grant 10,304,805 - Yoo , et al.	2019-05-28
Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board Grant 10,276,487 - Yoo , et al.	2019-04-30
Stress Tuned Stiffeners for Micro Electronics Package Warpage Control App 20190115270 - Yoo; Chan H. ; et al.	2019-04-18
Semiconductor Device With Flexible Circuit For Enabling Non-destructive Attaching And Detaching Of Device To System Board App 20190115286 - Yoo; Chan H. ; et al.	2019-04-18
Semiconductor Device App 20190067145 - Chun; Hyunsuk ; et al.	2019-02-28
High-yield Semiconductor Device Modules And Related Systems App 20190067233 - Pachamuthu; Ashok ; et al.	2019-02-28
Semiconductor Device Having Laterally Offset Stacked Semiconductor Dies App 20190067248 - Yoo; Chan H. ; et al.	2019-02-28
Thrumold Post Package With Reverse Build Up Hybrid Additive Structure App 20190067038 - Yoo; Chan H. ; et al.	2019-02-28
Dual Sided Fan-out Package Having Low Warpage Across All Temperatures App 20190067247 - Yoo; Chan H. ; et al.	2019-02-28
Hybrid Additive Structure Stackable Memory Die Using Wire Bond App 20190067034 - Pachamuthu; Ashok ; et al.	2019-02-28
Methods Of Making Semiconductor Device Modules With Increased Yield App 20190035755 - Pachamuthu; Ashok ; et al.	2019-01-31
Methods of making semiconductor device modules with increased yield Grant 10,192,843 - Pachamuthu , et al. Ja	2019-01-29
Thrumold post package with reverse build up hybrid additive structure Grant 10,103,038 - Yoo , et al. October 16, 2	2018-10-16
Backside via formation prior to die attachment App 20070275540 - Hackitt; Dale A. ; et al.	2007-11-29
Vertical taper waveguide Grant 6,973,236 - So , et al. December 6, 2	2005-12-06
Vertical taper waveguide App 20040120674 - So, Daniel W. ; et al.	2004-06-24
Method for controlling overload of main processor of distributed switching system with hierarchy structure Grant 5,574,770 - Yoo , et al. November 12, 1	1996-11-12
Method for controlling overload of distributed processors of full electronic switching system Grant 5,513,255 - Yoo , et al. April 30, 1	1996-04-30
Method for controlling overload in centralized and distributed operating hybrid switching system Grant 5,513,257 - Yoo , et al. April 30, 1	1996-04-30

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