Yoo; Chan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoo; Chan.The latest application filed is for "semiconductor device assembly with through-package interconnect and associated systems, devices, and methods".

Company Profile

5.8.10

Yoo; Chan - Boise ID
Yoo; Chan - Daejeon KR
Yoo; Chan - Morgan Hill CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods Grant 11,456,286 - Yoo , et al. September 27, 2	2022-09-27
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20200243493 - Yoo; Chan ; et al.	2020-07-30
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods Grant 10,615,154 - Yoo , et al.	2020-04-07
Interconnects For A Multi-die Package App 20200075548 - Kim; Kang-Yong ; et al.	2020-03-05
Face down dual sided chip scale memory package Grant 10,366,934 - Yoo , et al. July 30, 2	2019-07-30
Face Down Dual Sided Chip Scale Memory Package App 20190088565 - Yoo; Chan ; et al.	2019-03-21
Face Down Dual Sided Chip Scale Memory Package App 20180358275 - Yoo; Chan ; et al.	2018-12-13
Face down dual sided chip scale memory package Grant 10,153,221 - Yoo , et al. Dec	2018-12-11
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20180226387 - Yoo; Chan ; et al.	2018-08-09
Method of assembly semiconductor device with through-package interconnect Grant 9,978,730 - Yoo , et al. May 22, 2	2018-05-22
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20170040303 - Yoo; Chan ; et al.	2017-02-09
Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods Grant 9,508,686 - Yoo , et al. November 29, 2	2016-11-29
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices And Methods App 20150137365 - Yoo; Chan ; et al.	2015-05-21
Ettlia sp. Strain Having Superior Carbon Dioxide Fixation Ability and Lipid Producing Ability and Use Thereof App 20150010986 - Oh; Hee Mock ; et al.	2015-01-08
Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods Grant 8,906,743 - Yoo , et al. December 9, 2	2014-12-09
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20140197526 - Yoo; Chan ; et al.	2014-07-17
Waveguides with optical monitoring Grant 6,934,455 - Skinner , et al. August 23, 2	2005-08-23
Waveguides with optical monitoring App 20040120675 - Skinner, Michael ; et al.	2004-06-24

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