Yong; Cheng Choi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yong; Cheng Choi.The latest application filed is for "wire bonding method employing two scrub settings".

Company Profile

0.6.12

Yong; Cheng Choi - Puchong N/A MY
Yong; Cheng Choi - Kuala Lumpur MY
Yong; Cheng Choi - Kul MY
Yong; Cheng Choi - Selangor MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wire bonding method employing two scrub settings Grant 9,337,167 - Wong , et al. May 10, 2	2016-05-10
Wire Bonding Method Employing Two Scrub Settings App 20150279810 - Wong; Boh Kid ; et al.	2015-10-01
Wire Bonding Method With Two Step Free Air Ball Formation App 20150235981 - Eu; Poh Leng ; et al.	2015-08-20
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Grant 7,626,276 - Hess , et al. December 1, 2	2009-12-01
Bond Pad For Semiconductor Device App 20080182120 - Tan; Lan Chu ; et al.	2008-07-31
Method And Apparatus For Providing Structural Support For Interconnect Pad While Allowing Signal Conductance App 20070210442 - Hess; Kevin J. ; et al.	2007-09-13
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Grant 7,241,636 - Hess , et al. July 10, 2	2007-07-10
Method of making a stacked die package App 20070026573 - Ismail; Aminuddin ; et al.	2007-02-01
Method of forming a substrateless semiconductor package Grant 7,160,755 - Lo , et al. January 9, 2	2007-01-09
Method of forming a substrateless semiconductor package App 20060234421 - Lo; Wai Yew ; et al.	2006-10-19
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance App 20060154469 - Hess; Kevin J. ; et al.	2006-07-13
Integrated circuit die having a copper contact and method therefor Grant 6,933,614 - Lee , et al. August 23, 2	2005-08-23
Integrated circuit die having a copper contact and method therefor App 20040195696 - Lee, Chu-Chung ; et al.	2004-10-07
Stacked die semiconductor device App 20030230796 - Ismail, Aminuddin ; et al.	2003-12-18
Stacked die semiconductor device App 20030111720 - Tan, Lan Chu ; et al.	2003-06-19

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