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name:-0.0062341690063477
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Yong; Chang Beom Patent Filings

Yong; Chang Beom

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yong; Chang Beom.The latest application filed is for "semiconductor device and method of forming conductive vias using backside via reveal and selective passivation".

Company Profile
0.6.6
  • Yong; Chang Beom - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
Grant 9,865,524 - Na , et al. January 9, 2
2018-01-09
Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer
Grant 9,601,462 - Choi , et al. March 21, 2
2017-03-21
Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
Grant 9,257,382 - Na , et al. February 9, 2
2016-02-09
Semiconductor device and method of forming through-silicon-via with sacrificial layer
Grant 9,076,655 - Na , et al. July 7, 2
2015-07-07
Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation
App 20140300002 - Na; Duk Ju ;   et al.
2014-10-09
Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer
App 20140264851 - Choi; Won Kyoung ;   et al.
2014-09-18
Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer
App 20140199838 - Na; Duk Ju ;   et al.
2014-07-17
Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer
App 20130299998 - Na; Duk Ju ;   et al.
2013-11-14
Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
Grant 8,558,389 - Na , et al. October 15, 2
2013-10-15
Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV through Semiconductor Wafer
App 20130147055 - Na; Duk Ju ;   et al.
2013-06-13

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