Yonemura; Naomi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yonemura; Naomi.The latest application filed is for "method for manufacturing substrate for light emitting element package, and light emitting element package".

Company Profile

0.4.4

Yonemura; Naomi - Tokyo JP
Yonemura; Naomi - Shibukawa JP
Yonemura; Naomi - Gunma JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Substrate For Light Emitting Element Package, And Light Emitting Element Package App 20110311831 - Suzuki; Motohiro ; et al.	2011-12-22
Method For Manufacturing Substrate For Light Emitting Element Package, And Light Emitting Element Package App 20110284914 - Suzuki; Motohiro ; et al.	2011-11-24
Substrate For Light Emitting Element Package, And Light Emitting Element Package App 20110272731 - Suzuki; Motohiro ; et al.	2011-11-10
Metal-base circuit board and its manufacturing method Grant 7,709,939 - Yonemura , et al. May 4, 2	2010-05-04
Metal-base circuit board and its manufacturing method App 20070128772 - Yonemura; Naomi ; et al.	2007-06-07
Metal-base multilayer circuit substrate with heat conducting adhesive Grant 6,369,332 - Saitoh , et al. April 9, 2	2002-04-09
Metal-base multilayer circuit substrate having a heat conductive adhesive layer Grant 6,175,084 - Saitoh , et al. January 16, 2	2001-01-16
Circuit substrate for mounting a semiconductor element Grant 5,362,926 - Fukuda , et al. November 8, 1	1994-11-08

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