Yoneda; Yoshinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yoneda; Yoshinori.The latest application filed is for "solvent-free silicone-modified polyimide resin composition".

Company Profile

1.12.15

Yoneda; Yoshinori - Tokyo JP
Yoneda; Yoshinori - Annaka N/A JP
Yoneda; Yoshinori - Annaka-city JP
Yoneda; Yoshinori - Annaka-shi JP
Yoneda; Yoshinori - Gunma JP
Yoneda; Yoshinori - Usui-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solvent-free silicone-modified polyimide resin composition Grant 10,550,287 - Hattori , et al. Fe	2020-02-04
Silicone-modified polyimide resin composition of solvent free type Grant 10,421,840 - Hattori , et al. Sept	2019-09-24
Solvent-free Silicone-modified Polyimide Resin Composition App 20180312723 - HATTORI; Hatsuhiko ; et al.	2018-11-01
Silicone-modified Polyurethane-based Fiber And Method For Manufacturing Same App 20180086874 - HATTORI; Hatsuhiko ; et al.	2018-03-29
Silicone-modified Polyimide Resin Composition Of Solvent Free Type App 20170355825 - HATTORI; Hatsuhiko ; et al.	2017-12-14
Air conditioning system Grant 8,999,043 - Suzuki , et al. April 7, 2	2015-04-07
Air Conditioning System App 20140165838 - Suzuki; Yoshinobu ; et al.	2014-06-19
Binder For Lithium Secondary Battery, Negative Electrode For Lithium Secondary Battery, Lithium Secondary Battery, Binder Precursor Solution For Lithium Secondary Battery, And Method For Manufacturing Negative Electrode For Lithium Secondary Battery App 20120129048 - Fukui; Atsushi ; et al.	2012-05-24
Cosmetic Product Containing Film-forming Polymer App 20110301247 - HAYAKAWA; Chihiro ; et al.	2011-12-08
Phenolic OH-containing polyimide silicone, epoxy resin and curing agent Grant 8,053,533 - Yoneda , et al. November 8, 2	2011-11-08
Heat-curable polyimide silicone resin composition Grant 7,981,976 - Yoneda , et al. July 19, 2	2011-07-19
Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resin Grant 7,834,100 - Yoneda , et al. November 16, 2	2010-11-16
Solvent-free Polyimide Silicone Resin Composition And Cured Product Thereof App 20100056730 - YONEDA; Yoshinori ; et al.	2010-03-04
Heat-curable polyimide silicone Composition and a cured film therefrom App 20090062479 - Yoneda; Yoshinori ; et al.	2009-03-05
Heat-curable polyimide silicone resin composition App 20090062480 - Yoneda; Yoshinori ; et al.	2009-03-05
Solvent-free polymide silicone resin composition and a cured resin film thereof Grant 7,432,313 - Yoneda , et al. October 7, 2	2008-10-07
Solvent-free polyimide silicone resin composition and a resin film composed of the same Grant 7,405,244 - Yoneda , et al. July 29, 2	2008-07-29
Electrode for an electrochemical capacitor, a composition used for the electrode, a method of manufacturing the electrode, and an electrochemical capacitor using the electrode Grant 7,355,839 - Yoneda , et al. April 8, 2	2008-04-08
Electrode for an electrochemical capacitor, a composition used for the electrode, a method of manufacturing the electrode, and an electrochemical capacitor using the electrode App 20060250750 - Yoneda; Yoshinori ; et al.	2006-11-09
Colorless and transparent polyimidesilicone resin having thermosetting functional groups Grant 7,041,766 - Yoneda , et al. May 9, 2	2006-05-09
Solvent-free polyimide silicone resin composition and a resin film composed of the same App 20060084714 - Yoneda; Yoshinori ; et al.	2006-04-20
Solvent-free polymide silicone resin composition and a cured resin film thereof App 20060052476 - Yoneda; Yoshinori ; et al.	2006-03-09
Addition curing type silicone resin composition Grant 6,815,520 - Yoneda , et al. November 9, 2	2004-11-09
Colorless and transparent polyimidesilicone resin having thermosetting functional groups App 20040072982 - Yoneda, Yoshinori ; et al.	2004-04-15
Addition curing type silicone resin composition App 20020161140 - Yoneda, Yoshinori ; et al.	2002-10-31

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