Yomogida; Koichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yomogida; Koichi.The latest application filed is for "surface treatment solutions for gold and gold alloys".
- Yomogida; Koichi - Niigata JP
- Yomogida; Koichi - Niigata-shi JP
- Yomogida; Koichi - Saitama JP
- Yomogida; Koichi - Saitama-shi JP
| Patent | Date |
|---|---|
| Surface treatment solutions for gold and gold alloys Grant 9,914,838 - Mizuno , et al. March 13, 2 | 2018-03-13 |
| Method of treating gold or gold alloy with a surface treatment solution comprising a disulfide compound Grant 9,790,606 - Yomogida October 17, 2 | 2017-10-17 |
| Surface Treatment Solutions For Gold And Gold Alloys App 20170002211 - Mizuno; Yoko ; et al. | 2017-01-05 |
| Gold plating solution Grant 9,212,429 - Yomogida , et al. December 15, 2 | 2015-12-15 |
| Surface Treatment Solution App 20150152565 - YOMOGIDA; Koichi | 2015-06-04 |
| Gold Plating Solution App 20120132533 - YOMOGIDA; Koichi ; et al. | 2012-05-31 |
| Electroless gold plating solution Grant 7,534,289 - Yomogida May 19, 2 | 2009-05-19 |
| Plating method Grant 7,374,652 - Hayashi , et al. May 20, 2 | 2008-05-20 |
| Plating method App 20070007143 - Hayashi; Shinjiro ; et al. | 2007-01-11 |
| Composite material with improved binding strength and method for forming the same App 20050164020 - Seita, Masaru ; et al. | 2005-07-28 |
| Method for forming resin composite material Grant 6,899,781 - Seita , et al. May 31, 2 | 2005-05-31 |
| Resin composite material and method of forming the same App 20040170846 - Seita, Masaru ; et al. | 2004-09-02 |
| Direct patterning method App 20040101665 - Seita, Masaru ; et al. | 2004-05-27 |
| Composite material with improved binding strength and method for forming the same App 20040072015 - Seita, Masaru ; et al. | 2004-04-15 |
| Method for forming resin composite material App 20040001957 - Seita, Masaru ; et al. | 2004-01-01 |
| Non-charging resin composite and method for manufacturing the same App 20030003307 - Tsuchida, Hideki ; et al. | 2003-01-02 |
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