Yokozawa; Tadahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yokozawa; Tadahiro.The latest application filed is for "method for forming conductor layer, and method for producing multilayer wiring substrate using same".

Company Profile

0.2.12

Yokozawa; Tadahiro - Ichihara JP
YOKOZAWA; Tadahiro - Ichihara-shi JP
Yokozawa; Tadahiro - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming conductor layer, and method for producing multilayer wiring substrate using same Grant 10,149,394 - Miura , et al. De	2018-12-04
Method For Forming Conductor Layer, And Method For Producing Multilayer Wiring Substrate Using Same App 20160353580 - MIURA; Toru ; et al.	2016-12-01
Polyimide Film And Wiring Board App 20150069012 - Yamaguchi; Hiroaki ; et al.	2015-03-12
Polyimide Film, Polyimide Laminate Comprising Same, And Polyimide/metal Laminate Comprising Same App 20120308816 - Kohama; Shin-ichiro ; et al.	2012-12-06
Polyimide Film And Wiring Board App 20120288621 - Yamaguchi; Hiroaki ; et al.	2012-11-15
Production of via hole in a flexible printed circuit board by applying a laser or punch Grant 7,918,021 - Kogure , et al. April 5, 2	2011-04-05
Polyimide Film And Wiring Board App 20100252309 - Yamaguchi; Hiroaki ; et al.	2010-10-07
Method For Manufacturing Printed Wiring Board App 20100230142 - Bamba; Keita ; et al.	2010-09-16
Process For Producing Metal Wiring Board App 20090266589 - Shimokawa; Hiroto ; et al.	2009-10-29
Polyimide-metal Laminated Body And Polyimide Circuit Board App 20090242411 - Yokozawa; Tadahiro ; et al.	2009-10-01
Process For Producing Polyimide Film With Copper Wiring App 20090211786 - Bamba; Keita ; et al.	2009-08-27
Production Of Via Hole In Flexible Circuit Printable Board App 20090002953 - KOGURE; Ryuichiro ; et al.	2009-01-01
Polyimide-Metal Laminated Body and Polyimide Circuit Board App 20080286538 - Yokozawa; Tadahiro ; et al.	2008-11-20
Production of via hole in flexible circuit printable board App 20050162835 - Kogure, Ryuichiro ; et al.	2005-07-28

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