Yokoyama; Yasuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yokoyama; Yasuo.The latest application filed is for "resin sealed module".
- Yokoyama; Yasuo - Kyoto JP
- Yokoyama; Yasuo - Kahoku-gun JP
- Yokoyama, Yasuo - Tochigi-ken JP
| Patent | Date |
|---|---|
| Resin sealed module Grant 9,583,409 - Yokoyama , et al. February 28, 2 | 2017-02-28 |
| Resin Sealed Module App 20130300002 - Yokoyama; Yasuo ; et al. | 2013-11-14 |
| Electronic component and method of manufacturing electronic component Grant 8,300,421 - Yokoyama October 30, 2 | 2012-10-30 |
| Method Of Manufacturing Electronic Component App 20100315795 - YOKOYAMA; Yasuo | 2010-12-16 |
| Streaming image distribution system App 20050044255 - Yokoyama, Yasuo | 2005-02-24 |
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