Yokoyama; Kiyoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yokoyama; Kiyoshi.The latest application filed is for "electrostatic chuck".
- Yokoyama; Kiyoshi - Kirishima JP
- Yokoyama; Kiyoshi - Kokubu JP
- Yokoyama; Kiyoshi - Kirishima-shi JP
- Yokoyama, Kiyoshi - Kokubu-shi JP
- Yokoyama; Kiyoshi - Hayato JP
| Patent | Date |
|---|---|
| Bonded body, wafer support member using the same, and wafer treatment method Grant 7,709,099 - Yokoyama May 4, 2 | 2010-05-04 |
| Electrostatic chuck Grant 7,586,734 - Kamitani , et al. September 8, 2 | 2009-09-08 |
| Composite material, wafer holding member and method for manufacturing the same Grant 7,381,673 - Yokoyama , et al. June 3, 2 | 2008-06-03 |
| Electrostatic Chuck App 20080037194 - Kamitani; Satoru ; et al. | 2008-02-14 |
| Bonded body, wafer support member using the same, and wafer treatment method App 20070199660 - Yokoyama; Kiyoshi | 2007-08-30 |
| Composite material, wafer holding member and method for manufacturing the same App 20050101082 - Yokoyama, Kiyoshi ; et al. | 2005-05-12 |
| Contact heating device App 20020003137 - Yokoyama, Kiyoshi ; et al. | 2002-01-10 |
| Silicon nitride sintered body and process for preparation thereof Grant 4,892,848 - Yoshida , et al. January 9, 1 | 1990-01-09 |
| Silicon nitride sintered body Grant 4,746,636 - Yokoyama May 24, 1 | 1988-05-24 |
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