loadpatents
name:-0.032370090484619
name:-0.027904987335205
name:-0.0047969818115234
Yokoyama; Hideki Patent Filings

Yokoyama; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yokoyama; Hideki.The latest application filed is for "water-absorbent resin and method of producing water-absorbent resin".

Company Profile
4.35.33
  • Yokoyama; Hideki - Himeji JP
  • Yokoyama; Hideki - Himeji-shi JP
  • YOKOYAMA; Hideki - Shikama-ku Himeji-shi
  • Yokoyama; Hideki - Hyogo JP
  • Yokoyama; Hideki - Akita-ken JP
  • Yokoyama; Hideki - Hiroshima JP
  • Yokoyama; Hideki - Yuri-gun JP
  • Yokoyama; Hideki - Ichihara JP
  • Yokoyama, Hideki - Ichihara-shi JP
  • Yokoyama; Hideki - Aichi JP
  • Yokoyama; Hideki - Higashihiroshima JP
  • Yokoyama; Hideki - Tsu JP
  • Yokoyama; Hideki - Musashino JP
  • Yokoyama; Hideki - Murayama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Water-absorbent resin particle
Grant 11,420,184 - Yabuguchi , et al. August 23, 2
2022-08-23
Water-absorbent resin particle
Grant 11,338,267 - Yabuguchi , et al. May 24, 2
2022-05-24
Water-absorbent resin particles
Grant 11,241,669 - Yabuguchi , et al. February 8, 2
2022-02-08
Water-absorbent resin and method of producing water-absorbent resin
Grant 11,136,420 - Hinayama , et al. October 5, 2
2021-10-05
Water-absorbent Resin And Method Of Producing Water-absorbent Resin
App 20200199263 - Hinayama; Tetsuhiro ;   et al.
2020-06-25
Water-absorbent Resin Particle
App 20200038838 - YABUGUCHI; Hiroki ;   et al.
2020-02-06
Water-absorbent Resin Particles
App 20200038837 - YABUGUCHI; Hiroki ;   et al.
2020-02-06
Water-absorbent resin and absorbent article
Grant 10,525,443 - Murakami , et al. J
2020-01-07
Water-absorbent resin and absorbent article
Grant 10,323,105 - Yabuguchi , et al.
2019-06-18
Water-absorbent resin and absorbent article
Grant 9,982,069 - Hinayama , et al. May 29, 2
2018-05-29
Water-absorbent resin and absorbent article
Grant 9,925,294 - Hinayama , et al. March 27, 2
2018-03-27
Method of manufacturing water-absorbent resin, water-absorbent resin, water-absorbing agent and absorbent article
Grant 9,873,755 - Murakami , et al. January 23, 2
2018-01-23
Water-absorbent Resin And Absorbent Article
App 20170218096 - Yabuguchi; Hiroki ;   et al.
2017-08-03
Water-absorbent Resin And Method Of Producing Water-absorbent Resin
App 20170210831 - Hinayama; Tetsuhiro ;   et al.
2017-07-27
Water-absorbent Resin And Absorbent Article
App 20170203279 - Murakami; Masahiro ;   et al.
2017-07-20
Method Of Manufacturing Water-absorbent Resin, Water-absorbent Resin, Water-absorbing Agent And Absorbent Article
App 20170107313 - Murakami; Masahiro ;   et al.
2017-04-20
Water-absorbent Resin And Absorbent Article
App 20170107312 - Hinayama; Tetsuhiro ;   et al.
2017-04-20
Water-absorbent Resin And Absorbent Article
App 20160367717 - HINAYAMA; Tetsuhiro ;   et al.
2016-12-22
Method for producing a water-absorbent resin
Grant 9,132,413 - Kikuno , et al. September 15, 2
2015-09-15
Process for production of water-absorbent resin
Grant 9,074,022 - Yokoyama , et al. July 7, 2
2015-07-07
Method for producing a water-absorbent resin
Grant 8,883,944 - Heguri , et al. November 11, 2
2014-11-11
Method for producing a water-absorbent resin
Grant 8,859,700 - Yokoyama , et al. October 14, 2
2014-10-14
Method for producing a water-absorbent resin
Grant 8,841,395 - Yokoyama , et al. September 23, 2
2014-09-23
Method For Producing A Water-absorbent Resin
App 20140179886 - Yokoyama; Hideki ;   et al.
2014-06-26
Method For Producing A Water-absorbent Resin
App 20140094570 - Yokoyama; Hideki ;   et al.
2014-04-03
Method For Producing A Water-absorbent Resin
App 20130123445 - Heguri; Atsushi ;   et al.
2013-05-16
Method For Producing A Water-absorbent Resin
App 20130119309 - Kikuno; Sachi ;   et al.
2013-05-16
Method For Producing A Water-absorbent Resin
App 20130123455 - Yokoyama; Hideki ;   et al.
2013-05-16
Method For Producing A Water-absorbent Resin
App 20130123454 - Yokoyama; Hideki ;   et al.
2013-05-16
Water-absorbent Resin Suitable For Use In Hygienic Materials
App 20100331802 - Yokoyama; Hideki ;   et al.
2010-12-30
Water-absorbing Resin Suitable For Absorbing Viscous Liquids Containing High-molecular Compound, And Absorbent And Absorbent Article Each Comprising The Same
App 20100273647 - NAWATA; Yasuhiro ;   et al.
2010-10-28
Process For Production Of Water-absorbent Resin
App 20090182092 - Yokoyama; Hideki ;   et al.
2009-07-16
Water-absorbing Resin Suitable For Absorbing Viscous Liquids Containing High-molecular Compound, And Absorbent And Absorbent Article Each Comprising The Same
App 20090136736 - NAWATA; YASUHIRO ;   et al.
2009-05-28
Paste coating method
Grant 7,318,868 - Yokoyama , et al. January 15, 2
2008-01-15
Water-absorbing resin suitable for absorbing viscous liquids containing high-molecular compound, and absorbent and absorbent article each comprising the same
App 20070178786 - Nawata; Yasuhiro ;   et al.
2007-08-02
Paste coating method
App 20070000439 - Yokoyama; Hideki ;   et al.
2007-01-04
Paste coating method
Grant 7,115,302 - Yokoyama , et al. October 3, 2
2006-10-03
Vehicle seat system
Grant 6,991,287 - Ogawa , et al. January 31, 2
2006-01-31
Vehicle Seat System
App 20060006721 - Ogawa; Kazuharu ;   et al.
2006-01-12
Laminate type electronic component
Grant 6,956,731 - Yoshii , et al. October 18, 2
2005-10-18
Laminate type electronic component
App 20050083637 - Yoshll, Akitoshi ;   et al.
2005-04-21
Ceramic electronic device, paste coating method, and paste coating apparatus
App 20040208987 - Yokoyama, Hideki ;   et al.
2004-10-21
Ceramic electronic device, paste coating method, and paste coating apparatus
Grant 6,771,485 - Yokoyama , et al. August 3, 2
2004-08-03
Process for producing a ceramic electronic component
Grant 6,729,003 - Yokoyama , et al. May 4, 2
2004-05-04
Phenyl, naphthly or fluorene cyclopentyl epoxy resins
Grant 6,713,589 - Sue , et al. March 30, 2
2004-03-30
Ceramic electronic device, paste coating method, and paste coating apparatus
App 20030169556 - Yokoyama, Hideki ;   et al.
2003-09-11
Water-absorbing resin suitable for absorbing viscous liquids containing high-molecular compound, and absorbent and absorbent article each comprising the same
App 20030153887 - Nawata, Yasuhiro ;   et al.
2003-08-14
Cyclopentylene compound and intermediate thereof, epoxy resin composition, molding material, and resin-encapsulated electronic device
App 20020065386 - Sue, Haruaki ;   et al.
2002-05-30
Ceramic electronic component having electronic component containing cuprous oxide
Grant 6,381,118 - Yokoyama , et al. April 30, 2
2002-04-30
Ceramic electronic component and process for production of the same
App 20020046861 - Yokoyama, Hideki ;   et al.
2002-04-25
Aqueous cutting fluid, aqueous cutting agent, and process for cutting hard brittle materials with the same
Grant 6,228,816 - Ito , et al. May 8, 2
2001-05-08
Instrument panel structure of car body
Grant 5,067,747 - Yokoyama November 26, 1
1991-11-26
Jack for telephone set
Grant 4,655,529 - Yokoyama April 7, 1
1987-04-07
Connector
Grant 4,566,748 - Tanishi , et al. January 28, 1
1986-01-28
Vehicle tire
Grant D265,302 - Kojima , et al. July 6, 1
1982-07-06
Vehicle tire
Grant D265,306 - Kojima , et al. July 6, 1
1982-07-06
Vehicle tire
Grant D265,303 - Yokoyama July 6, 1
1982-07-06
Vehicle tire
Grant D263,946 - Kojima , et al. April 20, 1
1982-04-20

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