loadpatents
Patent applications and USPTO patent grants for Yokoyama; Hideki.The latest application filed is for "water-absorbent resin and method of producing water-absorbent resin".
Patent | Date |
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Water-absorbent resin particle Grant 11,420,184 - Yabuguchi , et al. August 23, 2 | 2022-08-23 |
Water-absorbent resin particle Grant 11,338,267 - Yabuguchi , et al. May 24, 2 | 2022-05-24 |
Water-absorbent resin particles Grant 11,241,669 - Yabuguchi , et al. February 8, 2 | 2022-02-08 |
Water-absorbent resin and method of producing water-absorbent resin Grant 11,136,420 - Hinayama , et al. October 5, 2 | 2021-10-05 |
Water-absorbent Resin And Method Of Producing Water-absorbent Resin App 20200199263 - Hinayama; Tetsuhiro ;   et al. | 2020-06-25 |
Water-absorbent Resin Particle App 20200038838 - YABUGUCHI; Hiroki ;   et al. | 2020-02-06 |
Water-absorbent Resin Particles App 20200038837 - YABUGUCHI; Hiroki ;   et al. | 2020-02-06 |
Water-absorbent resin and absorbent article Grant 10,525,443 - Murakami , et al. J | 2020-01-07 |
Water-absorbent resin and absorbent article Grant 10,323,105 - Yabuguchi , et al. | 2019-06-18 |
Water-absorbent resin and absorbent article Grant 9,982,069 - Hinayama , et al. May 29, 2 | 2018-05-29 |
Water-absorbent resin and absorbent article Grant 9,925,294 - Hinayama , et al. March 27, 2 | 2018-03-27 |
Method of manufacturing water-absorbent resin, water-absorbent resin, water-absorbing agent and absorbent article Grant 9,873,755 - Murakami , et al. January 23, 2 | 2018-01-23 |
Water-absorbent Resin And Absorbent Article App 20170218096 - Yabuguchi; Hiroki ;   et al. | 2017-08-03 |
Water-absorbent Resin And Method Of Producing Water-absorbent Resin App 20170210831 - Hinayama; Tetsuhiro ;   et al. | 2017-07-27 |
Water-absorbent Resin And Absorbent Article App 20170203279 - Murakami; Masahiro ;   et al. | 2017-07-20 |
Method Of Manufacturing Water-absorbent Resin, Water-absorbent Resin, Water-absorbing Agent And Absorbent Article App 20170107313 - Murakami; Masahiro ;   et al. | 2017-04-20 |
Water-absorbent Resin And Absorbent Article App 20170107312 - Hinayama; Tetsuhiro ;   et al. | 2017-04-20 |
Water-absorbent Resin And Absorbent Article App 20160367717 - HINAYAMA; Tetsuhiro ;   et al. | 2016-12-22 |
Method for producing a water-absorbent resin Grant 9,132,413 - Kikuno , et al. September 15, 2 | 2015-09-15 |
Process for production of water-absorbent resin Grant 9,074,022 - Yokoyama , et al. July 7, 2 | 2015-07-07 |
Method for producing a water-absorbent resin Grant 8,883,944 - Heguri , et al. November 11, 2 | 2014-11-11 |
Method for producing a water-absorbent resin Grant 8,859,700 - Yokoyama , et al. October 14, 2 | 2014-10-14 |
Method for producing a water-absorbent resin Grant 8,841,395 - Yokoyama , et al. September 23, 2 | 2014-09-23 |
Method For Producing A Water-absorbent Resin App 20140179886 - Yokoyama; Hideki ;   et al. | 2014-06-26 |
Method For Producing A Water-absorbent Resin App 20140094570 - Yokoyama; Hideki ;   et al. | 2014-04-03 |
Method For Producing A Water-absorbent Resin App 20130123445 - Heguri; Atsushi ;   et al. | 2013-05-16 |
Method For Producing A Water-absorbent Resin App 20130119309 - Kikuno; Sachi ;   et al. | 2013-05-16 |
Method For Producing A Water-absorbent Resin App 20130123455 - Yokoyama; Hideki ;   et al. | 2013-05-16 |
Method For Producing A Water-absorbent Resin App 20130123454 - Yokoyama; Hideki ;   et al. | 2013-05-16 |
Water-absorbent Resin Suitable For Use In Hygienic Materials App 20100331802 - Yokoyama; Hideki ;   et al. | 2010-12-30 |
Water-absorbing Resin Suitable For Absorbing Viscous Liquids Containing High-molecular Compound, And Absorbent And Absorbent Article Each Comprising The Same App 20100273647 - NAWATA; Yasuhiro ;   et al. | 2010-10-28 |
Process For Production Of Water-absorbent Resin App 20090182092 - Yokoyama; Hideki ;   et al. | 2009-07-16 |
Water-absorbing Resin Suitable For Absorbing Viscous Liquids Containing High-molecular Compound, And Absorbent And Absorbent Article Each Comprising The Same App 20090136736 - NAWATA; YASUHIRO ;   et al. | 2009-05-28 |
Paste coating method Grant 7,318,868 - Yokoyama , et al. January 15, 2 | 2008-01-15 |
Water-absorbing resin suitable for absorbing viscous liquids containing high-molecular compound, and absorbent and absorbent article each comprising the same App 20070178786 - Nawata; Yasuhiro ;   et al. | 2007-08-02 |
Paste coating method App 20070000439 - Yokoyama; Hideki ;   et al. | 2007-01-04 |
Paste coating method Grant 7,115,302 - Yokoyama , et al. October 3, 2 | 2006-10-03 |
Vehicle seat system Grant 6,991,287 - Ogawa , et al. January 31, 2 | 2006-01-31 |
Vehicle Seat System App 20060006721 - Ogawa; Kazuharu ;   et al. | 2006-01-12 |
Laminate type electronic component Grant 6,956,731 - Yoshii , et al. October 18, 2 | 2005-10-18 |
Laminate type electronic component App 20050083637 - Yoshll, Akitoshi ;   et al. | 2005-04-21 |
Ceramic electronic device, paste coating method, and paste coating apparatus App 20040208987 - Yokoyama, Hideki ;   et al. | 2004-10-21 |
Ceramic electronic device, paste coating method, and paste coating apparatus Grant 6,771,485 - Yokoyama , et al. August 3, 2 | 2004-08-03 |
Process for producing a ceramic electronic component Grant 6,729,003 - Yokoyama , et al. May 4, 2 | 2004-05-04 |
Phenyl, naphthly or fluorene cyclopentyl epoxy resins Grant 6,713,589 - Sue , et al. March 30, 2 | 2004-03-30 |
Ceramic electronic device, paste coating method, and paste coating apparatus App 20030169556 - Yokoyama, Hideki ;   et al. | 2003-09-11 |
Water-absorbing resin suitable for absorbing viscous liquids containing high-molecular compound, and absorbent and absorbent article each comprising the same App 20030153887 - Nawata, Yasuhiro ;   et al. | 2003-08-14 |
Cyclopentylene compound and intermediate thereof, epoxy resin composition, molding material, and resin-encapsulated electronic device App 20020065386 - Sue, Haruaki ;   et al. | 2002-05-30 |
Ceramic electronic component having electronic component containing cuprous oxide Grant 6,381,118 - Yokoyama , et al. April 30, 2 | 2002-04-30 |
Ceramic electronic component and process for production of the same App 20020046861 - Yokoyama, Hideki ;   et al. | 2002-04-25 |
Aqueous cutting fluid, aqueous cutting agent, and process for cutting hard brittle materials with the same Grant 6,228,816 - Ito , et al. May 8, 2 | 2001-05-08 |
Instrument panel structure of car body Grant 5,067,747 - Yokoyama November 26, 1 | 1991-11-26 |
Jack for telephone set Grant 4,655,529 - Yokoyama April 7, 1 | 1987-04-07 |
Connector Grant 4,566,748 - Tanishi , et al. January 28, 1 | 1986-01-28 |
Vehicle tire Grant D265,302 - Kojima , et al. July 6, 1 | 1982-07-06 |
Vehicle tire Grant D265,306 - Kojima , et al. July 6, 1 | 1982-07-06 |
Vehicle tire Grant D265,303 - Yokoyama July 6, 1 | 1982-07-06 |
Vehicle tire Grant D263,946 - Kojima , et al. April 20, 1 | 1982-04-20 |
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