Yokoyama; Dai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yokoyama; Dai.The latest application filed is for "component supply device, component mounting device, and method of manufacturing mounting board".

Company Profile

7.13.13

Yokoyama; Dai - Yamanashi JP
Yokoyama; Dai - Chiba N/A JP
Yokoyama; Dai - Singapore JP
Yokoyama; Dai - Kofu JP
Yokoyama, Dai - Kofu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component supply device and component mounting device Grant 11,357,144 - Watanabe , et al. June 7, 2	2022-06-07
Method of mounting component Grant 11,202,374 - Watanabe , et al. December 14, 2	2021-12-14
Method of manufacturing component-mounted substrate Grant 11,006,560 - Watanabe , et al. May 11, 2	2021-05-11
Component mounting device and method of mounting component Grant 10,568,250 - Watanabe , et al. Feb	2020-02-18
Component mounting apparatus Grant 10,549,432 - Yokoyama , et al. Fe	2020-02-04
Electronic component mounting method and electronic component mounting apparatus Grant 10,492,350 - Yokoyama , et al. Nov	2019-11-26
Component supply device, component mounter, and component-mounted board manufacturing method Grant 10,390,470 - Watanabe , et al. A	2019-08-20
Component Supply Device, Component Mounting Device, And Method Of Manufacturing Mounting Board App 20190133007 - WATANABE; HIDEAKI ; et al.	2019-05-02
Component Mounting Device And Method Of Manufacturing Component-mounted Substrate Using The Same App 20190082566 - WATANABE; Hideaki ; et al.	2019-03-14
Component Mounting Device And Method Of Mounting Component App 20180255671 - WATANABE; Hideaki ; et al.	2018-09-06
Component Mounting Device And Method Of Mounting Component App 20180255670 - WATANABE; Hideaki ; et al.	2018-09-06
Electronic component mounter Grant 10,004,170 - Nagasawa , et al. June 19, 2	2018-06-19
Component Supply Device, Component Mounter, And Component-mounted Board Manufacturing Method App 20180103566 - WATANABE; HIDEAKI ; et al.	2018-04-12
Component Mounting Apparatus App 20170066141 - YOKOYAMA; DAI ; et al.	2017-03-09
Electronic Component Mounter App 20170042073 - NAGASAWA; YOSUKE ; et al.	2017-02-09
Electronic Component Mounting Method And Electronic Component Mounting Apparatus App 20170034968 - YOKOYAMA; DAI ; et al.	2017-02-02
Porous polyimide membrane and process for production thereof Grant 8,980,421 - Ohya , et al. March 17, 2	2015-03-17
Porous Polyimide Membrane And Process For Production Thereof App 20130045355 - Ohya; Shyusei ; et al.	2013-02-21
Wiring and piping apparatus of part mounting machine App 20060016614 - Yokoyama; Dai ; et al.	2006-01-26
Electronic component mounting apparatus Grant 6,915,561 - Yokoyama , et al. July 12, 2	2005-07-12
Apparatus for mounting a wire component Grant 6,715,205 - Watanabe , et al. April 6, 2	2004-04-06
Electronic component mounting apparatus App 20020108237 - Yokoyama, Dai ; et al.	2002-08-15
Apparatus and method for mounting wire component App 20020046463 - Watanabe, Hideaki ; et al.	2002-04-25
Electronic parts mounting method Grant 5,909,914 - Imai , et al. June 8, 1	1999-06-08

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