loadpatents
Patent applications and USPTO patent grants for Yokota; Yatsuharu.The latest application filed is for "heat processing device".
Patent | Date |
---|---|
Heat processing device Grant 9,440,303 - Yokota September 13, 2 | 2016-09-13 |
Conveyor Grant 9,193,529 - Yokota November 24, 2 | 2015-11-24 |
Reflow soldering apparatus and method Grant 9,144,158 - Yokota September 22, 2 | 2015-09-22 |
Conveyor apparatus Grant 9,114,936 - Yokota August 25, 2 | 2015-08-25 |
Heat Processing Device App 20140367451 - Yokota; Yatsuharu | 2014-12-18 |
Conveyor Apparatus App 20140231224 - Yokota; Yatsuharu | 2014-08-21 |
Conveyor App 20140231223 - Yokota; Yatsuharu | 2014-08-21 |
Reflow Soldering Apparatus and Method App 20130263445 - Yokota; Yatsuharu | 2013-10-10 |
Reflow soldering apparatus Grant 7,690,550 - Yokota April 6, 2 | 2010-04-06 |
Device for heating printed-circuit board Grant 6,423,945 - Yokota July 23, 2 | 2002-07-23 |
Reflow soldering apparatus App 20020020695 - Yokota, Yatsuharu | 2002-02-21 |
Automatic reflow soldering apparatus Grant 5,922,230 - Yokota July 13, 1 | 1999-07-13 |
Reflow soldering method and the apparatus thereof Grant 5,141,147 - Yokota August 25, 1 | 1992-08-25 |
Reflow soldering method and the apparatus thereof Grant 4,909,430 - Yokota March 20, 1 | 1990-03-20 |
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