loadpatents
name:-0.0021069049835205
name:-0.005511999130249
name:-0.00042414665222168
Yokota; Yatsuharu Patent Filings

Yokota; Yatsuharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yokota; Yatsuharu.The latest application filed is for "heat processing device".

Company Profile
0.12.7
  • Yokota; Yatsuharu - Tokyo JP
  • Yokota; Yatsuharu - Hachioji JP
  • Yokota; Yatsuharu - Hachioji-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat processing device
Grant 9,440,303 - Yokota September 13, 2
2016-09-13
Conveyor
Grant 9,193,529 - Yokota November 24, 2
2015-11-24
Reflow soldering apparatus and method
Grant 9,144,158 - Yokota September 22, 2
2015-09-22
Conveyor apparatus
Grant 9,114,936 - Yokota August 25, 2
2015-08-25
Heat Processing Device
App 20140367451 - Yokota; Yatsuharu
2014-12-18
Conveyor Apparatus
App 20140231224 - Yokota; Yatsuharu
2014-08-21
Conveyor
App 20140231223 - Yokota; Yatsuharu
2014-08-21
Reflow Soldering Apparatus and Method
App 20130263445 - Yokota; Yatsuharu
2013-10-10
Reflow soldering apparatus
Grant 7,690,550 - Yokota April 6, 2
2010-04-06
Device for heating printed-circuit board
Grant 6,423,945 - Yokota July 23, 2
2002-07-23
Reflow soldering apparatus
App 20020020695 - Yokota, Yatsuharu
2002-02-21
Automatic reflow soldering apparatus
Grant 5,922,230 - Yokota July 13, 1
1999-07-13
Reflow soldering method and the apparatus thereof
Grant 5,141,147 - Yokota August 25, 1
1992-08-25
Reflow soldering method and the apparatus thereof
Grant 4,909,430 - Yokota March 20, 1
1990-03-20

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