Yokota; Reona
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yokota; Reona.The latest application filed is for "insulating resin material and multilayer substrate".
- Yokota; Reona - Ibaraki JP
- Yokota; Reona - Tsukuba N/A JP
- Yokota; Reona - Tsukuba-shi JP
- Yokota; Reona - Tsukuba city JP
| Patent | Date |
|---|---|
| Insulating resin material and multilayer substrate Grant 9,382,445 - Hayashi , et al. July 5, 2 | 2016-07-05 |
| Preliminary-cured material, roughened preliminary-cured material, and laminated body Grant 9,120,293 - Yokota , et al. September 1, 2 | 2015-09-01 |
| Insulating Resin Material And Multilayer Substrate App 20150210884 - Hayashi; Tatsushi ; et al. | 2015-07-30 |
| Preliminary-cured Material, Roughened Preliminary-cured Material, And Laminated Body App 20130108861 - Yokota; Reona ; et al. | 2013-05-02 |
| Laminated Body And Method For Producing Laminated Body App 20110217512 - Heishi; Masaru ; et al. | 2011-09-08 |
| Resin Composition And Multilayer Resin Film Employing The Same App 20110003914 - Yokota; Reona ; et al. | 2011-01-06 |
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