YOKOTA; Hideki
Patent Applications and Registrations
Patent applications and USPTO patent grants for YOKOTA; Hideki.The latest application filed is for "semiconductor module".
- YOKOTA; Hideki - Tokyo JP
- Yokota; Hideki - Takasaki N/A JP
- Yokota; Hideki - Takasaki-shi JP
| Patent | Date |
|---|---|
| Semiconductor Module App 20200006238 - YOKOTA; Hideki ; et al. | 2020-01-02 |
| Camera module Grant 9,818,780 - Miyazaki , et al. November 14, 2 | 2017-11-14 |
| Method of manufacturing substrate having cavity Grant 9,301,407 - Miyazaki , et al. March 29, 2 | 2016-03-29 |
| Camera module Grant 9,253,386 - Miyazaki , et al. February 2, 2 | 2016-02-02 |
| Printed wiring board and method for manufacturing same Grant 8,963,016 - Yokota , et al. February 24, 2 | 2015-02-24 |
| Method Of Manufacturing Substrate Having Cavity App 20150010694 - MIYAZAKI; Masashi ; et al. | 2015-01-08 |
| Camera Module App 20140253794 - MIYAZAKI; Masashi ; et al. | 2014-09-11 |
| Camera Module App 20140252522 - MIYAZAKI; Masashi ; et al. | 2014-09-11 |
| Electronic component to be embedded in substrate and component-embedded substrate Grant 8,791,783 - Miyazaki , et al. July 29, 2 | 2014-07-29 |
| Electronic Component To Be Embedded In Substrate And Component-embedded Substrate App 20130200977 - Miyazaki; Masashi ; et al. | 2013-08-08 |
| Printed Wiring Board And Method For Manufacturing Same App 20110203836 - Yokota; Hideki ; et al. | 2011-08-25 |
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