| Patent | Date |
|---|
Copper clad laminate, multilayer printed circuit board and their processing method
Grant 5,569,545 - Yokono , et al. October 29, 1 | 1996-10-29 |
Process for fabricating an interconnected multilayer board
Grant 5,388,328 - Yokono , et al. February 14, 1 | 1995-02-14 |
Interconnected multilayer boards and fabrication processes thereof
Grant 5,300,735 - Yokono , et al. April 5, 1 | 1994-04-05 |
Multilayer wiring substrate and production thereof
Grant 5,208,656 - Matsuyama , et al. May 4, 1 | 1993-05-04 |
Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate
Grant 5,162,240 - Saitou , et al. November 10, 1 | 1992-11-10 |
Cooling arrangement for semiconductor devices and method of making the same
Grant 5,133,403 - Yokono , et al. July 28, 1 | 1992-07-28 |
Method for forming conductor layers and method for fabricating multilayer substrates
Grant 4,963,512 - Iwanaga , et al. October 16, 1 | 1990-10-16 |
Electronic device plated with gold by means of an electroless gold plating solution
Grant 4,963,974 - Ushio , et al. October 16, 1 | 1990-10-16 |
Apparatus for testing semiconductor device
Grant 4,931,726 - Kasukabe , et al. June 5, 1 | 1990-06-05 |
Connector and semiconductor device packages employing the same
Grant 4,908,696 - Ishihara , et al. March 13, 1 | 1990-03-13 |
Method for assembling flat type plastic multifiber connectors
Grant 4,753,515 - Sato , et al. June 28, 1 | 1988-06-28 |
Optical switch
Grant 4,715,673 - Noro , et al. December 29, 1 | 1987-12-29 |
Process for producing solar cells
Grant 4,643,913 - Okunaka , et al. February 17, 1 | 1987-02-17 |
Flexible photosensitive polymer composition with azide and/or amine compound, poly(amic acid) and highly polar compound with boiling point above 150.degree. C.
Grant 4,587,197 - Kojima , et al. May 6, 1 | 1986-05-06 |
Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound
Grant 4,565,767 - Kataoka , et al. January 21, 1 | 1986-01-21 |
Photo and radiation-sensitive organopolymeric material
Grant 4,544,729 - Nate , et al. October 1, 1 | 1985-10-01 |
Heat-resistant silicone block polymer
Grant 4,513,132 - Shoji , et al. April 23, 1 | 1985-04-23 |
Positive type, radiation-sensitive organic polymer materials
Grant 4,504,646 - Nate , et al. March 12, 1 | 1985-03-12 |
Process for forming thin film
Grant 4,495,218 - Azuma , et al. January 22, 1 | 1985-01-22 |
Electrode material for semi-conductor devices
Grant 4,486,232 - Nakatani , et al. December 4, 1 | 1984-12-04 |
Optical fiber connector
Grant 4,484,796 - Sato , et al. November 27, 1 | 1984-11-27 |
Radiation-sensitive poly(amic acid) polymer composition
Grant 4,451,551 - Kataoka , et al. May 29, 1 | 1984-05-29 |
Reaction injection molded article with threads and method of molding same
Grant 4,446,185 - Waragai , et al. May 1, 1 | 1984-05-01 |
Process for producing integral skin polyurethane foam
Grant 4,444,704 - Hira , et al. April 24, 1 | 1984-04-24 |
Composition and process for preparing transparent conducting film
Grant 4,420,500 - Nakatani , et al. December 13, 1 | 1983-12-13 |
Apparatus for molding plastic
Grant 4,411,609 - Yoshii , et al. October 25, 1 | 1983-10-25 |
Composition for fire retardant urethane foam
Grant 4,409,341 - Hira , et al. October 11, 1 | 1983-10-11 |
Uninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler composition
Grant 4,387,311 - Kobayashi , et al. June 7, 1 | 1983-06-07 |
Process for producing transparent electroconductive film
Grant 4,369,208 - Okunaka , et al. January 18, 1 | 1983-01-18 |
Process for forming metallic image
Grant 4,347,304 - Sakurai , et al. August 31, 1 | 1982-08-31 |
Process for producing rigid polyurethane foam
Grant 4,342,842 - Hira , et al. August 3, 1 | 1982-08-03 |
Process for regenerating chemical copper plating solution
Grant 4,324,629 - Oka , et al. April 13, 1 | 1982-04-13 |
Photosensitive compositions containing polyamides acid with photosensitive groups
Grant 4,321,319 - Shoji , et al. March 23, 1 | 1982-03-23 |
Method for automatically controlling composition of chemical copper plating solution
Grant 4,310,563 - Oka , et al. January 12, 1 | 1982-01-12 |
Composition and process for producing transparent conductive film
Grant 4,303,554 - Sudo , et al. December 1, 1 | 1981-12-01 |
Electroless copper plating solution
Grant 4,303,443 - Miyazawa , et al. December 1, 1 | 1981-12-01 |
Liquid crystal display device
Grant 4,273,420 - Watanabe , et al. June 16, 1 | 1981-06-16 |
Resin compositions containing polyepoxides and uretdiones
Grant 4,138,372 - Nishikawa , et al. February 6, 1 | 1979-02-06 |
Dynamoelectric machine having coil windings and core encapsulated with resin-filler composition
Grant 4,128,527 - Kinjo , et al. December 5, 1 | 1978-12-05 |
Novel thermosetting resin and a process for producing same
Grant 4,070,416 - Narahara , et al. January 24, 1 | 1978-01-24 |
Thermosetting resin compositions prepared from isocyanates and epoxyphenols
Grant 3,984,376 - Yokono , et al. October 5, 1 | 1976-10-05 |
Epoxy resin composition having excellent latent hardening characteristics
Grant 3,963,796 - Yokono , et al. June 15, 1 | 1976-06-15 |
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